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    • 5. 发明授权
    • Dielectric capacitor manufacturing method and semiconductor storage device manufacturing method
    • 电介质电容器制造方法和半导体存储器件的制造方法
    • US06544857B1
    • 2003-04-08
    • US09262329
    • 1999-03-04
    • Katsuyuki HironakaMasataka SugiyamaChiharu IsobeTakaaki Ami
    • Katsuyuki HironakaMasataka SugiyamaChiharu IsobeTakaaki Ami
    • H01L2120
    • H01L28/55H01L21/02197H01L21/02271H01L21/31122H01L21/32136H01L28/75
    • In a process for manufacturing a dielectric capacitor, an IrO2 film, an Ir film, an amorphous film, and a Pt film-are sequentially made on a Si substrate. The SBT film may comprise BixSryTa2.0Oz, where the atomic composition ratio maybe within the range of 0≦Sr/Ti≦1.0, 0≦Ba/Ti≦1.0. The Pt film, the amorphous film, the Ir film, and the IrO2 film formed into a dielectric capacitor and the amorphous film is annealed to change its amorphous phase to a crystal phase of a perovskite type crystalline structure and thereby obtain the SBT film. The process may include a lower electrode made from an organic metal source material selected from a group consisting of Bi(C6H5)3, Bi(o-C7H7)3, Bi(O-C2H5)3, Bi(O-iC3H7)3, Bi(O- tC4H9)3, Bi(O-tC5H11)3, Sr(THD)2, Sr(THD)2 tetraglyme, Sr(Me5C5)2·2THF, Ti(i-OC3H7)4, TiO(THD)2, Ti(THD)2(i-OC3H7)2, Ta(i-OC3H7)5, Ta(iOC3H7)4THD, Nb(i-OC3H7)5, Nb(i- OC3H7)4THD.
    • 在介质电容器的制造方法中,依次在Si衬底上制造IrO2膜,Ir膜,非晶膜和Pt膜。 SBT膜可以包含BixSryTa2.0Oz,其中原子组成比可以在0 <= Sr / Ti <=1.0,0≤Ba/Ti≤1.0的范围内。 将形成为介电电容器的Pt膜,非晶膜,Ir膜和IrO 2膜与非晶膜退火,将其非晶相变为钙钛矿型结晶结构的结晶相,由此得到SBT膜。 该方法可以包括由选自Bi(C 6 H 5)3,Bi(o-C 7 H 7)3,Bi(O-C 2 H 5)3,Bi(O-C 3 H 7)3, Bi(O-tC4H9)3,Bi(O-tC5H11)3,Sr(THD)2,Sr(THD)2四聚体,Sr(Me5C5)2.2THF,Ti(i-OC3H7)4,TiO(THD) Ti(I-OC3H7)2,(i-OC3H7)2,Ta(i-OC3H7)5,Ta(iOC3H7)4THD,Nb(i-OC3H7)5,Nb(i-OC3H7)4THD。