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1. 发明专利

JPH07193994A CURRENT LEAD AND CURRENT LIMITER EMPLOYING IT 失效
公开(公告)号：JPH07193994A
公开(公告)日：1995-07-28
申请号：JP34718393
申请日：1993-12-27
申请人： TOKYO ELECTRIC POWER CO , TOSHIBA CORP
发明人： HARA CHIKUSHI , NAKADE MASAHIKO , HONJO SHOICHI , KURIYAMA TORU , NAKAGOME HIDEKI , YAZAWA TAKASHI , TAZAKI KENJI , MAEDA HIDEAKI , YAMAMOTO KAZUO , ARAOKA KATSUMASA
IPC分类号： H02H9/02
摘要： PURPOSE:To provide a current lead for suppressing the intrusion of heat effectively and a current limiter employing it. CONSTITUTION:Superconducting current limiting elements 7a, 7b, 7c are set in an inner tank 2 so that they are cooled by liquid helium H. Bushings 9, 11 penetrate the wall of the inner tank 2 and the wall of an outer tank 3. A current path for connecting the superconducting current limiting element in series with the electric circuit is established through the bushings 9, 11 and a current lead 12 having a turnup part 15 between the bushings 9, 11 is provided with an oxide superconductor 13 being employed between the turnup part 15 and the bushing 9 while a copper material being employed between the turnup part 15 and the bushing 11. A refrigerator 16 cools the turnup part 15 of each current lead 12 at a temperature determined by the critical temperature of the oxide superconductor 13.

2. 发明专利

JPH09252147A CURRENT LIMITER 失效
公开(公告)号：JPH09252147A
公开(公告)日：1997-09-22
申请号：JP5796196
申请日：1996-03-14
申请人： TOKYO ELECTRIC POWER CO , TOSHIBA CORP
发明人： HARA CHIKUSHI , OKUMA TAKESHI , NAKADE MASAHIKO , TAZAKI KENJI , YAZAWA TAKASHI , NOMURA SHIYUNJI , MAEDA HIDEAKI , TSURUNAGA KAZUYUKI
IPC分类号： H01L39/20 , H01F6/06 , H02H9/02
摘要： PROBLEM TO BE SOLVED: To reduce the Joule's heat at a current limiting operation and a-c loss at a usual operation by covering superconductor wires of a superconductor coil with a heat barrier layer. SOLUTION: A superconductor wire 25 is wound round a first bobbin 23 and supported with spiral grooves 24 cut on the outside of the bobbin, and a superconductor wire 29n is wound round a second bobbin 27 and supported with spiral grooves 28 cut on the outside of the bobbin. The wires 25 and 29 are covered with heat barrier layers 31 having equal characteristics such as critical temp. and critical current and 20μm or more thick. The barrier layers 31 are formed by coating and half hardening an org. resin having a higher thermal diffusion resistance at very low temp., e.g. polyester resin or epoxy resin on the outer surface of the superconductor wires as thick as specified, and the wires in this condition are wound round the bobbins and the resin is hardened.

3. 发明专利

JPH0917627A BOBBIN FOR SUPERCONDUCTING COIL 失效
公开(公告)号：JPH0917627A
公开(公告)日：1997-01-17
申请号：JP10226396
申请日：1996-04-24
申请人： TOKYO ELECTRIC POWER CO , TOSHIBA CORP , TOYO BOSEKI
发明人： HARA CHIKUSHI , NAKADE MASAHIKO , OKUMA TAKESHI , TAZAKI KENJI , YAZAWA TAKASHI , MAEDA HIDEAKI , YONEDA ERIKO , NOMURA SHIYUNJI , KASHIMA TOSHIHIRO , YAMANAKA ATSUHIKO
IPC分类号： H01F5/02 , H01F6/06
摘要： PROBLEM TO BE SOLVED: To restrain generation of quench by constituting a bobbin of fiber reinforced plastic which contains polyethylene fiber exhibiting a negative thermal expansion coefficient and reinforced material whose modulus of elasticity is larger than that of the polyethylene fiber, and orientating the polyethylene fibers in a specific angle range, with respect to the shaft axis line of the bobbin. SOLUTION: This bobbin for a superconducting coil is constituted of matrix resin, polyethylene fiber exhibiting a negative thermal expansion coefficient in the fiber direction, and reinforced material whose modulus of elasticity is larger than that of the polyethylene fiber. The polyethylene fiber is orientated in the range of ±35-90 degrees with respect to the shaft axis line of the bobbin, and has characteristics that the strength is at least 1.32GPa and the modulus of elasticity is at least 23.9GPa. The reinforced material is alumina fiber and has characteristics that the strength is at least 1200Mpa, and the modulus of elasticity is at least 120GPa.

