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1. 发明授权

US06551371B1 Titanium-based composite material, method for producing the same and engine valve 有权
标题翻译：钛基复合材料及其制造方法和发动机阀门
公开(公告)号：US06551371B1
公开(公告)日：2003-04-22
申请号：US09743809
申请日：2001-01-22
申请人： Tadahiko Furuta , Takashi Saito , Hiroyuki Takamiya , Toshiya Yamaguchi
发明人： Tadahiko Furuta , Takashi Saito , Hiroyuki Takamiya , Toshiya Yamaguchi
IPC分类号： C01C105
CPC分类号： C22C32/00 , C22C14/00 , C22F1/183 , F01L3/02
摘要： A titanium-based composite material according to the present invention is characterized in that it comprises: a matrix containing a titanium (Ti) alloy as a major component, and titanium compound particles and/or rare-earth element compound particles dispersed in the matrix, wherein the matrix contains 3.0-7.0% by weight of aluminum (Al), 2.0-6.0% by weight of tin (Sn), 2.0-6.0% by weight of zirconium (Zr), 0.1-0.4% by weight of silicon (Si) and 0.1-0.5% by weight of oxygen (O), the titanium compound particles occupy 1-10% by volume, and the rare-earth element compound particles occupy 3% by volume or less. With this arrangement, it is possible to obtain a titanium material, which is good in terms of the heat resistance, hot working property, specific strength, and so on.
摘要翻译：根据本发明的钛基复合材料的特征在于它包括：以钛（Ti）合金为主要成分的基体，分散在基质中的钛化合物颗粒和/或稀土元素化合物颗粒，其中所述基质含有3.0-7.0重量％的铝（Al），2.0-6.0重量％的锡（Sn），2.0-6.0重量％的锆（Zr），0.1-0.4重量％的硅（Si ）和0.1-0.5重量％的氧（O），钛化合物颗粒占1-10体积％，稀土元素化合物颗粒占3体积％以下。由此，可以获得在耐热性，热加工性，比强度等方面优异的钛材料。

2. 发明授权

US06607693B1 Titanium alloy and method for producing the same 有权
标题翻译：钛合金及其制造方法
公开(公告)号：US06607693B1
公开(公告)日：2003-08-19
申请号：US09762703
申请日：2001-02-12
申请人： Takashi Saito , Tadahiko Furuta , Kazuaki Nishino , Hiroyuki Takamiya
发明人： Takashi Saito , Tadahiko Furuta , Kazuaki Nishino , Hiroyuki Takamiya
IPC分类号： C22C1400
CPC分类号： C22C27/02 , B22F2998/10 , C22C1/045 , C22C1/0458 , C22C14/00 , Y10S75/95 , B22F1/0003 , B22F3/1208 , B22F3/15
摘要： A titanium alloy according to the present invention is characterized in that it comprises an element of Va group (the vanadium group) in an amount of 30-60% by weight and the balance of titanium substantially, exhibits an average Young's modulus of 75 GPa or less, and exhibits a tensile elastic limit strength of 700 MPa or more. This titanium alloy can be used in a variety of products, which are required to exhibit a low Young's modulus, a high elastic deformability and a high strength, in a variety of fields.
摘要翻译：根据本发明的钛合金的特征在于，其包含量为30-60重量％的Va族（钒族）的元素和基本上钛的余量，其平均杨氏模量为75GPa或并且具有700MPa以上的拉伸弹性极限强度。该钛合金可以用于各种领域中需要显示低杨氏模量，高弹性变形性和高强度的各种产品。

3. 发明授权

US6117204A Sintered titanium alloy material and process for producing the same 有权
标题翻译：烧结钛合金材料及其制备方法
公开(公告)号：US6117204A
公开(公告)日：2000-09-12
申请号：US153911
申请日：1998-09-16
申请人： Takashi Saito , Tadahiko Furuta , Hiroyuki Takamiya
发明人： Takashi Saito , Tadahiko Furuta , Hiroyuki Takamiya
IPC分类号： C22C1/04 , C22C14/00 , C22C32/00
CPC分类号： C22C14/00 , C22C32/0073
摘要： A sintered Ti alloy material and a process for producing the same, which comprises a matrix mainly comprising a Ti alloy, and TiB dispersed and maintained in said matrix, wherein a composition of the sintered Ti alloy material at least comprises from 0.1 to 8.0% by weight of B, from 3.0 to 30.0% by weight of Mo, 50% by weight or more of Ti, and the balance of unavoidable impurities.
摘要翻译：一种烧结Ti合金材料及其制造方法，其包含主要包含Ti合金的基体和分散并保持在所述基体中的TiB，其中，所述烧结Ti合金材料的组成至少包含0.1〜8.0％ B的重量，3.0〜30.0重量％的Mo，50重量％以上的Ti，余量为不可避免的杂质。

