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    • 4. 发明授权
    • Solar cell and manufacturing method thereof
    • 太阳能电池及其制造方法
    • US08450602B2
    • 2013-05-28
    • US13023910
    • 2011-02-09
    • Shoichi KarakidaTakahiko NishidaMitsunori NakataniHiroaki Morikawa
    • Shoichi KarakidaTakahiko NishidaMitsunori NakataniHiroaki Morikawa
    • H01L31/00H02N6/00
    • H01L31/022425Y02E10/50
    • A solar cell comprises a substrate that includes a photoelectric conversion function, a first electrode provided on one surface of the substrate, a second electrode provided on other surface of the substrate, and a third electrode provided on the other surface of the substrate with its periphery overlapping the second electrode in the in-plane direction of the substrate for extracting an electric power from the second electrode. The thickness of the second electrode is larger than that of the third electrode, and the difference between the thickness of the second electrode and that of the third electrode is within a range from equal to or more than 10 micrometers to equal to or less than 30 micrometers. Thereby, in the solar cell, an electrode separation (alloy separation) can be effectively prevented.
    • 一种太阳能电池包括:包含光电转换功能的基板,设置在基板的一个表面上的第一电极,设置在该基板的另一个表面上的第二电极;以及设置在基板的另一个表面上的第三电极, 在所述基板的面内方向上重叠所述第二电极,以从所述第二电极提取电力。 第二电极的厚度大于第三电极的厚度,并且第二电极的厚度与第三电极的厚度之间的差在等于或大于10微米至等于或小于30的范围内 微米。 因此,在太阳能电池中,能够有效地防止电极分离(合金分离)。
    • 10. 发明授权
    • Method of manufacturing field effect transistors
    • 制造场效应晶体管的方法
    • US5112766A
    • 1992-05-12
    • US730626
    • 1991-07-16
    • Takayuki FujiiMitsunori Nakatani
    • Takayuki FujiiMitsunori Nakatani
    • H01L21/22H01L21/338H01L29/10H01L29/417H01L29/423H01L29/812
    • H01L29/66878H01L29/1075H01L29/42316
    • A method of producing a field effect transistor includes forming a first conductivity type active layer having a first concentration of dopant impurities producing the first conductivity type in a semi-insulating semiconductor substrate, forming a mask film on the substrate on part of the first conductivity type region, depositing a gate metal film on the mask film and on the substrate not covered by the mask film, etching the gate metal film and leaving a portion of the gate metal film on the substrate adjacent to and contacting the mask film as a gate electrode, implanting dopant impurities producing a second conductivity type in the substrate using the mask film and the gate electrode as an implantation mask, annealing the substrate at an elevated temperature to activate the implanted dopant impurities whereby some of the implanted dopant impurities diffuse laterally within the substrate to produce a second conductivity type region in the substrate underneath part of the gate electrode, removing the mask film, implanting dopant impurities producing the first conductivity type in the substrate using the gate electrode as an ion implantation mask to produce first and second doped regions in the substrate on opposite sides of the gate electrode and having a second concentration of dopant impurities larger than the first concentration, the second doped region being disposed within the second conductivity type region that extends underneath part of the gate electrode, and forming a source electrode on the first doped region and a drain electrode on the second doped region.