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1. 发明申请

WO2004074952A3 METHOD FOR AUTOMATIC CONFIGURATION OF A PROCESSING SYSTEM 审中-公开
标题翻译：一种加工系统的自动配置方法
公开(公告)号：WO2004074952A3
公开(公告)日：2005-02-24
申请号：PCT/US2004004175
申请日：2004-02-12
申请人： TOKYO ELECTRON LTD , LAM HIEU A , CHAMNESS KEVIN ANDREW , YUE HONGYU , FATKE DAVID , HARADA SATOSHI , HUME EDWARD CARL III , WILLIS JAMES EDWARD
发明人： LAM HIEU A , CHAMNESS KEVIN ANDREW , YUE HONGYU , FATKE DAVID , HARADA SATOSHI , HUME EDWARD CARL III , WILLIS JAMES EDWARD
IPC分类号： G05B19/418 , G06F19/00 , H01L21/66
CPC分类号： G05B19/41865 , G05B19/41845 , G05B2219/31334 , G05B2219/32191 , G05B2219/45031 , Y02P90/16 , Y02P90/185 , Y02P90/20 , Y02P90/22 , Y02P90/86
摘要： A method of automatically configuring an Advanced Process Control (APC) system for a semiconductor manufacturing environment in which an auto-configuration script is generated for executing an auto-configuration program. The auto-configuration script activates default values for input to the auto-configuration program. The auto-configuration script is executed to generate an enabled parameter file output from the auto-configuration program. The enabled parameter file identifies parameters for statistical process control (SPC) chart generation.
摘要翻译：一种自动配置用于半导体制造环境的高级过程控制（APC）系统的方法，其中生成用于执行自动配置程序的自动配置脚本。自动配置脚本激活自动配置程序输入的默认值。执行自动配置脚本以生成从自动配置程序输出的启用参数文件。启用的参数文件识别统计过程控制（SPC）图生成的参数。

2. 发明申请

WO2004109410A3 METHOD FOR DATA PRE-POPULATION 审中-公开
标题翻译：数据预处理方法
公开(公告)号：WO2004109410A3
公开(公告)日：2005-11-10
申请号：PCT/US2004014756
申请日：2004-05-11
申请人： TOKYO ELECTRON LTD , WILLIS JAMES E , HARADA SATOSHI , HUME EDWARD C III , KLEKOTKA JAMES E
发明人： WILLIS JAMES E , HARADA SATOSHI , HUME EDWARD C III , KLEKOTKA JAMES E
IPC分类号： G05B9/02 , G05B11/01 , G05B19/00 , G05B19/418
CPC分类号： G05B19/4183 , G05B2219/31288 , Y02P90/10 , Y02P90/14
摘要： A method of using an APC system to perform a data pre-population function is described in which the APC system is coupled to a processing element. The APC system comprises an APC computer including operational software, a database coupled to the APC computer, and a GUI, and the processing element comprises at least one of a tool, a processing module, and a sensor. When the APC system operates, the APC system collects data from the processing element and stores the collected data in the database. When an APC malfunction occurs, a data recovery (data pre-population) can be performed. When some of the historical data is missing, a data recovery (data pre-population) can be performed. When an APC system is coupled to a new tool having some historical data, a data recovery (data pre-population) can be performed.
摘要翻译：描述了使用APC系统执行数据预先插入功能的方法，其中APC系统耦合到处理元件。 APC系统包括APC计算机，其包括操作软件，耦合到APC计算机的数据库和GUI，并且处理元件包括工具，处理模块和传感器中的至少一个。当APC系统运行时，APC系统从处理元件收集数据，并将收集的数据存储在数据库中。当发生APC故障时，可以执行数据恢复（数据预填充）。当某些历史数据丢失时，可以执行数据恢复（数据预先填充）。当APC系统耦合到具有一些历史数据的新工具时，可以执行数据恢复（数据预先填充）。

