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    • 2. 发明申请
    • METHOD FOR MANUFACTURING GRATINGS IN SEMICONDUCTOR MATERIALS THAT READILY OXIDISE
    • 在半导体材料中制备易于氧化的材料的方法
    • WO2005046013A1
    • 2005-05-19
    • PCT/IB2004/003537
    • 2004-10-29
    • BOOKHAM TECHNOLOGY PLCFINLAY, RichardKNIGHT, Gordon, D.GOODCHILD, Darren, P.HINZER, Karin
    • FINLAY, RichardKNIGHT, Gordon, D.GOODCHILD, Darren, P.HINZER, Karin
    • H01S5/12
    • G02B5/1857H01L21/3083H01S5/12H01S5/1228H01S5/1231H01S5/2081H01S2301/173
    • The present invention is a combination of in-situ etching with a grating mask pattern comprised only of semiconductor material, together with the fabrication of a protective layer beneath the semiconductor grating mask that protects the semiconductor material that readily oxidises. As such the present invention is based on a two-stage process. First the grating pattern is defined in a semiconductor material, wherein this pattern is called the semiconductor grating mask. The semiconductor grating mask sits on top of a layer of protective material, which in turn is on top of the semiconductor material that readily oxidises, wherein the protective layer prevents oxidation of the material below.The semiconductor structure is then moved to a reactor, where, in the second stage, the mask pattern is transferred into the underlying protective layer and the semiconductor material that readily oxidises, by in-situ etching. The grating is then overgrown in the same reactor without exposing the etched grating to the atmosphere. The overgrown material protects the underlying semiconductor material from oxidation when the structure is removed from the reactor.
    • 本发明是原位蚀刻与仅由半导体材料组成的光栅掩模图案的组合,以及在半导体光栅掩模下面制造保护半导体材料的保护层,其保护易于氧化。 因此,本发明基于两阶段过程。 首先,光栅图案被限定在半导体材料中,其中该图案被称为半导体光栅掩模。 半导体光栅掩模位于保护材料层的顶部,保护材料层又在半导体材料的顶部上容易氧化,其中保护层防止材料在下面氧化。然后将半导体结构移至反应器,其中 在第二阶段中,通过原位蚀刻将掩模图案转移到下面的保护层和容易氧化的半导体材料中。 然后光栅在相同的反应器中过度生长,而不会将蚀刻的光栅暴露在大气中。 当结构从反应器中移除时,杂色成长的材料保护下面的半导体材料免于氧化。
    • 3. 发明申请
    • METHOD FOR MANUFACTURING GRATINGS IN SEMICONDUCTOR MATERIALS
    • 在半导体材料中制造光刻的方法
    • WO2005043701A1
    • 2005-05-12
    • PCT/IB2004/003538
    • 2004-10-28
    • BOOKHAM TECHNOLOGY PLCKNIGHT, Gordon, D.CLEROUX, MichaelFINLAY, Richard
    • KNIGHT, Gordon, D.CLEROUX, MichaelFINLAY, Richard
    • H01S5/12
    • H01S5/12H01L21/30612H01S5/1228H01S5/1231H01S5/2081H01S5/3235H01S2301/173H01S2304/04
    • The present invention is a combination of in-situ etching using a grating mask that is formed in semiconductor material only and the subsequent overgrowth of additional semiconductor material to enclose the grating structure prior to exposure to the atmosphere and the contaminants therein. The present invention is based on a two-stage process. First the grating pattern is defined in a semiconductor material, which is the grating mask. This grating mask is created at a position above the material that is to ultimately contain the grating pattern. Upon the completion of the fabrication of the grating mask, the semiconductor structure is moved to a reactor, where in the second stage, the grating pattern defined by the grating mask is transferred into the underlying semiconductor layers by in-situ etching. The grating is subsequently overgrown with additional semiconductor material while in the same reactor, thereby not exposing the etched grating pattern to the atmosphere thereby reducing the contaminants in the grating structure of the semiconductor laser.
    • 本发明是使用仅在半导体材料中形成的光栅掩模的原位蚀刻和随后的附加半导体材料的过度生长以在暴露于大气和其中的污染物之前封装光栅结构的组合。 本发明基于两阶段方法。 首先,光栅图案被定义在半导体材料中,其是光栅掩模。 该光栅掩模在最终包含光栅图案的材料上方的位置处产生。 在完成光栅掩模的制造之后,将半导体结构移动到电抗器,其中在第二阶段,由光栅掩模限定的光栅图案通过原位蚀刻转移到下面的半导体层中。 光栅随后在相同的反应器中长满了附加的半导体材料,从而不会将蚀刻的光栅图案暴露于大气中,从而减少了半导体激光器的光栅结构中的污染物。