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1. 发明授权

US06536964B1 Substrate processing system and substrate processing method 失效
标题翻译：基板加工系统和基板加工方法
公开(公告)号：US06536964B1
公开(公告)日：2003-03-25
申请号：US09652141
申请日：2000-08-31
申请人： Takahiro Kitano , Masami Akimoto , Takafumi Toshimitsu
发明人： Takahiro Kitano , Masami Akimoto , Takafumi Toshimitsu
IPC分类号： G03D504
CPC分类号： H01L21/67253 , G03F7/162 , G03F7/3021 , G03F7/3028
摘要： In an FAB having a plurality of coating and developing processing apparatus, atmospheric pressure is measured by a barometer provided in the FAB, and a measured value is sent to each of the coating and developing processing apparatus via a host computer. In each coating and developing processing apparatus, based on the value, the rotation speed of a substrate in a resist solution coating unit is regulated only when the atmospheric pressure value exceeds a predetermined allowable value which is preset according to the type of chemical. As a result, without causing the complication of the apparatus, plant and equipment investment can be held to minimum, and the coating film thickness of a substrate can be maintained at a predetermined thickness.
摘要翻译：在具有多个涂布显影处理装置的FAB中，通过设置在FAB中的气压计来测量大气压，经由主计算机将测定值发送给各涂装显影处理装置。在每个涂覆和显影处理装置中，基于该值，只有当大气压力值超过根据化学品类型预设的预定容许值时，才调节抗蚀剂溶液涂布单元中的基底的旋转速度。结果，不会导致装置的复杂化，可以将植物和设备投资保持最小，并且可以将基板的涂膜厚度保持在预定厚度。

2. 发明授权

US07766566B2 Developing treatment apparatus and developing treatment method 有权
标题翻译：开发治疗仪器和开发治疗方法
公开(公告)号：US07766566B2
公开(公告)日：2010-08-03
申请号：US11495732
申请日：2006-07-31
申请人： Takahiro Kitano , Masami Akimoto , Shuuichi Nishikido , Dai Kumagai
发明人： Takahiro Kitano , Masami Akimoto , Shuuichi Nishikido , Dai Kumagai
IPC分类号： G03D5/04
CPC分类号： G03D5/04 , G03F7/30 , G03F7/3021 , H01L21/6715 , H01L21/67748 , Y10S134/902
摘要： In the present invention, a substrate transfer unit into/from which a substrate is transferred from/to the outside of a treatment container and a developing treatment unit in which development of the substrate is performed are arranged side by side in the treatment container, and a carrier mechanism is provided which carries the substrate while grasping an outside surface of the substrate from both sides, between the substrate transfer unit and the developing treatment unit. A developing solution supply nozzle for supplying a developing solution onto the substrate and a gas blow nozzle for blowing a gas to the substrate, are provided between the substrate transfer unit and the developing treatment unit and above a carriage path along which the substrate is carried, and a cleaning solution supply nozzle is provided in the developing treatment unit for supplying a cleaning solution onto the substrate. According to the present invention, since the substrate is carried with its outside surface being grasped, spread of contamination can be prevented to restrain generation of particles in the treatment container.
摘要翻译：在本发明中，在处理容器中并排设置有将基板从处理容器的外部转移到基板转移单元和进行基板的显影的显影处理单元，并且提供了一种承载机构，其承载基板，同时从基板转印单元和显影处理单元之间的两侧抓住基板的外表面。用于将显影液供给到基板上的显影液供给喷嘴和用于将气体吹送到基板的气体吹出喷嘴设置在基板转印单元和显影处理单元之间以及载置基板的滑架路径上方，并且在显影处理单元中设置清洁液供给喷嘴，用于将清洗液供给到基板上。根据本发明，由于基板的外表面被抓住，因此可以防止污染物的扩散，从而抑制处理容器中的颗粒的产生。

