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    • 1. 发明授权
    • Ink jet head for use in a printer
    • 用于打印机的喷墨头
    • US06726312B1
    • 2004-04-27
    • US09686950
    • 2000-10-12
    • Tadamasa FujimuraNobutaka KajiuraToshiharu Suganuma
    • Tadamasa FujimuraNobutaka KajiuraToshiharu Suganuma
    • B41J2045
    • B41J2/161B41J2/14233B41J2/1623B41J2/1632B41J2/1637B41J2002/14419
    • There is provided an ink jet head to transmit a shock wave propagated by an oscillator plate to the ink discharge orifice without significant power-loss for ink ejection. An ink jet head has a body (10) having an oscillator plate with an outer surface (11) and an inner surface (12), the inner surface being parallel to the outer surface. The ink jet head also has an ink pressuring chamber formed in the body between the inner surface and an opposed lower wall (13), the lower wall being angled relative to the inner surface. The ink jet head also has an ink feed chamber formed in the body. The ink jet head also has an ink feed passage formed in the body communicating between the ink feed chamber and the ink pressuring chamber, the ink feed passage having an ink feed orifice opening into the ink pressuring chambers. The ink jet head also has an ink discharge passage formed through the lower wall of the body communicating with a discharge orifice on the lower wall, the ink discharge passage having an inlet at the ink pressuring chamber and terminating at the discharge orifice, the ink discharge passage being continuously narrowed from the ink pressuring chamber to the discharge orifice.
    • 提供了一种喷墨头,用于将由振荡板传播的冲击波传递到喷墨孔,而没有显着的墨水喷射功率损耗。 喷墨头具有具有外表面(11)和内表面(12)的振荡板的主体(10),内表面平行于外表面。 喷墨头还具有形成在内表面和相对的下壁(13)之间的主体中的油墨加压室,下壁相对于内表面成一定角度。 喷墨头还具有形成在主体中的供墨室。 喷墨头还具有形成在本体中的供墨通道,其连通在供墨室和加压室之间,供墨通道具有通向油墨加压室的供墨孔。 喷墨头还具有通过本体的下壁形成的墨水排出通道,其与下壁上的排放孔连通,排墨通道在墨压室处具有入口并终止于排出口,墨排出口 通道从压墨室连续变窄到排出口。
    • 2. 发明授权
    • Curing device
    • 固化装置
    • US5697777A
    • 1997-12-16
    • US523019
    • 1995-09-01
    • Mitsuo AraiToshiharu Suganuma
    • Mitsuo AraiToshiharu Suganuma
    • H01L21/52F26B3/00F26B3/20F26B15/12F27B9/28
    • F26B3/00F26B15/12F26B3/20H01L24/75
    • A curing device for drying bonding material used for bonding, for example, chips to a lead frame for semiconductor devices including a workpiece heating chamber casing having heating blocks for heat-drying the bonding material and a gas supply chamber casing provided above the workpiece heating chamber casing so as to cover the heating chamber casing and to supply a high-temperature gas to the surfaces of the heating blocks, and the gas supply chamber casing is constructed so that it can be opened and closed with respect to the workpiece heating chamber casing, assuring easy access to the inside of the heating chamber casing for various works such as cleaning of the heating blocks, etc.
    • 用于将用于将例如芯片接合的接合材料用于半导体器件的引线框架的固化装置,所述半导体器件的引线框架包括具有用于加热所述接合材料的加热块的工件加热室壳体和设置在所述工件加热室上方的气体供给室壳体 壳体,以覆盖加热室壳体并向加热块的表面供给高温气体,并且气体供给室壳体被构造成能够相对于工件加热室壳体打开和关闭, 确保容易地进入加热室壳体的内部,用于诸如清洁加热块等的各种工作。