4. 发明申请

US20070002509A1 Integrated circuit device and electronic instrument 有权
标题翻译：集成电路器件和电子仪器
公开(公告)号：US20070002509A1
公开(公告)日：2007-01-04
申请号：US11477720
申请日：2006-06-30
申请人： Takashi Kumagai , Hisanobu Ishiyama , Kazuhiro Maekawa , Satoru Ito , Takashi Fujise , Junichi Karasawa , Satoru Kodaira , Takayuki Saiki , Hiroyuki Takamiya
发明人： Takashi Kumagai , Hisanobu Ishiyama , Kazuhiro Maekawa , Satoru Ito , Takashi Fujise , Junichi Karasawa , Satoru Kodaira , Takayuki Saiki , Hiroyuki Takamiya
IPC分类号： H02H9/00
CPC分类号： G09G3/3688 , G02F1/13452 , G02F2202/28 , G09G3/3696 , G09G2300/0426 , G09G2310/027
摘要： An integrated circuit device includes a pad PDx and an electrostatic discharge protection element ESDx formed in a rectangular region and electrically connected with the pad PDx. The pad PDx is disposed in an upper layer of the electrostatic discharge protection element ESDx so that an arrangement direction of the pads is parallel to a long side direction of the region in which the electrostatic discharge protection element ESDx is formed, and the pad PDx overlaps part or the entirety of the electrostatic discharge protection element ESDx.
摘要翻译：集成电路器件包括形成在矩形区域中并与焊盘PDx电连接的焊盘PDx和静电放电保护元件ESDx。垫PDx设置在静电放电保护元件ESDx的上层中，使得焊盘的布置方向平行于形成有静电放电保护元件ESDx的区域的长边方向，并且焊盘PDx重叠部分或全部静电放电保护元件ESDx。

5. 发明授权

US08338890B2 Semiconductor device and method for manufacturing semiconductor device 失效
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US08338890B2
公开(公告)日：2012-12-25
申请号：US12627652
申请日：2009-11-30
申请人： Takayuki Saiki , Shinya Sato , Hiroyuki Takamiya
发明人： Takayuki Saiki , Shinya Sato , Hiroyuki Takamiya
IPC分类号： H01L23/62
CPC分类号： H01L25/0657 , H01L23/481 , H01L23/60 , H01L24/29 , H01L24/32 , H01L24/48 , H01L25/18 , H01L27/0251 , H01L2224/0401 , H01L2224/0557 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/078 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2224/05552 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes: a plurality of external terminals; a plurality of semiconductor substrates that are layered; a through electrode penetrating through at least one of the semiconductor substrates and electrically connected with any of the external terminals; and a plurality of electrostatic discharge protection circuits provided on any one of the semiconductor substrates. In the device, the through electrode is electrically connected with the plurality of electrostatic discharge protection circuits.
摘要翻译：半导体器件包括：多个外部端子; 层叠的多个半导体基板; 穿透电极，穿透至少一个所述半导体衬底并与所述任何外部端子电连接; 以及设置在所述半导体基板中的任一个上的多个静电放电保护电路。在该器件中，贯通电极与多个静电放电保护电路电连接。

6. 发明授权

US07974051B2 Integrated circuit device and electronic instrument 有权
标题翻译：集成电路器件和电子仪器
公开(公告)号：US07974051B2
公开(公告)日：2011-07-05
申请号：US12081004
申请日：2008-04-09
申请人： Shinya Sato , Takayuki Saiki , Hiroyuki Takamiya
发明人： Shinya Sato , Takayuki Saiki , Hiroyuki Takamiya
IPC分类号： H02H9/00
CPC分类号： H01L27/0251
摘要： An interface circuit is provided between a first circuit block and a second circuit block that operates using a power supply system differing from that of the first circuit block. An electrostatic discharge protection circuit that include a PN diode and a diffused resistor is formed in order to prevent electrostatic discharge destruction of a gate insulating film of a transistor that forms the interface circuit. The electrostatic discharge protection circuit may be formed using the remaining basic cells of a gate array that forms the second circuit block. An electrostatic discharge protection circuit formed of a bidirectional diode may be connected between a first low-potential power supply and a second low-potential power supply.
摘要翻译：在第一电路块和使用不同于第一电路块的电源系统的电源系统操作的第二电路块之间提供接口电路。形成包括PN二极管和扩散电阻器的静电放电保护电路，以防止形成接口电路的晶体管的栅极绝缘膜的静电放电破坏。可以使用形成第二电路块的门阵列的剩余基本单元形成静电放电保护电路。由双向二极管形成的静电放电保护电路可以连接在第一低电位电源和第二低电位电源之间。