3. 发明授权

US06371667B1 Film forming method and film forming apparatus 有权
标题翻译：成膜方法和成膜装置
公开(公告)号：US06371667B1
公开(公告)日：2002-04-16
申请号：US09545003
申请日：2000-04-06
申请人： Takahiro Kitano , Masami Akimoto , Tomohide Minami , Masateru Morikawa
发明人： Takahiro Kitano , Masami Akimoto , Tomohide Minami , Masateru Morikawa
IPC分类号： G03D500
CPC分类号： G03D5/00
摘要： A resist solution discharge nozzle for discharging a resist solution to a wafer is moved at a constant speed along a radial direction of the wafer while the wafer is being rotated. During this movement, the amount of the resist solution to be discharged from the resist solution discharge nozzle is gradually decreased. The resist solution discharged to the wafer is applied to the front surface of the wafer drawing a spiral track, and coating amounts of the resist solution per unit area with respect to a central portion and a peripheral portion of the wafer can be made equal. Accordingly, waste of a processing solution supplied onto a substrate can be eliminated, and a uniform processing solution film can be formed on the substrate.
摘要翻译：用于将抗蚀剂溶液放电到晶片的抗蚀剂溶液排出喷嘴在晶片旋转的同时沿着晶片的径向以恒定的速度移动。在该运动中，从抗蚀剂溶液排出喷嘴排出的抗蚀剂溶液的量逐渐降低。将排出到晶片的抗蚀剂溶液施加到晶片的前表面，从而绘制螺旋轨道，并且可以使相对于晶片的中心部分和周边部分的每单位面积的抗蚀剂溶液的涂布量相等。因此，能够消除供给到基板上的处理液的浪费，能够在基板上形成均匀的处理液膜。

4. 发明授权

US06936107B2 Coating film forming apparatus and coating unit 失效
标题翻译：涂膜成膜装置和涂装单元
公开(公告)号：US06936107B2
公开(公告)日：2005-08-30
申请号：US10728768
申请日：2003-12-08
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： H01L21/027 , G03F7/16 , H01L21/00 , B05C11/10
CPC分类号： H01L21/6715 , G03F7/162 , Y10S134/902
摘要： A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.
摘要翻译：一种涂膜形成装置，用于通过将涂布溶液涂布到基底上来形成膜，该基材设置有盒部，涂布单元，显影单元，预处理/后处理单元和用于在基板之间转移基板的主臂各单位。在涂布单元中，设置了通过在Y方向间歇地移动基板并且沿X方向移动喷嘴，以单行程的方式将抗蚀剂施加在基板上的涂布部分，并且设置为减压干燥部分，用于在施加后在减压下干燥基板，并且还提供了用于去除附着到基板周边的涂膜的设备。此外，当将减压干燥部配置在涂布单元的外侧时，主臂被盖覆盖，使其内部处于溶剂气氛下。

5. 发明授权

US06676757B2 Coating film forming apparatus and coating unit 有权
标题翻译：涂膜成膜装置和涂装单元
公开(公告)号：US06676757B2
公开(公告)日：2004-01-13
申请号：US09734877
申请日：2000-12-13
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： B05C1110
CPC分类号： H01L21/6715 , G03F7/162 , Y10S134/902
摘要： A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.
摘要翻译：一种涂膜形成装置，用于通过将涂布溶液涂布到基底上来形成膜，该基材设置有盒部，涂布单元，显影单元，预处理/后处理单元和用于在基板之间转移基板的主臂各单位。在涂布单元中，设置了通过在Y方向间歇地移动基板并且沿X方向移动喷嘴，以单行程的方式将抗蚀剂施加在基板上的涂布部分，并且设置为减压干燥部分，用于在施加后在减压下干燥基板，并且还提供了用于去除附着到基板周边的涂膜的设备。此外，当将减压干燥部配置在涂布单元的外侧时，主臂被盖覆盖，使其内部处于溶剂气氛下。

