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1. 发明授权

US07095788B1 Circuit for facilitating simultaneous multi-directional transmission of multiple signals between multiple circuits using a single transmission line 失效
标题翻译：用于促进使用单个传输线在多个电路之间同时多方向传输多个信号的电路
公开(公告)号：US07095788B1
公开(公告)日：2006-08-22
申请号：US09640802
申请日：2000-08-17
申请人： Tai Anh Cao , Lloyd Andre Walls
发明人： Tai Anh Cao , Lloyd Andre Walls
IPC分类号： H04B3/00 , H04L25/00
CPC分类号： H03K17/693
摘要： An encoding element (109, 111, 113) and a decoding arrangement (110, 112, 114) is included with each separate circuit (104, 105, 106) in a system (100) of circuits which must communicate digital signals with each other. The encoding devices (109, 111, 113) included with the separate circuits (104, 105, 106) cooperate to produce an encoded signal on a common transmission line or network (108) which interconnects the various circuits. The decoding arrangement (110, 112, 114) associated with each respective circuit receives the encoded signal appearing on the transmission line and decodes the encoded signal to reproduce or recreate the digital data signals transmitted from the other circuits in the system.
摘要翻译：编码元件（109,111,113）和解码装置（110,112,114）包括在必须相互通信数字信号的电路系统（100）中的每个分离电路（104,105,106）。包括在分离电路（104,105,106）中的编码装置（109,111,113）协作以在互连各种电路的公共传输线或网络（108）上产生编码信号。与每个相应电路相关联的解码装置（110,112,114）接收出现在传输线上的编码信号，并对编码信号进行解码，以再现或重建从系统中其他电路发送的数字数据信号。

2. 发明授权

US07510323B2 Multi-layered thermal sensor for integrated circuits and other layered structures 有权
标题翻译：用于集成电路和其他分层结构的多层热传感器
公开(公告)号：US07510323B2
公开(公告)日：2009-03-31
申请号：US11375474
申请日：2006-03-14
申请人： Aquilur Rahman , Lloyd Andre Walls
发明人： Aquilur Rahman , Lloyd Andre Walls
IPC分类号： G01K7/16 , H01L23/48
CPC分类号： G01K7/16 , G01K1/14
摘要： A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC.This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, a conductive element extending between first and second layers for connecting said first and second conductive paths into a single continuous conductive path having a resistance that varies with temperature.The sensor is responsive to electric current sent through said continuous path for determining temperature proximate to said continuous path from said path resistance.
摘要翻译：为集成电路（IC）提供了紧凑的电阻式热传感器，其中不同的传感器部件被放置在IC的不同层上。这允许选择性地减少任何特定IC层上的传感器电阻线所需的横向面积。在有用的实施例中，导电元件在第一和第二层之间延伸，用于将所述第一和第二导电路径连接成具有随温度变化的电阻的单个连续导电路径。传感器响应于通过所述连续路径发送的电流，用于从所述路径电阻确定接近所述连续路径的温度。

3. 发明授权

US5789937A Impedence self-adjusting driver circuit 失效
标题翻译：阻抗自调节驱动电路
公开(公告)号：US5789937A
公开(公告)日：1998-08-04
申请号：US702406
申请日：1996-08-14
申请人： Tai Any Cao , Satyajit Dutta , Thai Quoc Nguyen , Pee-Keong Or , Thanh Doan Trinh , Lloyd Andre Walls
发明人： Tai Any Cao , Satyajit Dutta , Thai Quoc Nguyen , Pee-Keong Or , Thanh Doan Trinh , Lloyd Andre Walls
IPC分类号： G06F3/00 , H01L21/822 , H01L27/04 , H03K19/00 , H03K19/0175 , H04L25/02 , H03K19/0185
CPC分类号： H04L25/0278 , H03K19/0005 , H04L25/028
摘要： A driver circuit including of one or more fingers, or parallel driver circuits, senses for an overshoot or an undershoot condition of the signal transmitted onto a transmission line coupled to the driver circuit and compensates for such an overshoot or an undershoot by temporarily turning off the offending transition portion of the driver circuit, or finger portion. This is accomplished by turning off the transistor applying one of the two supply voltages coupled to the output transmission line. Effectively, the compensation circuitry within the driver circuit more closely matches the output impedance of the driver circuit to the impedance on the driven transmission line.
摘要翻译：包括一个或多个手指或并行驱动器电路的驱动器电路感测到传输到耦合到驱动器电路的传输线上的信号的过冲或下冲状态，并通过暂时关闭该脉冲来补偿这种过冲或下冲驱动器电路的违规过渡部分或手指部分。这是通过关闭施加耦合到输出传输线的两个电源电压中的一个的晶体管来实现的。有效地，驱动电路内的补偿电路更接近匹配驱动电路的输出阻抗与驱动传输线上的阻抗。

