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    • 5. 发明授权
    • Nozzle touch device in an injection molding apparatus
    • 注射成型设备中的喷嘴触摸装置
    • US5143736A
    • 1992-09-01
    • US531639
    • 1990-06-01
    • Masaaki KumamuraRyohei InabaShojiro DanmotoMitsuo Arai
    • Masaaki KumamuraRyohei InabaShojiro DanmotoMitsuo Arai
    • B29C45/17B29C45/50B29C45/64B29C45/76
    • B29C45/641B29C45/1777B29C45/50B29C45/76B29C2033/207B29C2045/5076B29C2045/508
    • An injection molding apparatus includes a screw housed in a heating cylinder, a rotator for rotating the screw, a linear mover for moving the screw linearly, a motor for driving the rotator, a driver for driving the linear mover, and a base member for supporting the screw, the rotator, the linear mover, the motor and the driver. The screw, the linear mover and the rotator are supported by the base member along a vertical line against the ground. In the injection molding apparatus is a nozzle touch mechanism which includes a support member mounted on the base member, and a member for mounting a die member mounted on the support member to support the die member. The die member is mounted by the member for mounting the die member so that a molding material entrance port of the die member engages an injection port of the heating cylinder. The nozzle touch mechanism further includes a spring member provided between the member for mounting a die member and the support member so as to exert a nozzle touch force on the heating cylinder and the die member.
    • 注射成型装置包括容纳在加热缸中的螺杆,用于旋转螺杆的旋转器,用于使丝杠直线移动的直线移动器,用于驱动旋转器的马达,用于驱动线性动子的驱动器和用于支撑的基座构件 螺丝,旋转器,直线移动器,电机和驱动器。 螺杆,直线移动器和旋转器由底座部件沿垂直线对着地面支撑。 注射成型装置是一种喷嘴接触机构,其包括安装在基底构件上的支撑构件,以及用于安装安装在支撑构件上以支撑模具构件的模具构件的构件。 模具构件由用于安装模具构件的构件安装,使得模具构件的模制材料入口端口接合加热缸的注入口。 喷嘴接触机构还包括设置在用于安装模具构件的构件和支撑构件之间以在加热缸和模具构件上施加喷嘴接触力的弹簧构件。
    • 6. 发明授权
    • Curing device
    • 固化装置
    • US5267853A
    • 1993-12-07
    • US959778
    • 1992-10-13
    • Mitsuo Arai
    • Mitsuo Arai
    • H01L21/52F27B9/24F27D3/12H01L21/50F27B9/28
    • F27B9/24F27D2003/122
    • A curing device, which hardens on heater blocks a paste used for die-bonding the chips to lead frames, including frame supporting wires, wire slacking preventing collars and frame conveying wires. The frame supporting wires are installed above the heater blocks and parallel to the feeding direction of the lead frames, and the wire slacking preventing collars are mounted on the frame supporting wires so that a constant space is retained between the frame supporting wires and the heater blocks. The lead frames are fed and placed on the frame supporting wires when the frame conveying wires, which are movable vertically, is moved down, so that the pastes is heated by the heater blocks.
    • 一种固化装置,其在加热器上硬化用于将芯片芯片接合到引线框架的糊状物,包括框架支撑线,防止绳索和框架输送线。 框架支撑线安装在加热器块的上方并平行于引线框架的馈送方向,并且防止卷线的环被安装在框架支撑线上,使得在框架支撑线和加热块之间保持恒定的空间 。 当可垂直移动的框架输送线向下移动时,引线框架被馈送并放置在框架支撑线上,使得糊料被加热器块加热。
    • 8. 发明授权
    • Curing device
    • 固化装置
    • US5697777A
    • 1997-12-16
    • US523019
    • 1995-09-01
    • Mitsuo AraiToshiharu Suganuma
    • Mitsuo AraiToshiharu Suganuma
    • H01L21/52F26B3/00F26B3/20F26B15/12F27B9/28
    • F26B3/00F26B15/12F26B3/20H01L24/75
    • A curing device for drying bonding material used for bonding, for example, chips to a lead frame for semiconductor devices including a workpiece heating chamber casing having heating blocks for heat-drying the bonding material and a gas supply chamber casing provided above the workpiece heating chamber casing so as to cover the heating chamber casing and to supply a high-temperature gas to the surfaces of the heating blocks, and the gas supply chamber casing is constructed so that it can be opened and closed with respect to the workpiece heating chamber casing, assuring easy access to the inside of the heating chamber casing for various works such as cleaning of the heating blocks, etc.
    • 用于将用于将例如芯片接合的接合材料用于半导体器件的引线框架的固化装置,所述半导体器件的引线框架包括具有用于加热所述接合材料的加热块的工件加热室壳体和设置在所述工件加热室上方的气体供给室壳体 壳体,以覆盖加热室壳体并向加热块的表面供给高温气体,并且气体供给室壳体被构造成能够相对于工件加热室壳体打开和关闭, 确保容易地进入加热室壳体的内部,用于诸如清洁加热块等的各种工作。