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    • 10. 发明专利
    • Resist pattern forming material
    • 电阻形成材料
    • JP2003015295A
    • 2003-01-15
    • JP2001196069
    • 2001-06-28
    • Tokyo Ohka Kogyo Co Ltd東京応化工業株式会社
    • NITTA KAZUYUKIMIMURA TAKEYOSHISHIMATANI SATOSHIOKUBO KAZUYOSHIMATSUUMI TATSUYA
    • G03F7/039G03F7/004G03F7/11H01L21/027H01L21/768
    • PROBLEM TO BE SOLVED: To provide a resist pattern forming material capable of giving a high resolution resist pattern adaptable to a fine pattern which is required when a semiconductor device is manufactured by a via first dual damascene method and producing no resist residue.
      SOLUTION: In the resist pattern forming material obtained by disposing a coating layer of a chemical amplification type positive type resist composition containing (A) a polyhydroxystyrene having acid dissociable dissolution inhibiting groups substituted for at least part of the hydrogen atoms of hydroxyl groups and (B) a compound which generates an acid when irradiated with radiation on a substrate on which a first interlayer insulation layer, an etching stopper layer and a second interlayer insulation layer have been stacked in order, the component (A) has ≤40% remaining rate of the acid dissociable dissolution inhibiting groups after a dissociation test with hydrochloric acid.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:提供一种抗蚀剂图案形成材料,其能够提供适用于当通过第一双镶嵌方法制造半导体器件并且不产生抗蚀剂残留物时所需的精细图案的高分辨率抗蚀剂图案。 解决方案:在通过设置化学放大型正型抗蚀剂组合物的涂层获得的抗蚀剂图案形成材料中,所述抗蚀剂图案形成材料包含(A)具有取代羟基的至少一部分氢原子的酸解离溶解抑制基团的聚羟基苯乙烯和(B )在依次层叠有第一层间绝缘层,蚀刻停止层和第二层间绝缘层的基板上照射辐射时产生酸的化合物,成分(A)的残留率为40% 的盐酸解离试验后的酸解离溶解抑制基团。