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1. 发明授权

US06928719B2 Method for fabricating surface acoustic wave filter package 失效
标题翻译：制造表面声波滤波器封装的方法
公开(公告)号：US06928719B2
公开(公告)日：2005-08-16
申请号：US10119708
申请日：2002-04-11
申请人： Tae Hoon Kim , Chan Wang Park , Joo Hun Park , Jong Tae Kim
发明人： Tae Hoon Kim , Chan Wang Park , Joo Hun Park , Jong Tae Kim
IPC分类号： H01L23/29 , H01L23/31 , H03H3/08 , H03H9/02 , H03H9/25 , H03H9/64 , H04R31/00 , H05K3/28
CPC分类号： H03H9/1078 , H01L2224/73204 , H03H9/02913 , H03H9/059 , H03H9/1085 , H03H9/1092 , Y10T29/42 , Y10T29/49005 , Y10T29/4913 , Y10T29/49146
摘要： A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.
摘要翻译：一种用于制造表面声波滤波器芯片封装的方法，包括：将表面声波滤波器芯片安装在基板上; 在基板和芯片之间的空间中形成底部填充物; 通过使用喷涂工艺在芯片的整个外壁上形成金属屏蔽层; 并在金属屏蔽层上模制树脂。金属屏蔽层由导电环氧树脂使用喷嘴形成。

2. 发明授权

US06670206B2 Method for fabricating surface acoustic wave filter packages 失效
公开(公告)号：US06670206B2
公开(公告)日：2003-12-30
申请号：US10119725
申请日：2002-04-11
申请人： Tae Hoon Kim , Chan Wang Park , Joo Hun Park , Jae Myung Kim
发明人： Tae Hoon Kim , Chan Wang Park , Joo Hun Park , Jae Myung Kim
IPC分类号： H01L2100
CPC分类号： H01L21/561 , H01L21/563 , H01L24/29 , H01L24/97 , H01L2224/73203 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/181 , H01L2924/3025 , H03H3/08 , H03H9/02913 , H03H9/059 , H03H9/1078 , H03H9/1085 , H01L2924/00
摘要： Disclosed is a method for simply fabricating plural surface acoustic wave filter chip packages in large quantities comprising the steps of providing a wafer, on the surface of which plural surface acoustic wave filter chips are formed, and a package substrate, on the surface of which mounting portions corresponding to surface acoustic wave filter chips are formed; providing underfill on the package substrate; mounting the wafer on the package substrate; removing wafer portions between surface acoustic wave filter chips; forming metal shield layers on outer walls of separated surface acoustic wave filter chips; molding a resin on outer walls of surface acoustic wave filter chips coated with metal layers; and dividing the package substrate molded with resin into individual surface acoustic wave filter chip packages.

3. 外观设计

USD512693S1 Light-emitting diode 有权
标题翻译：发光二极管
公开(公告)号：USD512693S1
公开(公告)日：2005-12-13
申请号：US29220170
申请日：2004-12-27
申请人： Chang Wook Kim , Chan Wang Park , Won Young Choi
设计人： Chang Wook Kim , Chan Wang Park , Won Young Choi

4. 发明授权

US06730539B2 Method of manufacturing semiconductor device package 失效
标题翻译：制造半导体器件封装的方法
公开(公告)号：US06730539B2
公开(公告)日：2004-05-04
申请号：US10327922
申请日：2002-12-26
申请人： Chan Wang Park , Joon Ho Yoon
发明人： Chan Wang Park , Joon Ho Yoon
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L23/3107 , H01L23/488 , H01L24/10 , H01L24/13 , H01L24/48 , H01L2224/05599 , H01L2224/13 , H01L2224/13099 , H01L2224/45099 , H01L2224/4848 , H01L2224/85051 , H01L2224/85444 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15787 , H01L2924/181 , H01L2224/48465 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing a semiconductor device package includes forming a patterned photoresist film with windows for exposing a plurality of connection bump areas on a conductive substrate, forming metal plating layers on the connection bumps area using the photoresist film, and forming first gold plating layers on the metal plating layers. The metal plating layers prevent the diffusion of the first gold plating layers into the conductive substrate. According to the method, high-qualified conductive layers are formed on the connection bumps by a simplified manufacturing process. Further, connection bumps having an upper part in an almost hemispherical shape are formed on the first gold plating layers, thereby improving the reliability of the semiconductor device package.
摘要翻译：一种制造半导体器件封装的方法包括：将具有窗口的图案化的光致抗蚀剂膜形成用于暴露导电衬底上的多个连接凸起区域，在该连接凸起区域上使用光致抗蚀剂膜形成金属电镀层，以及在第金属镀层。金属镀层防止第一镀金层扩散到导电衬底中。根据该方法，通过简化的制造工艺在连接凸块上形成高质量的导电层。此外，在第一镀金层上形成具有几乎半球形状的上部的连接凸块，从而提高半导体器件封装的可靠性。