4. 发明授权

US07946763B2 Multi-layered thermal sensor for integrated circuits and other layered structures 失效
标题翻译：用于集成电路和其他分层结构的多层热传感器
公开(公告)号：US07946763B2
公开(公告)日：2011-05-24
申请号：US12363353
申请日：2009-01-30
申请人： Aquilur Rahman , Lloyd Andre Walls
发明人： Aquilur Rahman , Lloyd Andre Walls
IPC分类号： G01K7/16 , H01L23/48
CPC分类号： G01K7/16 , G01K1/14
摘要： A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, a plurality of first linear conductive members are positioned in a first IC layer, in spaced-apart parallel relationship with one another. A plurality of second linear conductive members are similarly positioned in a second IC layer in spaced-apart parallel relationship with one another, and in orthogonal relationship with the first linear members or in parallel with existing wiring channels of the second IC layer. Conductive elements respectively connect the first linear members into a first conductive path, and the second linear members into a second conductive path. A third conductive element extending between the first and second layers connects the first and second conductive paths into a single continuous conductive path, wherein the path has a resistance that varies with temperature. A device responsive to an electric current sent through the continuous path determines temperature of the path from the path resistance. Two or more of the thermal sensors could be connected in series, for use in measuring critical IC circuits.
摘要翻译：为集成电路（IC）提供了紧凑的电阻式热传感器，其中不同的传感器部件被放置在IC的不同层上。这允许选择性地减少任何特定IC层上的传感器电阻线所需的横向面积。在有用的实施例中，多个第一线性导电构件以彼此间隔开的平行关系定位在第一IC层中。多个第二直线导电构件类似地位于彼此间隔开的平行关系的第二IC层中，并且与第一线性构件正交关系或与第二IC层的现有布线通道并联。导电元件分别将第一线性部件连接到第一导电路径中，并且将第二线性部件分别连接到第二导电路径中。在第一和第二层之间延伸的第三导电元件将第一和第二导电路径连接成单个连续导电路径，其中路径具有随温度变化的电阻。响应于通过连续路径发送的电流的装置从路径电阻确定路径的温度。两个或多个热传感器可以串联连接，用于测量关键IC电路。

5. 发明授权

US06771675B1 Method for facilitating simultaneous multi-directional transmission of multiple signals between multiple circuits using a single transmission line 有权
标题翻译：用于促进使用单个传输线在多个电路之间同时多方向传输多个信号的方法
公开(公告)号：US06771675B1
公开(公告)日：2004-08-03
申请号：US09640770
申请日：2000-08-17
申请人： Tai Anh Cao , Lloyd Andre Walls
发明人： Tai Anh Cao , Lloyd Andre Walls
IPC分类号： H04J302
CPC分类号： H04L5/04
摘要： Digital signals from a group of three or more circuits (104, 105, 106) are used to create an encoded or combined signal on a common transmission line (108). The encoded signal is then decoded at each different circuit to produce or recreate the digital signal asserted by each different circuit in the group. The encoded signal comprises a signal included in a set of unique signal values, with each signal in the set corresponding to a different combination of digital signals asserted by the group of circuits. Decoding the encoded signal at each circuit (104, 105, 106) in the group involves comparing the encoded signal to a particular reference voltage from a set of reference voltages. A particular reference voltage used in this comparison may be selected using one or more digital signals already decoded from the encoded signal.
摘要翻译：来自一组三个或更多个电路（104,105,106）的数字信号用于在公共传输线（108）上创建编码或组合的信号。然后在每个不同的电路处解码编码的信号以产生或重建由组中的每个不同电路断言的数字信号。编码信号包括包含在一组唯一信号值中的信号，集合中的每个信号对应于该组电路断言的数字信号的不同组合。在组中的每个电路（104,105,106）处对编码信号进行解码包括将编码信号与来自一组参考电压的特定参考电压进行比较。可以使用已经从编码信号解码的一个或多个数字信号来选择在该比较中使用的特定参考电压。