3. 发明申请

WO2005027186A2 EXPANSION-TYPE REFLECTION MIRROR 审中-公开
标题翻译：扩展型反射镜
公开(公告)号：WO2005027186A2
公开(公告)日：2005-03-24
申请号：PCT/JP2004013488
申请日：2004-09-09
申请人： NIPPON TELEGRAPH & TELEPHONE , HARADA SATOSHI , MEGURO AKIRA , ISHIKAWA HIRONORI , OZAWA SATORU
发明人： HARADA SATOSHI , MEGURO AKIRA , ISHIKAWA HIRONORI , OZAWA SATORU
IPC分类号： G02B7/182 , G02B7/183 , H01L20060101 , H01Q1/28 , H01Q15/16 , H01Q15/20 , H01L
CPC分类号： G02B7/183 , H01Q1/288 , H01Q15/162
摘要： An expansion-type reflection mirror has connecting members that are installed between extendable members constructing an expansion truss. Each connection member connects a portion corresponding to an antinode of and a portion corresponding to a node of a bucking mode occurring in extendable members when tensile force is applied to surface cable. Further, the surface cable is composed of inner surface cable and outer periphery surface cable that is joined to the outer periphery of the inner surface cable. Cable having high rigidity and whose length varies a little when tensile force varies is used as the inner surface cable. As the outer periphery surface cable, cable having lower rigidity than the inner surface cable and whose tensile force varies less than the inner surface cable when the length varies is used. Tensile force is applied from the expansion truss to the inner surface cable through the outer periphery surface cable to form a predetermined mirror surface shape.
摘要翻译：扩展型反射镜具有安装在构成展开桁架的可伸展构件之间的连接构件。当拉力施加到表面电缆时，每个连接构件连接对应于可伸展构件中发生的弯曲模式的节点的波腹和对应于该节点的部分。此外，表面电缆由内表面电缆和与内表面电缆的外周接合的外周表面电缆构成。作为内表面电缆，使用刚性高，拉伸力变化时长度变化少的电缆。作为外周表面电缆，使用具有比内表面电缆更低的刚性并且当长度变化时其张力变化小于内表面电缆的电缆。从膨胀桁架通过外周表面缆线向内表面缆线施加拉伸力以形成预定的镜面形状。

4. 发明专利

AU2003221362A1 PLASMA PROCESSING METHOD, SEASONING END DETECTION METHOD, AND PLASMA PROCESSING DEVICE 未知
公开(公告)号：AU2003221362A1
公开(公告)日：2003-09-22
申请号：AU2003221362
申请日：2003-03-12
申请人： TOKYO ELECTRON LTD
发明人： TAKAYAMA NAOKI , OH HIN , HARADA SATOSHI
IPC分类号： H05H1/00 , H01L21/00 , H01L21/3065

5. 发明专利

AU2003235901A1 METHOD OF PREDICTING PROCESSING DEVICE CONDITION OR PROCESSED RESULT 未知
公开(公告)号：AU2003235901A1
公开(公告)日：2003-12-02
申请号：AU2003235901
申请日：2003-05-08
申请人： TOKYO ELECTRON LTD
发明人： SAKANO SHINJI , HARADA SATOSHI
IPC分类号： G05B13/04 , G05B23/02 , G06F19/00 , H01L21/3065 , H01L21/66
摘要： A method for predicting a processing result includes a process of performing a principal component analysis on a plurality of detected data obtained during a first standard processing, to construct a principal component analysis model; a process of obtaining residuals of the principal component analysis model as first residuals; a process of performing a second standard processing; and a process of obtaining a plurality of detected data from a plurality of detectors during the second standard processing. And, the detected data obtained during the second standard processing are applied to the principal component analysis model, to obtain second residuals. The method further includes a process of weighting the second residuals based on weighting references, and constructing a new multivariate analysis model with use of the weighted second residuals; and a process of predicting a processing result of the second standard processing with use of the multivariate analysis model.

