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    • 1. 发明授权
    • Positive photosensitive polyimide resin composition
    • 正光敏聚酰亚胺树脂组合物
    • US06875554B2
    • 2005-04-05
    • US10381736
    • 2001-10-03
    • Tadashi HatanakaTomonari NakayamaTakayasu Nihira
    • Tadashi HatanakaTomonari NakayamaTakayasu Nihira
    • G03F7/037C08G73/10C08L79/08G03F7/022G03F7/023G03F7/004G03F7/038
    • G03F7/0233
    • A positive photosensitive polyimide resin composition comprising: (a) a solvent-soluble polyimide comprised of from 1 to 100 mol % of a bivalent organic group derived from a diamine, that has at least one solvent solubilizing functional group, the polyimide having a reduced viscosity ranging from 0.05 to 5.0 dl/g, (b) a photosensitive orthoquinonediazide compound, and (c) from 0.1 to 50 wt %, based on the total weight of all polymers of the composition, of a component (c1) or (c2), wherein: component (c1) is a solvent-soluble polyimide comprised of from 1 to 100 mol % of a bivalent organic group derived from a diamine, that has at least one functional group selected from the group consisting of a long chain alkyl group having at least 6 carbon atoms and a fluorinated alkyl group, the polyimide having a reduced viscosity ranging from 0.05 to 5.0 dl/g, and component (c2) is a polyamic acid comprised of from 1 to 100 mol % of a bivalent organic group derived from a diamine, that has at least one functional group selected from the group consisting of a long chain alkyl group having at least 6 carbon atoms and a fluorinated alkyl group, the polyimide having a reduced viscosity ranging from 0.05 to 5.0 dl/g.
    • 一种正型光敏聚酰亚胺树脂组合物,其包含:(a)由1至100摩尔%的衍生自二胺的二价有机基团的溶剂可溶性聚酰亚胺,其具有至少一种溶剂增溶官能团,所述聚酰亚胺具有比浓粘度 范围为0.05至5.0dl / g,(b)光敏正二叠氮化合物,和(c)基于组合物的所有聚合物的总重量,0.1至50重量%的组分(c1)或(c2) 其中:成分(c1)是由1〜100摩尔%的来自二胺的二价有机基团构成的溶剂可溶性聚酰亚胺,其具有至少1个选自由以下组成的组中的官能团:长链烷基, 至少6个碳原子和氟化烷基,所述聚酰亚胺的比浓粘度范围为0.05-5.0dl / g,组分(c2)是由1至100mol%的衍生自 二胺,至少有o 选自具有至少6个碳原子的长链烷基和氟化烷基的官能团,所述聚酰亚胺的比浓粘度为0.05-5.0dl / g。
    • 2. 发明授权
    • Positive type photosensitive polyimide resin composition
    • 正型光敏聚酰亚胺树脂组合物
    • US06677099B1
    • 2004-01-13
    • US10148396
    • 2002-05-30
    • Kazuhisa IshiiTomonari NakayamaTakayasu NihiraHiroyoshi Fukuro
    • Kazuhisa IshiiTomonari NakayamaTakayasu NihiraHiroyoshi Fukuro
    • G03F7023
    • H01L21/02118C08K5/20C08K5/28C08L79/08G03F7/0233H01L21/312
    • A positive type photosensitive resin composition which can be developed by an aqueous alkaline solution and which is excellent in the developability and the adhesion to a substrate, is presented. Namely, the present invention presents a positive type photosensitive polyimide resin composition characterized by comprising 100 parts by weight of a solvent-soluble polyimide having repeating units represented by the formula (1) and from 1 to 50 parts by weight of a polyimide precursor having repeating units represented by the formula (2), and by further containing an o-quinonediazide compound in an amount of from 1 to 100 parts by weight per 100 parts by weight of the total amount of the repeating units represented by the formula (1) and the repeating units represented by the formula (2): (wherein R1 and R3 are bivalent organic groups, from 1 to 90 mol % of R1 is a bivalent organic group having one or plural groups of at least one type selected from the group consisting of a phenolic hydroxyl group, a carboxyl group, a thiophenol group and a sulfonic group, and from 10 to 99 mol % is a bivalent organic group having no phenolic hydroxyl, carboxylic, thiophenol or sulfonic group, and R2 and R4 are tetravalent organic groups constituting a tetracarboxylic acid or its derivative).