6. 发明授权

US5770969A Controllable decoupling capacitor 失效
标题翻译：可控去耦电容
公开(公告)号：US5770969A
公开(公告)日：1998-06-23
申请号：US518083
申请日：1995-08-22
申请人： Lloyd Andre Walls , Byron Lee Krauter , Stanley Everett Schuster
发明人： Lloyd Andre Walls , Byron Lee Krauter , Stanley Everett Schuster
IPC分类号： G05F3/24 , H03K17/16
CPC分类号： H02H7/16 , Y10T307/852
摘要： A decoupling capacitor and protection circuit is provided that will assist the power supply network in stabilizing the voltage near circuits that demand short rapid transitions in electrical current. The protection circuit also significantly reduces the amount of electrical current drawn by defective large area decoupling capacitors. An inverter stage controls a switching circuit connected in series with a decoupling capacitor. A feedback circuit is provided from the output of the capacitor to the switching circuit. If the capacitor goes bad, then a voltage is present on the feedback circuit and the switching circuit ensures that the output of the failed capacitor is presented with an open circuit so that the short circuit current flow through the capacitor is eliminated. In this manner, the integrity of the other circuits located near the failed capacitor will operate appropriately.
摘要翻译：提供去耦电容器和保护电路，其将帮助电源网络稳定电路附近的电压，从而要求电流中的快速快速转换。保护电路还显着减少了由大面积去耦电容器引起的电流量。逆变器级控制与去耦电容串联连接的开关电路。从电容器的输出到开关电路提供反馈电路。如果电容变坏，则反馈电路上存在电压，开关电路确保故障电容器的输出呈开路状态，从而消除短路电流流过电容器。以这种方式，位于故障电容器附近的其它电路的完整性将适当地运行。

7. 发明授权

US5864584A Circuitry for allowing two drivers to communicate with two receivers using one transmission line 失效
公开(公告)号：US5864584A
公开(公告)日：1999-01-26
申请号：US387518
申请日：1995-02-13
申请人： Tai Cao , Satyajit Dutta , Thai Quoc Nguyen , Thanh Doan Trinh , Lloyd Andre Walls
发明人： Tai Cao , Satyajit Dutta , Thai Quoc Nguyen , Thanh Doan Trinh , Lloyd Andre Walls
IPC分类号： G06F13/40 , H04L5/04 , H04L25/02 , H04J15/00 , H04B14/06 , H04L25/34
CPC分类号： H04L25/0292 , G06F13/4072 , H04L25/028 , H04L5/04
摘要： The present invention allows for the simultaneous transmission of two digital signals from one integrated circuit to another. The two digital signals are encoded utilizing a voltage divider circuit and are then transmitted by one transmission line to the second integrated circuit chip. The second integrated circuit chip decodes the first digital signal and then utilizes this decoded digital signal to further decode the second digital signal.

8. 发明申请

US20110176579A1 MULTI-LAYERED THERMAL SENSOR FOR INTEGRATED CIRCUITS AND OTHER LAYERED STRUCTURES 有权
标题翻译：用于集成电路和其他层状结构的多层热传感器
公开(公告)号：US20110176579A1
公开(公告)日：2011-07-21
申请号：US13077139
申请日：2011-03-31
申请人： Aquilur Rahman , Lloyd Andre Walls
发明人： Aquilur Rahman , Lloyd Andre Walls
IPC分类号： G01K7/16
CPC分类号： G01K7/16 , G01K1/14
摘要： A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, first linear conductive members are positioned in a first IC layer, in parallel relationship with one another. Second linear conductive members are positioned in a second IC layer in parallel relationship with one another. Conductive elements connect the first linear members into a first conductive path, and the second linear members into a second conductive path. A third conductive element extending between the first and second layers connects the first and second conductive paths into a single conductive path, wherein the path resistance varies with temperature. The path resistance is used to determine temperature.
摘要翻译：为集成电路（IC）提供了紧凑的电阻式热传感器，其中不同的传感器部件被放置在IC的不同层上。这允许选择性地减少任何特定IC层上的传感器电阻线所需的横向面积。在有用的实施例中，第一线性导电构件彼此平行地定位在第一IC层中。第二线性导电构件彼此平行地定位在第二IC层中。导电元件将第一线性构件连接到第一导电路径中，并将第二线性构件连接到第二导电路径中。在第一和第二层之间延伸的第三导电元件将第一和第二导电路径连接成单个导电路径，其中路径电阻随温度而变化。路径电阻用于确定温度。

