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    • 3. 发明授权
    • Mixed voltage interface converter
    • 混合电压接口转换器
    • US5663663A
    • 1997-09-02
    • US638028
    • 1996-04-26
    • Tai CaoSatyajit DuttaThai Quoc NguyenThanh Doan TrinhLloyd Andre Walls
    • Tai CaoSatyajit DuttaThai Quoc NguyenThanh Doan TrinhLloyd Andre Walls
    • H03K19/00H03K19/0175H03K19/018H03K19/0185H03K19/0948
    • H03K19/018521H03K19/018514
    • The present invention facilitates communication of signals from circuitry implemented with a first CMOS technology requiring a first voltage level supply for operation to circuitry implemented with a second CMOS technology requiring a second voltage level supply for operation, wherein the first and second voltage level supplies are not equal. The present invention receives from the circuitry implemented with a first CMOS technology a signal which has a first voltage level that is not acceptable for input into the circuitry implemented with a second CMOS technology. This signal is converted to a second voltage level that is acceptable for input into the circuitry implemented with a second CMOS technology, and then transmitted to the circuitry implemented with a second CMOS technology requiring a second voltage level supply for operation.
    • 本发明有助于来自使用第一CMOS技术实现的信号的信号的通信,该第一CMOS技术需要用于操作的第一电压电平供给用第二CMOS技术实现的电路,该第二CMOS技术需要用于操作的第二电压电平供应,其中第一和第二电压电平供应不是 等于。 本发明从由第一CMOS技术实现的电路接收具有第一电压电平的信号,该第一电压电平对于用第二CMOS技术实现的电路的输入是不可接受的。 该信号被转换为对于用第二CMOS技术实现的电路的输入可接受的第二电压电平,然后被传送到用第二CMOS技术实现的电路,该第二CMOS技术需要用于操作的第二电压电平。
    • 7. 发明授权
    • Multi-layered thermal sensor for integrated circuits and other layered structures
    • 用于集成电路和其他分层结构的多层热传感器
    • US07510323B2
    • 2009-03-31
    • US11375474
    • 2006-03-14
    • Aquilur RahmanLloyd Andre Walls
    • Aquilur RahmanLloyd Andre Walls
    • G01K7/16H01L23/48
    • G01K7/16G01K1/14
    • A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC.This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, a conductive element extending between first and second layers for connecting said first and second conductive paths into a single continuous conductive path having a resistance that varies with temperature.The sensor is responsive to electric current sent through said continuous path for determining temperature proximate to said continuous path from said path resistance.
    • 为集成电路(IC)提供了紧凑的电阻式热传感器,其中不同的传感器部件被放置在IC的不同层上。 这允许选择性地减少任何特定IC层上的传感器电阻线所需的横向面积。 在有用的实施例中,导电元件在第一和第二层之间延伸,用于将所述第一和第二导电路径连接成具有随温度变化的电阻的单个连续导电路径。 传感器响应于通过所述连续路径发送的电流,用于从所述路径电阻确定接近所述连续路径的温度。
    • 8. 发明授权
    • Multi-layered thermal sensor for integrated circuits and other layered structures
    • 用于集成电路和其他分层结构的多层热传感器
    • US07946763B2
    • 2011-05-24
    • US12363353
    • 2009-01-30
    • Aquilur RahmanLloyd Andre Walls
    • Aquilur RahmanLloyd Andre Walls
    • G01K7/16H01L23/48
    • G01K7/16G01K1/14
    • A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, a plurality of first linear conductive members are positioned in a first IC layer, in spaced-apart parallel relationship with one another. A plurality of second linear conductive members are similarly positioned in a second IC layer in spaced-apart parallel relationship with one another, and in orthogonal relationship with the first linear members or in parallel with existing wiring channels of the second IC layer. Conductive elements respectively connect the first linear members into a first conductive path, and the second linear members into a second conductive path. A third conductive element extending between the first and second layers connects the first and second conductive paths into a single continuous conductive path, wherein the path has a resistance that varies with temperature. A device responsive to an electric current sent through the continuous path determines temperature of the path from the path resistance. Two or more of the thermal sensors could be connected in series, for use in measuring critical IC circuits.