6. 发明授权

US06627263B2 Film forming apparatus and film forming method 失效
公开(公告)号：US06627263B2
公开(公告)日：2003-09-30
申请号：US10154111
申请日：2002-05-21
申请人： Takahiro Kitano , Masateru Morikawa , Masami Akimoto , Kazuhiro Takeshita
发明人： Takahiro Kitano , Masateru Morikawa , Masami Akimoto , Kazuhiro Takeshita
IPC分类号： B05D312
CPC分类号： H01L21/6715 , B05C5/0216 , B05C11/08 , G03F7/162
摘要： A film forming apparatus comprising a substrate holding section for holding a substrate to be processed, a nozzle unit arranged and opposing the substrate holding section, having a discharge hole for continuously applying film-forming solution, in the form of a slender stream, to a surface of a substrate held by the substrate holding section, and a drive mechanism for driving the substrate and the nozzle unit relative to each other, thereby to coat the surface of the substrate with the solution, while the nozzle unit is applying the solution, in the form of a slender stream, to the surface of the substrate.

7. 发明申请

US20070031145A1 Developing treatment apparatus and developing treatment method 有权
标题翻译：开发治疗仪器和开发治疗方法
公开(公告)号：US20070031145A1
公开(公告)日：2007-02-08
申请号：US11495732
申请日：2006-07-31
申请人： Takahiro Kitano , Masami Akimoto , Shuuichi Nishikido , Dai Kumagai
发明人： Takahiro Kitano , Masami Akimoto , Shuuichi Nishikido , Dai Kumagai
IPC分类号： G03D5/00
CPC分类号： G03D5/04 , G03F7/30 , G03F7/3021 , H01L21/6715 , H01L21/67748 , Y10S134/902
摘要： In the present invention, a substrate transfer unit into/from which a substrate is transferred from/to the outside of a treatment container and a developing treatment unit in which development of the substrate is performed are arranged side by side in the treatment container, and a carrier mechanism is provided which carries the substrate while grasping an outside surface of the substrate from both sides, between the substrate transfer unit and the developing treatment unit. A developing solution supply nozzle for supplying a developing solution onto the substrate and a gas blow nozzle for blowing a gas to the substrate, are provided between the substrate transfer unit and the developing treatment unit and above a carriage path along which the substrate is carried, and a cleaning solution supply nozzle is provided in the developing treatment unit for supplying a cleaning solution onto the substrate. According to the present invention, since the substrate is carried with its outside surface being grasped, spread of contamination can be prevented to restrain generation of particles in the treatment container.
摘要翻译：在本发明中，在处理容器中并排设置有将基板从处理容器的外部转移到基板转移单元和进行基板的显影的显影处理单元，并且提供了一种承载机构，其承载基板，同时从基板转印单元和显影处理单元之间的两侧抓住基板的外表面。用于将显影液供给到基板上的显影液供给喷嘴和用于将气体吹送到基板的气体吹出喷嘴设置在基板转印单元和显影处理单元之间以及载置基板的滑架路径上方，并且在显影处理单元中设置清洁液供给喷嘴，用于将清洗液供给到基板上。根据本发明，由于基板的外表面被抓住，因此可以防止污染物的扩散，从而抑制处理容器中的颗粒的产生。

8. 发明授权

US07087118B2 Coating film forming apparatus and coating unit 失效
标题翻译：涂膜成膜装置和涂装单元
公开(公告)号：US07087118B2
公开(公告)日：2006-08-08
申请号：US11080756
申请日：2005-03-16
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： B05C11/10 , B05B12/12
CPC分类号： H01L21/6715 , G03F7/162 , Y10S134/902
摘要： A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.
摘要翻译：一种涂膜形成装置，用于通过将涂布溶液涂布到基底上来形成膜，该基材设置有盒部，涂布单元，显影单元，预处理/后处理单元和用于在基板之间转移基板的主臂各单位。在涂布单元中，设置了通过在Y方向间歇地移动基板并且沿X方向移动喷嘴，以单行程的方式将抗蚀剂施加在基板上的涂布部分，并且设置为减压干燥部分，用于在施加后在减压下干燥基板，并且还提供了用于去除附着到基板周边的涂膜的设备。此外，当将减压干燥部配置在涂布单元的外侧时，主臂被盖覆盖，使其内部处于溶剂气氛下。