    • 本发明提供一种正极型感光性树脂组合物,其可以通过碱性水溶液显影,并且显影性和对基材的粘附性优异。 即,本发明提供一种正型感光性聚酰亚胺树脂组合物,其特征在于,含有100重量份具有式(1)表示的重复单元的溶剂可溶性聚酰亚胺和1〜50重量份具有重复 由式(2)表示的单元,并且还包含相对于由式(1)表示的重复单元的总量和每100重量份的由式(1)表示的重复单元的总量为1至100重量份的邻醌二叠氮化合物和 由式(2)表示的重复单元:(其中R 1和R 3是二价有机基团,1至90摩尔%的R 1是具有一个或多个基团的二价有机基团 选自酚羟基,羧基,苯硫酚基和磺酸基的至少一种,10〜99摩尔%为无酚羟基,羧基,苯硫酚或磺酸基的二价有机基团, R 2和R 4是构成四羧酸或其衍生物的四价有机基团)。
    • 3. 发明授权
    • Positive photosensitive polyimide resin composition
    • 正光敏聚酰亚胺树脂组合物
    • US07026080B2
    • 2006-04-11
    • US10488093
    • 2002-09-18
    • Tomonari NakayamaMasakazu KatoTakayasu Nihira
    • Tomonari NakayamaMasakazu KatoTakayasu Nihira
    • G03F7/023
    • C08L79/08G03F7/0233
    • The invention provides a positive photosensitive resin composition which is free from film reduction, swelling or peeling at the time of development with an aqueous alkaline solution and which provides a dimensionally stable patterns after curing, and of which the final cured film has a low water absorption and excellent alkaline resistance. A positive photosensitive polyimide resin composition characterized by comprising an organic solvent-soluble polyimide having repeating units represented by the formula (1): (wherein m is an integer of from 3 to 10,000, R1 is a tetravalent organic group, R2 is a bivalent organic group, provided that from 5 to 100 mol % of R2 is a bivalent organic group having fluorine), a polyamic acid and a compound capable of generating an acid by irradiation with light.
    • 本发明提供一种正性感光性树脂组合物,其在用碱性水溶液显影时没有膜还原,溶胀或剥离,并且在固化后提供尺寸稳定的图案,并且其最终固化膜具有低吸水性 并具有优异的耐碱性。 一种正型感光性聚酰亚胺树脂组合物,其特征在于,含有具有式(1)表示的重复单元的有机溶剂可溶性聚酰亚胺:其中,m为3〜10000的整数,R 1为四价 有机基团R 2是二价有机基团,条件是5〜100摩尔%的R 2是具有氟的二价有机基团),聚酰胺酸和 能够通过光照射产生酸的化合物。
    • 5. 发明申请
    • Positively photosensitive resin composition and method of pattern formation
    • 积极感光树脂组合物和图案形成方法
    • US20050147914A1
    • 2005-07-07
    • US10510704
    • 2003-04-18
    • Tadashi HatanakaTakayasu Nihira
    • Tadashi HatanakaTakayasu Nihira
    • G03C1/76G03F7/00G03F7/022G03F7/023G03F7/039G03F7/40
    • G03F7/0233G03F7/0007G03F7/0226
    • The present invention provides a positive photosensitive resin composition which can be developed with a tetramethylammonium hydroxide aqueous solution with a usual concentration, has high sensitivity and excellent resolution, and is excellent in heat resistance, planarization properties, transparency, low water absorption or the like. Further, the present invention provides a method for arbitrarily forming a pattern having a semicircular or trapezoidal section by using the composition. The positive photosensitive resin composition of the present invention comprises an alkali-soluble resin, a 1,2-quinone diazide compound, a crosslinking compound having at least two epoxy groups and a surfactant, and the alkali-soluble resin is a copolymer comprising a carboxylic group-containing acrylic monomer, a hydroxyl group-containing acrylic monomer and an N-substituted maleimide as essential components. By changing the postbake conditions, the composition can arbitrarily form a pattern having a semicircular or trapezoidal section.
    • 本发明提供一种能够以通常浓度的四甲基氢氧化铵水溶液显影,具有高灵敏度和优异分辨率的正型感光性树脂组合物,耐热性,平坦化性,透明性,低吸水性等优异。 此外,本发明提供一种通过使用该组合物任意形成具有半圆形或梯形截面的图案的方法。 本发明的正型感光性树脂组合物包含碱溶性树脂,1,2-醌二叠氮化合物,具有至少两个环氧基的交联化合物和表面活性剂,碱溶性树脂是包含羧酸的共聚物 基团的丙烯酸类单体,含羟基的丙烯酸类单体和N-取代的马来酰亚胺作为必需成分。 通过改变后烘烤条件,组合物可任意形成具有半圆形或梯形截面的图案。
    • 6. 发明授权
    • Positively photosensitive resin composition and method of pattern formation
    • 积极感光树脂组合物和图案形成方法
    • US07001705B2
    • 2006-02-21
    • US10510704
    • 2003-04-18
    • Tadashi HatanakaTakayasu Nihira
    • Tadashi HatanakaTakayasu Nihira
    • G03F7/023G03F7/30
    • G03F7/0233G03F7/0007G03F7/0226
    • The present invention provides a positive photosensitive resin composition which can be developed with a tetramethylammonium hydroxide aqueous solution with a usual concentration, has high sensitivity and excellent resolution, and is excellent in heat resistance, planarization properties, transparency, low water absorption or the like. Further, the present invention provides a method for arbitrarily forming a pattern having a semicircular or trapezoidal section by using the composition. The positive photosensitive resin composition of the present invention comprises an alkali-soluble resin, a 1,2-quinone diazide compound, a crosslinking compound having at least two epoxy groups and a surfactant, and the alkali-soluble resin is a copolymer comprising a carboxylic group-containing acrylic monomer, a hydroxyl group-containing acrylic monomer and an N-substituted maleimide as essential components. By changing the postbake conditions, the composition can arbitrarily form a pattern having a semicircular or trapezoidal section.