6. 发明专利

JP2004039805A Method of predicting process and treatment apparatus 有权
公开(公告)号：JP2004039805A
公开(公告)日：2004-02-05
申请号：JP2002193624
申请日：2002-07-02
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： HARADA SATOSHI
IPC分类号： H01L21/3065 , G05B23/02
摘要： PROBLEM TO BE SOLVED: To solve the problem that, since a predicted value by a model formula created before cleaning largely deviates from a set value in a plasma treatment apparatus 1 after cleaning, process parameters of the plasma treatment apparatus 1 after cleaning cannot be predicated using the model formula created before cleaning as it is. SOLUTION: A method of predicting a process comprises steps of creating a principal component analysis model, by carrying out the principal component analysis of a plurality of detection data obtained from standard treatments conducted on a plurality of wafers using the plasma treatment apparatus 1 before cleaning and finding a residual as a first residual; finding a second residual by the principal component analysis model using a plurality of detection data obtained from the standard treatments conducted on the wafers using the plasma treatment apparatus 1 after cleaning; selecting the detection data wherein a variance in the second residual is small, with maximum and minimum values of a variance of the first residual as references; and creating a multiple regression model using residuals of a plurality of selected detection data. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2003264179A METHOD FOR DETECTING END OF SEASONING AND PLASMA TREATMENT METHOD 审中-公开
公开(公告)号：JP2003264179A
公开(公告)日：2003-09-19
申请号：JP2002066369
申请日：2002-03-12
申请人： TOKYO ELECTRON LTD
发明人： TAKAYAMA NAOKI , O TAKESHI , HARADA SATOSHI
IPC分类号： H05H1/00 , H01L21/00 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To solve the problem of prior art analytic data that it is difficult to ascertain whether a variation becoming the decision criterion of the end of seasoning is a variation due to seasoning, i.e., a variation based on the state change in a treatment container, or a variation based on the temperature variation between dummy wafers and thereby it is difficult to make a decision whether seasoning has ended or not. SOLUTION: The method for detecting the end of seasoning when seasoning is performed by supplying dummy wafers W into the treatment container 2 of a plasma treatment system 1 comprises a step for supplying the dummy wafers W into the treatment container 2, cooling the inside of the treatment container 2, and performing multivariate analysis using a plurality of data obtained when a plurality of dummy wafers W are supplied again into the treatment container 2 to formulate a formula for predicting the end of seasoning, and a step for detecting the end of seasoning when seasoning is performed based on the prediction formula. COPYRIGHT: (C)2003,JPO

8. 发明专利

JP2004047501A Method for detecting abnormality of processor 有权
公开(公告)号：JP2004047501A
公开(公告)日：2004-02-12
申请号：JP2002169465
申请日：2002-06-11
申请人： Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： SAKANO SHINJI , HARADA SATOSHI
IPC分类号： H01L21/3065
摘要： PROBLEM TO BE SOLVED: To solve the problem wherein important abnormalities cannot be detected for all wafers, because a baseline formed by the residual scores of each wafer subjected to maintenance and inspection deviates from a baseline formed by the residual scores of each wafer not being subjected to maintenance and inspection, and because it exceeds abnormality decision line and decides the process of a processor as being abnormal.
SOLUTION: The method for detecting abnormalities comprises a step for obtaining the emission intensity S of a plasma being detected for each of a plurality of wafers using an end point detector 19 which is not subjected to maintenance and inspection as first operation data; a step for determining a residual matrix by analyzing the main components of the first operation data; a step for setting the abnormality decision line L of a processor based on the square sum (residual score) of the residual components of the residual matrix; a step for obtaining the emission intensity S being detected for each wafer, using a detector subjected to maintenance and inspection as second operation data; a step for determining a residual matrix, based on the analysis of main component of the second operation data; and a step for determining a residual score by comparing the second operation data with the first operation data and selecting the operation data, having a smaller variation of residue.
COPYRIGHT: (C)2004,JPO

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