5. 发明授权

US06653725B2 Chip package and method of manufacturing the same 失效
标题翻译：芯片封装及其制造方法
公开(公告)号：US06653725B2
公开(公告)日：2003-11-25
申请号：US10321427
申请日：2002-12-18
申请人： Moon Bong Ahn , Chan Wang Park , Yong Chil Choi
发明人： Moon Bong Ahn , Chan Wang Park , Yong Chil Choi
IPC分类号： H01L2348
CPC分类号： H01L23/4922 , H01L23/3121 , H01L23/49827 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/00015 , H01L2924/01078 , H01L2924/181 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A chip package includes a chip having a first surface provided with a first terminal and a second surface provided with at least one second terminal, the second surface being opposite to the first surface, a first substrate arranged on the first surface of the chip and having a first conductive via hole connected to the first terminal, a second substrate arranged on the second surface of the chip and having at least one second conductive via hole connected to the second terminal, and a resin molding part formed around the chip between the first substrate and the second substrate. And the present invention provides a chip package assembly including the chip package. Further, a method of manufacturing the chip package and an assembly including the chip package are provided. The chip package does not use a bonding wire and additional conductive lands, thereby reducing the size of the package and simplifying the manufacturing process.
摘要翻译：芯片封装包括具有设置有第一端子的第一表面和设置有至少一个第二端子的第二表面的芯片，所述第二表面与第一表面相对，布置在芯片的第一表面上的第一衬底具有连接到第一端子的第一导电通孔，布置在芯片的第二表面上并具有连接到第二端子的至少一个第二导电通孔的第二基板，以及在第一基板之间的芯片周围形成的树脂模制部件和第二基板。并且本发明提供了一种包括芯片封装的芯片封装组件。此外，提供了一种制造芯片封装的方法和包括芯片封装的组件。芯片封装不使用接合线和附加的导电焊盘，从而减小封装的尺寸并简化制造工艺。

6. 发明授权

US07156538B2 LED package for backlight unit 有权
标题翻译：背光单元的LED封装
公开(公告)号：US07156538B2
公开(公告)日：2007-01-02
申请号：US10953787
申请日：2004-09-30
申请人： Kyung Taeg Han , Chan Wang Park , Seon Goo Lee
发明人： Kyung Taeg Han , Chan Wang Park , Seon Goo Lee
IPC分类号： F21V21/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014
摘要： Disclosed herein is an LED package for a backlight unit. The LED package includes a plurality of LEDs, a die bonding part, a wire bonding part and a body. The die bonding part, on which the plurality of LEDs is arranged, allows the first electrodes of the LEDs to be electrically connected to an external circuit. The wire bonding part is spaced apart from the die bonding part by a predetermined distance to be insulated from the die bonding part and allows the second electrodes of the LEDs to be electrically connected to the external circuit so that the LEDs are operated. The body has a molding cup which is used to fill a space above the LEDs with transparent resin and a base on which the die bonding part and the wire bonding part are arranged.
摘要翻译：这里公开了一种用于背光单元的LED封装。 LED封装包括多个LED，芯片接合部，引线接合部和主体。多个LED布置在其上的裸片接合部分允许LED的第一电极电连接到外部电路。引线接合部与芯片接合部隔开预定距离，以与芯片接合部绝缘，并且允许LED的第二电极电连接到外部电路，使得LED被操作。本体具有用于以透明树脂填充LED上方的空间的模制杯和芯片接合部分和引线接合部分布置在其上的基座。

7. 发明申请

US20050199884A1 High power LED package 审中-公开
标题翻译：大功率LED封装
公开(公告)号：US20050199884A1
公开(公告)日：2005-09-15
申请号：US10890178
申请日：2004-07-14
申请人： Seon Goo Lee , Seung Mo Park , Chan Wang Park , Jung Kyu Park
发明人： Seon Goo Lee , Seung Mo Park , Chan Wang Park , Jung Kyu Park
IPC分类号： H01L27/15 , H01L33/48 , H01L33/54 , H01L33/60 , H01L33/62
CPC分类号： H01L33/54 , H01L24/17 , H01L24/73 , H01L24/97 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/16245 , H01L2224/48247 , H01L2924/12041 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A high power LED package, in which substantially planar first and second lead frames made of high reflectivity metal are spaced from each other for a predetermined gap. An LED chip is seated on at least one of the lead frames, and having terminals electrically connected to the lead frames, respectively. A package body made of resin seals the LED chip therein while fixedly securing the lead frame in the bottom thereof. The encapsulant preferably fills up the gap between the first and second lead frames. The LED package is structured to raise thermal radiation efficiency thereby reducing the size and thickness thereof.
摘要翻译：大功率LED封装，其中由高反射率金属制成的大致平面的第一和第二引线框架彼此间隔开预定的间隙。 LED芯片位于至少一个引线框架上，并且具有分别电连接到引线框架的端子。由树脂制成的包装体将LED芯片密封在其中，同时将引线框固定在其底部。密封剂优选地填充第一和第二引线框架之间的间隙。 LED封装构造为提高热辐射效率，从而减小其尺寸和厚度。

8. 发明申请

US20050139846A1 High power light emitting diode package and fabrication method thereof 审中-公开
标题翻译：大功率发光二极管封装及其制造方法
公开(公告)号：US20050139846A1
公开(公告)日：2005-06-30
申请号：US10859144
申请日：2004-06-03
申请人： Jung Park , Chan Wang Park , Joon Yoon , Chang Kim , Young Park
发明人： Jung Park , Chan Wang Park , Joon Yoon , Chang Kim , Young Park
IPC分类号： H01L33/44 , H01L21/00 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a high power LED package. In the LED package, a lower board has a heat radiation member in an LED mounting area and at least one via hole around the heat radiation member. First and second bottom electrodes are formed in the underside of the lower board, and connected to the heat radiation member and the via hole. An insulation layer is formed on the lower board to cover the heat radiation member. First and second electrode patterns on the insulation layer are connected to the first and second bottom electrodes through the via hole.
摘要翻译：公开了一种大功率LED封装。在LED封装中，下板在LED安装区域具有散热构件，并且在散热构件周围具有至少一个通孔。第一和第二底部电极形成在下板的下侧，并连接到散热构件和通孔。在下板上形成绝缘层以覆盖散热构件。绝缘层上的第一和第二电极图案通过通孔连接到第一和第二底部电极。

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