    • 本发明提供一种能够以通常浓度的四甲基氢氧化铵水溶液显影,具有高灵敏度和优异分辨率的正型感光性树脂组合物,耐热性,平坦化性,透明性,低吸水性等优异。 此外,本发明提供一种通过使用该组合物任意形成具有半圆形或梯形截面的图案的方法。 本发明的正型感光性树脂组合物包含碱溶性树脂,1,2-醌二叠氮化合物,具有至少两个环氧基的交联化合物和表面活性剂,碱溶性树脂是包含羧酸的共聚物 基团的丙烯酸类单体,含羟基的丙烯酸类单体和N-取代的马来酰亚胺作为必需成分。 通过改变后烘烤条件,组合物可任意形成具有半圆形或梯形截面的图案。
    • 7. 发明授权
    • Polyimide precursors and polyimides
    • 聚酰亚胺前体和聚酰亚胺
    • US06489431B1
    • 2002-12-03
    • US09806487
    • 2001-04-12
    • Kazuhisa IshiiTakayasu NihiraHiroyoshi Fukuro
    • Kazuhisa IshiiTakayasu NihiraHiroyoshi Fukuro
    • C08G7310
    • C08G73/1039C08G73/10
    • A polyimide precursor having a repeating unit represented by the following general formula (1), wherein R1 contains a bivalent organic group constituting a diamine having a hexafluoropropylidene group in its molecule represented by the following general formula (2), and the reduced viscosity is from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl), and a polyimide obtained by imidizing said precursor: (wherein R1 is a bivalent organic group constituting a diamine, A is a hydrogen atom, a linear alkyl group including a methyl group, or a trifluoromethyl group, and n is the number of a substituent on an aromatic ring and an integer of from 1 to 4).
    • 具有由以下通式(1)表示的重复单元的聚酰亚胺前体,其中R1分子由以下通式(2)表示的分子中包含构成具有六氟亚丙基的二胺的二价有机基团,并且比浓粘度来自 0.05〜5.0dl / g(在N-甲基吡咯烷酮中,温度30℃,浓度:0.5g / dl)和通过酰亚胺化所述前体获得的聚酰亚胺(其中R1是构成二胺的二价有机基团,A 是氢原子,包括甲基或三氟甲基的直链烷基,n是芳环上的取代基数和1至4的整数)。
    • 10. 发明授权
    • Alicyclic compound and curable resin composition
    • 脂环族化合物和可固化树脂组合物
    • US06365771B1
    • 2002-04-02
    • US09786443
    • 2001-03-14
    • Hideo SuzukiTakayasu NihiraShinichiro Takigawa
    • Hideo SuzukiTakayasu NihiraShinichiro Takigawa
    • C07C6952
    • C07C43/1781C07C43/162C07C69/54C07C2603/68C08F220/30C08F222/1006G03F7/027
    • Decane compound or decene compound shown in the formula [1] below wherein A1 and A2 are independently hydrogen or (meth)acryloyl group or 2-vinyloxyethyl group; and the dotted line is single bond or double bond with the proviso that A1 and A2 are not hydrogen at the same time; and curable resin composition containing said compound therein. The compound are suitable as the photo-monomer for resist raw materials because of high clarity at short wavelength ultraviolet light, dry etching resistance, adhesive property for the substrate and high solubility in alkaline developing solution in addition to high sensitivity and greater resolution; as the monomer for optic raw materials and disk overcoat materials because of high clarity, low birefringence and low water absorption rate; and as the monomer for the coating raw materials such as EB curable coating raw materials because of high reactivity, high wear characteristics and water resistance.
    • 式(1)所示的癸烷化合物或癸烯化合物,其中A1和A2独立地为氢或(甲基)丙烯酰基或2-乙烯氧基乙基; 并且虚线是单键或双键,条件是A1和A2不同时为氢; 和含有该化合物的可固化树脂组合物。由于在短波长紫外光下的高透明度,耐干蚀刻性,基板粘合性和在碱性显影液中的高溶解度,因此该化合物适合作为抗蚀剂原料的光单体 灵敏度高,分辨率更高; 作为光学原料和圆盘外套材料的单体,因为透明度高,双折射低,吸水率低; 并且作为涂料原料如EB固化涂料原料的单体,因为反应性高,耐磨性和耐水性高。