    • 为集成电路(IC)提供了紧凑的电阻式热传感器,其中不同的传感器部件被放置在IC的不同层上。 这允许选择性地减少任何特定IC层上的传感器电阻线所需的横向面积。 在有用的实施例中,多个第一线性导电构件以彼此间隔开的平行关系定位在第一IC层中。 多个第二直线导电构件类似地位于彼此间隔开的平行关系的第二IC层中,并且与第一线性构件正交关系或与第二IC层的现有布线通道并联。 导电元件分别将第一线性部件连接到第一导电路径中,并且将第二线性部件分别连接到第二导电路径中。 在第一和第二层之间延伸的第三导电元件将第一和第二导电路径连接成单个连续导电路径,其中路径具有随温度变化的电阻。 响应于通过连续路径发送的电流的装置从路径电阻确定路径的温度。 两个或多个热传感器可以串联连接,用于测量关键IC电路。
    • 9. 发明授权
    • Method for facilitating simultaneous multi-directional transmission of multiple signals between multiple circuits using a single transmission line
    • 用于促进使用单个传输线在多个电路之间同时多方向传输多个信号的方法
    • US06771675B1
    • 2004-08-03
    • US09640770
    • 2000-08-17
    • Tai Anh CaoLloyd Andre Walls
    • Tai Anh CaoLloyd Andre Walls
    • H04J302
    • H04L5/04
    • Digital signals from a group of three or more circuits (104, 105, 106) are used to create an encoded or combined signal on a common transmission line (108). The encoded signal is then decoded at each different circuit to produce or recreate the digital signal asserted by each different circuit in the group. The encoded signal comprises a signal included in a set of unique signal values, with each signal in the set corresponding to a different combination of digital signals asserted by the group of circuits. Decoding the encoded signal at each circuit (104, 105, 106) in the group involves comparing the encoded signal to a particular reference voltage from a set of reference voltages. A particular reference voltage used in this comparison may be selected using one or more digital signals already decoded from the encoded signal.
    • 来自一组三个或更多个电路(104,105,106)的数字信号用于在公共传输线(108)上创建编码或组合的信号。 然后在每个不同的电路处解码编码的信号以产生或重建由组中的每个不同电路断言的数字信号。 编码信号包括包含在一组唯一信号值中的信号,集合中的每个信号对应于该组电路断言的数字信号的不同组合。 在组中的每个电路(104,105,106)处对编码信号进行解码包括将编码信号与来自一组参考电压的特定参考电压进行比较。 可以使用已经从编码信号解码的一个或多个数字信号来选择在该比较中使用的特定参考电压。
    • 10. 发明授权
    • Controllable decoupling capacitor
    • 可控去耦电容
    • US5770969A
    • 1998-06-23
    • US518083
    • 1995-08-22
    • Lloyd Andre WallsByron Lee KrauterStanley Everett Schuster
    • Lloyd Andre WallsByron Lee KrauterStanley Everett Schuster
    • G05F3/24H03K17/16
    • H02H7/16Y10T307/852
    • A decoupling capacitor and protection circuit is provided that will assist the power supply network in stabilizing the voltage near circuits that demand short rapid transitions in electrical current. The protection circuit also significantly reduces the amount of electrical current drawn by defective large area decoupling capacitors. An inverter stage controls a switching circuit connected in series with a decoupling capacitor. A feedback circuit is provided from the output of the capacitor to the switching circuit. If the capacitor goes bad, then a voltage is present on the feedback circuit and the switching circuit ensures that the output of the failed capacitor is presented with an open circuit so that the short circuit current flow through the capacitor is eliminated. In this manner, the integrity of the other circuits located near the failed capacitor will operate appropriately.
    • 提供去耦电容器和保护电路,其将帮助电源网络稳定电路附近的电压,从而要求电流中的快速快速转换。 保护电路还显着减少了由大面积去耦电容器引起的电流量。 逆变器级控制与去耦电容串联连接的开关电路。 从电容器的输出到开关电路提供反馈电路。 如果电容变坏,则反馈电路上存在电压,开关电路确保故障电容器的输出呈开路状态,从而消除短路电流流过电容器。 以这种方式,位于故障电容器附近的其它电路的完整性将适当地运行。