4. 发明专利

JPH08153741A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08153741A
公开(公告)日：1996-06-11
申请号：JP29523394
申请日：1994-11-29
申请人： TOSHIBA CORP
发明人： OOSHIMA YUMIKO , NAKAZAWA TAKAHITO , MAEDA HIDEAKI , IWASAKI HIROSHI
IPC分类号： H01L21/60 , H01L21/56 , H01L23/12
摘要： PURPOSE: To prevent unevenness of the finish of a package or nonconformity of its outer appearance regardless of the diameter of a needle by contacting the edge surface of an auxiliary board with the edge surface of a wiring board closely so that the upper surface of a resin applying auxiliary board is in parallel with the major surface of the wiring board. CONSTITUTION: Bump electrodes 2a of a chip 2 are arranged so that those electrodes face with the corresponding connecting pads of the board 1 and the tips of the bump electrodes 2a are pressed into the connecting pads to be embedded and the silver paste on the connecting pads is cured thermally to bond the two. An auxiliary board 11 that is for the help of applying the resin is provided and the edge surface of the auxiliary board 11 is touched with the edge surface of the board 1 closely so that the upper surface of the auxiliary board 11 is in parallel with the major surface of the board 1. The resin 5a is applied on the surface that includes the part the auxiliary board 11 contacts the board 1 and the opening part between the chip 2 and the board 1 is filled with the resin 5a. Then the auxiliary board 11 is removed from the board 1.

5. 发明专利

JPH07273244A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH07273244A
公开(公告)日：1995-10-20
申请号：JP6049394
申请日：1994-03-30
申请人： TOSHIBA CORP
发明人： MAEDA HIDEAKI , IWASAKI HIROSHI
IPC分类号： H01L21/60 , H01L23/12
摘要： PURPOSE:To provide a semiconductor package which is low in cost, compact in structure, and high in reliability. CONSTITUTION:A semiconductor package is equipped with a board 6 provided with a wiring circuit 6a which includes a connector 6b formed on its primary surface, a semiconductor chip 7 mounted on the primary surface of the board 7 in a face-down manner, a resin layer 10 filled between the semiconductor chip 7 and the board 6, and a plane-type outer connection terminal 9 electrically connected to the semiconductor element 7 and, if necessary, led out and exposed on the other primary surface of the board 7 through a blind viahole connection, wherein the wiring circuit 6a which includes the connector 6b formed on the primary surface of the board 6 is formed nearly flush with the surface of the board 6.

6. 发明专利

JPH01207903A SHEET COIL 失效
公开(公告)号：JPH01207903A
公开(公告)日：1989-08-21
申请号：JP3186288
申请日：1988-02-16
申请人： TOSHIBA CORP
发明人： URATA MASAMI , MAEDA HIDEAKI , YASUDA SATOSHI
IPC分类号： H01F5/00
摘要： PURPOSE:To enable improved characteristics to be obtained and workability on assembly to be improved by forming each of wound electrically-conductive wire in a sheet shape and by fixing it with adhesive. CONSTITUTION:With a sheet-shaped coil 2b formed in rectangular form, each electrically-conductive wire is forcedly adhered by epoxy resin, etc. Which is adhered to the minimum. The thickness of this electrically-conductive wire is limited to that which is allowed to change freely in horizontal direction. This change has a mechanical plasticity and hence magnetic device can be assembled without applying any reinforced pressure by means of a press, etc. Thus, nearly no distortion is generated in coil itself. It allows a coil to be mounted easily regardless of complex configuration and assembly to be made easily.