9. 发明申请

US20090135883A1 Multi-Layered Thermal Sensor for Integrated Circuits and Other Layered Structures 失效
标题翻译：用于集成电路和其他分层结构的多层热传感器
公开(公告)号：US20090135883A1
公开(公告)日：2009-05-28
申请号：US12363353
申请日：2009-01-30
申请人： Aquilur Rahman , Lloyd Andre Walls
发明人： Aquilur Rahman , Lloyd Andre Walls
IPC分类号： G01K7/00 , G01K7/16
CPC分类号： G01K7/16 , G01K1/14
摘要： A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, a plurality of first linear conductive members are positioned in a first IC layer, in spaced-apart parallel relationship with one another. A plurality of second linear conductive members are similarly positioned in a second IC layer in spaced-apart parallel relationship with one another, and in orthogonal relationship with the first linear members or in parallel with existing wiring channels of the second IC layer. Conductive elements respectively connect the first linear members into a first conductive path, and the second linear members into a second conductive path. A third conductive element extending between the first and second layers connects the first and second conductive paths into a single continuous conductive path, wherein the path has a resistance that varies with temperature. A device responsive to an electric current sent through the continuous path determines temperature of the path from the path resistance. Two or more of the thermal sensors could be connected in series, for use in measuring critical IC circuits.
摘要翻译：为集成电路（IC）提供了紧凑的电阻式热传感器，其中不同的传感器部件被放置在IC的不同层上。这允许选择性地减少任何特定IC层上的传感器电阻线所需的横向面积。在有用的实施例中，多个第一线性导电构件以彼此间隔开的平行关系定位在第一IC层中。多个第二直线导电构件类似地位于彼此间隔开的平行关系的第二IC层中，并且与第一线性构件正交关系或与第二IC层的现有布线通道并联。导电元件分别将第一线性部件连接到第一导电路径中，并且将第二线性部件分别连接到第二导电路径中。在第一和第二层之间延伸的第三导电元件将第一和第二导电路径连接成单个连续导电路径，其中路径具有随温度变化的电阻。响应于通过连续路径发送的电流的装置从路径电阻确定路径的温度。两个或多个热传感器可以串联连接，用于测量关键IC电路。

10. 发明授权

US06337884B1 Circuitry for allowing two drivers to communicate with two receivers using one transmission line 失效
标题翻译：允许两个驱动器使用一条传输线与两个接收机通信的电路
公开(公告)号：US06337884B1
公开(公告)日：2002-01-08
申请号：US09096502
申请日：1998-06-12
申请人： Tai Cao , Satyajit Dutta , Thai Quoc Nguyen , Thanh Doan Trinh , Lloyd Andre Walls
发明人： Tai Cao , Satyajit Dutta , Thai Quoc Nguyen , Thanh Doan Trinh , Lloyd Andre Walls
IPC分类号： H04B300
CPC分类号： H04L25/0292 , G06F13/4072 , H04L5/04 , H04L25/028
摘要： The present invention allows for the simultaneous transmission of two digital signals from one integrated circuit to another. The two digital signals are encoded utilizing a voltage divider circuit and are then transmitted by one transmission line to the second integrated circuit chip. The second integrated circuit chip decodes the first digital signal and then utilizes this decoded digital signal to further decode the second digital signal.
摘要翻译：本发明允许将两个数字信号从一个集成电路同时传输到另一个集成电路。两个数字信号利用分压电路进行编码，然后由一个传输线传输到第二集成电路芯片。第二集成电路芯片解码第一数字信号，然后利用该解码的数字信号进一步解码第二数字信号。

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