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    • 6. 发明专利
    • PACKAGE BODY FOR SEMICONDUCTOR WAFER
    • JP2000062891A
    • 2000-02-29
    • JP22723498
    • 1998-08-11
    • TOSHIBA CERAMICS CO
    • KUROKI TOMOHITOKOBAYASHI SHININOUE KENJI
    • B65D85/86H01L21/673H01L21/68
    • PROBLEM TO BE SOLVED: To enable pressure in a wafer case during air transportation to be restored promptly after landing by providing a bag for packaging a wafer case with semiconductor wafers housed therein, and setting in a specific range the ratio of a value in which the volume of semiconductor wafers is subtracted from the content volume of the bag and the content volume of the wafer case. SOLUTION: The wafer case 3 for a semiconductor wafer packaging body 1 is comprised of a case main body 5 and a lid body 7. A bag 4 for packaging this wafer case 3 is provided with an opening for putting in and out the wafer case 3 at its one side. In this case, regarding the size of the wafer case 3 and the bag 4, the ratio of a value in which the volume of the semiconductor is subtracted from the content volume of the bag 4 and the content volume of the wafer case 3 is set to be in a range of 1.03-1.18. By this structure, even in the case where if the atmosphere in the airplane lowers during air- transportation and thereby air in the wafer case 3 comes out of the bag 4, the pressure in the wafer case 3 is maintained on the order of 0.9 atm, so that the pressure in the water case can be restored promptly to the atmosphere after landing.