7. 发明授权

US5470402A Ferritic heat-resistant cast steel and process for producing the same 失效
标题翻译：铁素体耐热铸钢及其制造方法
公开(公告)号：US5470402A
公开(公告)日：1995-11-28
申请号：US275749
申请日：1994-07-20
申请人： Kazuaki Nishino , Yoji Awano , Hiroyuki Takamiya , Mitsufumi Ito , Masami Suzuki , Yoshikazu Genma
发明人： Kazuaki Nishino , Yoji Awano , Hiroyuki Takamiya , Mitsufumi Ito , Masami Suzuki , Yoshikazu Genma
IPC分类号： C21D6/00 , C22C38/00 , C22C38/48 , C22C38/60 , C22C38/24
CPC分类号： C22C38/60
摘要： A ferritic heat-resistant cast steel includes C in an amount of from 0.1 to 0.4% by weight, Si in an amount of from 0.5 to 2.0% by weight, Mn in an amount of 1.0% by weight or less, S in an amount of from 0.06 to 0.20% by weight, Ni in an amount of 1.0% by weight or less, Cr in an amount of from 13 to 20% by weight, V in an amount of from 0.2 to 1.0% by weight, at least one element selected from the group consisting of Nb in an amount of from 0.1 to 0.4% by weight, Mo in an amount of from 0.1 to 2.0% by weight, and W in an amount of from 0.2 to 4.0% by weight, and the balance of Fe and inevitable impurities, the S being dispersed as sulfides in the ferritic heat-resistant cast steel. It can further include at least one element selected from the group consisting of Te in an amount of from 0.01 to 0.1% by weight and Al in an amount of from 0.01 to 0.5% by weight. It can be produced by melting and casting the alloying elements and thereafter by annealing the resulting cast product at a temperature of from 750.degree. to 1,000.degree. C.
摘要翻译：一种铁素体系耐热铸钢，其中C为0.1〜0.4重量％，Si为0.5〜2.0重量％，Mn为1.0重量％以下，S为量为0.06〜0.20重量％，Ni为1.0重量％以下，Cr为13〜20重量％，V为0.2〜1.0重量％，至少1个元素选自0.1〜0.4重量％的Nb，0.1〜2.0重量％的Mo，0.2〜4.0重量％的W，余量的Fe和不可避免的杂质，S作为硫化物分散在铁素体耐热铸钢中。它还可以包括至少一种选自Te组分的元素，其量为0.01至0.1重量％，Al的量为0.01至0.5重量％。可以通过熔融和铸造合金元素，然后在750〜1000℃的温度下退火所得到的铸造产品。

8. 发明申请

US20070000971A1 Integrated circuit device and electronic instrument 有权
标题翻译：集成电路器件和电子仪器
公开(公告)号：US20070000971A1
公开(公告)日：2007-01-04
申请号：US11477741
申请日：2006-06-30
申请人： Takashi Kumagai , Hisanobu Ishiyama , Kazuhiro Maekawa , Satoru Ito , Takashi Fujise , Junichi Karasawa , Satoru Kodaira , Takayuki Saiki , Hiroyuki Takamiya
发明人： Takashi Kumagai , Hisanobu Ishiyama , Kazuhiro Maekawa , Satoru Ito , Takashi Fujise , Junichi Karasawa , Satoru Kodaira , Takayuki Saiki , Hiroyuki Takamiya
IPC分类号： A47J36/02
CPC分类号： H01L27/0207 , G09G3/3688 , H01L27/105 , H01L27/11 , H01L27/1116
摘要： An integrated circuit device includes first and second transistors NTr1 and PTr1 push-pull connected between first and second power supply lines and outputting a voltage of one of the first and second power supply lines to a connection node ND by a charge-pump operation, and a pad PD electrically connected with the connection node ND and electrically connected with a flying capacitor, to which a given voltage is applied at one end, at the other end of the flying capacitor. The pad PD is disposed in an upper layer of at least one of the first and second transistors NTr1 and PTr1 so that the pad PD overlaps part or the entirety of at least one of the first and second transistors NTr1 and PTr1.
摘要翻译：集成电路装置包括连接在第一和第二电源线之间的第一和第二晶体管NTr1和PTr1推挽，并通过电荷泵操作将第一和第二电源线之一的电压输出到连接节点ND 以及与连接节点ND电连接并与在一端施加给定电压的飞跨电容器电连接在浮动电容器的另一端的焊盘PD。焊盘PD设置在第一和第二晶体管NTr 1和PTr 1中的至少一个的上层中，使得焊盘PD与第一和第二晶体管NTr 1和PTr 1中的至少一个晶体管的一部分或全部重叠。