9. 发明授权

US06605153B2 Coating film forming apparatus 失效
标题翻译：涂膜成膜装置
公开(公告)号：US06605153B2
公开(公告)日：2003-08-12
申请号：US09735657
申请日：2000-12-14
申请人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
发明人： Takahiro Kitano , Masateru Morikawa , Yukihiko Esaki , Nobukazu Ishizaka , Norihisa Koga , Kazuhiro Takeshita , Hirofumi Ookuma , Masami Akimoto
IPC分类号： B05C1110
CPC分类号： H01L21/6715 , B05B12/20 , B05B13/041 , B05C5/0212 , B05C5/0216 , B05C5/0291 , B05C11/1039
摘要： An apparatus includes a holding portion for holding a substrate, a nozzle, provided to face the substrate held by the holding portion, for discharging a solution to the substrate, a driver for moving the nozzle along a surface of the substrate relatively with respect to the substrate while the solution is being discharged to the surface of the substrate from the nozzle, a mask unit covering a portion other than a film formation area of the substrate and including a mask member for catching the solution from the nozzle, and a cleaner provided in the mask unit. The coating solution can be supplied to the surface of the substrate in a way similar to a picture drawn with a single stroke of a brush. A cleaning unit for cleaning the mask member does not need to be provided separately, leading to the facilitation of cleaning and a reduction in space.
摘要翻译：一种装置，包括用于保持基板的保持部分，设置成面对由保持部分保持的基板的喷嘴，用于将溶液排出到基板;驱动器，用于相对于所述基板沿着基板的表面移动喷嘴基板，同时溶液从喷嘴排出到基板的表面;掩模单元，覆盖除了基板的成膜区域以外的部分，并且包括用于从喷嘴捕获溶液的掩模构件，以及设置在该基板中的清洁器面具单元。涂布溶液可以以类似于用笔刷的单次笔画绘制的图像的方式供应到基底的表面。用于清洁面罩构件的清洁单元不需要单独提供，从而促进清洁和减少空间。

10. 发明授权

US07797855B2 Heating apparatus, and coating and developing apparatus 有权
标题翻译：加热装置和涂装显影装置
公开(公告)号：US07797855B2
公开(公告)日：2010-09-21
申请号：US11505810
申请日：2006-08-18
申请人： Tetsuo Fukuoka , Masami Akimoto , Takahiro Kitano , Yoshio Kimura , Shinichi Hayashi , Hikaru Ito
发明人： Tetsuo Fukuoka , Masami Akimoto , Takahiro Kitano , Yoshio Kimura , Shinichi Hayashi , Hikaru Ito
IPC分类号： F26B21/06
CPC分类号： C30B33/02 , C30B35/00 , H01L21/67098 , H01L21/67748
摘要： A heating apparatus 2 comprises a housing 20; a flat heating chamber 4 which is provided in the housing 2 and adapted to heat a wafer W used as a substrate, with one side of the heating chamber 4 opening for carrying in and carrying out the wafer; and a heating plates 44, 45 provided in the heating chamber 4 such that the wafer W can be heated from both above and below. A cooling plate 3 is provided in the housing 20 located in the vicinity of the opening of the heating chamber 4, for cooling the wafer W after being heated by the heating plates 44, 45. Additionally, a carrying means is provided in the housing 20 for carrying the wafer W between an upper position of the cooling plate 3 and the interior of the heating chamber 4 such that a heat treatment for the wafer W can be performed with the wafer W being held in the heating chamber 4.
摘要翻译：加热装置2包括壳体20; 平面加热室4，其设置在壳体2中并且适于加热用作基板的晶片W，加热室4的一侧开口用于承载和执行晶片; 以及设置在加热室4中的加热板44,45，使得晶片W能够从上下两者加热。冷却板3设置在位于加热室4的开口附近的壳体20中，用于在被加热板44,45加热之后冷却晶片W.此外，在壳体20中设置有承载装置用于在冷却板3的上部位置和加热室4的内部之间承载晶片W，使得可以在将晶片W保持在加热室4中的情况下进行晶片W的热处理。

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