9. 发明授权

US6150455A Thermostable polymer electrolyte gel 失效
标题翻译：耐热聚合物电解质凝胶
公开(公告)号：US6150455A
公开(公告)日：2000-11-21
申请号：US963832
申请日：1997-11-04
申请人： Hiroyuki Takamiya , Ryosuke Nishida , Tatsuaki Sumitani
发明人： Hiroyuki Takamiya , Ryosuke Nishida , Tatsuaki Sumitani
IPC分类号： C08K3/24 , C08K3/28 , C08L33/20 , H01B1/12 , H01M6/18 , H01M6/22 , H01M10/05 , H01M10/0565 , C08L9/02
CPC分类号： H01M10/052 , H01B1/122 , H01M10/0565 , H01M2300/0085 , Y10T428/31935
摘要： A thermostable polymer electrolyte gel containing an acrylonitrile polymer, an electrolyte and a solvent, the acrylonitrile polymer having an acrylonitrile content of from 89 wt % to 98 wt % and meeting the following relationship:1,040,000-(A.times.10,000).ltoreq.B.ltoreq.1,490,000-(A.times.10,000)where A is the acrylonitrile content in wt % and B is the weight average molecular weight of the acrylonitrile polymer, the polymer electrolyte gel having an ion conductivity of 10.sup.-3 S/cm or higher at 20.degree. C., exhibiting the "retention of shape" in a thermostability test, and containing the acrylonitrile polymer in a proportion of from 3 wt % to 9 wt %. The thermostable polymer electrolyte gel can be produced by dissolving an acrylonitrile polymer and an electrolyte in a solvent to prepare a solution of the polymer, and cooling the polymer solution to a temperature of 0.degree. C. or lower.
摘要翻译：包含丙烯腈聚合物，电解质和溶剂的耐热聚合物电解质凝胶，所述丙烯腈聚合物具有89重量％至98重量％的丙烯腈含量并满足以下关系：1,040,000-（Ax10,000） / = 1,490,000-（Ax10,000）其中A是丙烯腈含量（wt％），B是丙烯腈聚合物的重均分子量，聚合物电解质凝胶在20℃时的离子电导率为10-3S / cm或更高在热稳定性试验中表现出“保持形状”，并以3重量％至9重量％的比例含有丙烯腈聚合物。可以通过将丙烯腈聚合物和电解质溶解在溶剂中来制备聚合物溶液并将聚合物溶液冷却至0℃或更低的温度来制备耐热聚合物电解质凝胶。

10. 发明授权

US06143390A Low-temperature regenerative type moisture absorbing element 失效
标题翻译：低温再生式吸湿元件
公开(公告)号：US06143390A
公开(公告)日：2000-11-07
申请号：US695820
申请日：1996-08-05
申请人： Hiroyuki Takamiya , Tatsuaki Sumitani , Masao Ieno
发明人： Hiroyuki Takamiya , Tatsuaki Sumitani , Masao Ieno
IPC分类号： B01D53/26 , B01D53/28 , B01J19/32 , B01J20/26 , B01J20/28 , B32B33/00 , B05D1/14
CPC分类号： B01J20/28033 , B01D53/28 , B01J19/32 , B01J20/28023 , B01J20/28042 , B01J20/28045 , B01D2253/202 , B01J2219/32206 , B01J2219/3221 , B01J2219/32213 , B01J2219/32483
摘要： A low-temperature regenerative type moisture absorbing element of fast moisture absorbing and releasing speed, capable of regenerating at 110.degree. C. or less and having a sufficiently high moisture absorbing and releasing performance in spite of small size is provided. A low-temperature regenerative type moisture absorbing element is mainly composed of high moisture absorbing and releasing polymeric compound with the content of salt type carboxyl group adjusted to a specific amount, and further comprises plural gas passages, of which regeneration temperature is 110.degree. C. or less. It is hence possible to provide a moisture absorbing element of small size, high efficiency, and energy-saving type, being excellent in moisture absorbing and releasing performance, and easily capable of removing absorbed moisture at low temperature which was impossible with the conventional moisture absorbing element. It can be applied not only in industrial and commercial uses, but also in household dehumidifying and drying applications, and may be employed in dehumidifying and drying applications of various gases.
摘要翻译：提供了一种具有快速吸水和释放速度的低温再生式吸湿元件，其能够在110℃或更低温度下再生，并具有足够高的吸湿性能，尽管尺寸小。低温再生式吸湿元件主要由具有特定量的盐类羧基含量的高吸水和释放聚合物组成，并且还包括再生温度为110℃的多个气体通道。或更少。因此，可以提供一种小型，高效率，节能型的吸湿元件，其吸湿性和脱模性优异，并且能够容易地除去在常规吸湿中不可能的低温吸收水分元件。它不仅可用于工业和商业用途，而且可用于家用除湿和干燥应用中，并且可用于各种气体的除湿和干燥应用。

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