7. 发明专利

JPS63164302A SUPERCONDUCTING MAGNET 失效
公开(公告)号：JPS63164302A
公开(公告)日：1988-07-07
申请号：JP30862686
申请日：1986-12-26
申请人： TOSHIBA CORP
发明人： URATA MASAMI , MAEDA HIDEAKI , FUKUSHIMA EIJI , KOIZUMI MISAO
IPC分类号： G01R33/20 , A61B5/055 , A61B10/00 , H01F6/06
摘要： PURPOSE:To obtain the superconducting magnet with which a uniform magnetic field can be generated by a method wherein a spool, formed with the cast material of iron alloy containing Ni, Mn and Mo of the specific composition, is used. CONSTITUTION:A spool 1 is formed by forging the metal material composed in weight ratio of Cr of 12%, Ni of 12%, Mn of 10%, Mo of 5% and the remainder of Fe. Grooves 4 and 5 to be used to attach a main superconducting coil 2 and a magnetic field correcting superconducting coil 3 are formed respectively on the outer circumferential surface. The relative permeability of the spool 1 formed with the material of the above-mentioned composition is 1.003 at the temperature of liquid helium, and no hysteresis is shown therein. The loss of eddy current generating on the spool, when the current flowing on the superconducting coil is increased or decreased, can be reduced and as a result, the quantity of evaporation of the liquid helium can also be reduced.

8. 发明专利

JPS62285405A SUPERCONDUCTING COIL 失效
公开(公告)号：JPS62285405A
公开(公告)日：1987-12-11
申请号：JP12808486
申请日：1986-06-04
申请人： TOSHIBA CORP
发明人： URATA MASAMI , MAEDA HIDEAKI
IPC分类号： G01R33/381 , A61B5/055 , A61B10/00 , H01F6/06
摘要： PURPOSE:To prevent substantially the occurrence of quenching due to the move of a conductor by varying the tension of a winding in the axial direction so that the tension of the winding in the vicinity of a 'flange' of a coil be stronger than that in the vicinity of the center of the coil when a conducting wire material is wound on a coil bobbin. CONSTITUTION:A change in the form of a bobbin in the vicinity of the center thereof can be reduced when a winding tension at positions in the vicinity of the center in the axial direction/of a coil is weakened. On the other hand, the change in the form of the bobbin in the vicinity of the 'flange' of the bobbin is very much smaller than that in the vicinity of the center and a stress applied on a conductor near the 'flange' is increased by the smaller change in the form, when winding is made with a strong winding tension at positions near the 'flange', i.e. at positions in the end portions in the axial direction of the coil. Therefore, the movement of the conductor in the vicinity of the 'flange' is prevented substantially, and consequently qeunching due to the movement of the conductor is prevented substantially from occurrence. j.

9. 发明专利

JPS62108507A SUPERCONDUCTING COIL 失效
公开(公告)号：JPS62108507A
公开(公告)日：1987-05-19
申请号：JP24697685
申请日：1985-11-06
申请人： TOSHIBA CORP
发明人： URATA MASAMI , MAEDA HIDEAKI
IPC分类号： H01F6/06
摘要： PURPOSE:To increase the effective inner diameter of a superconducting coil by winding a superconducting lead by applying a tension which is large at the inside of the coil and small at the outside of the coil to the lead at winding time to reduce the thickness of a coil spool. CONSTITUTION:When a winding tension is varied according to the position of a layer so as to be strong at the inner layer side and weak at the outer layer side, the radial compressing force 2 applied to a winding blank becomes strong at the inner layer side and weak at the outer layer side. Accordingly, when the compressing force of each layer in case of applying an electromagnetic force generated by the energization becomes a predetermined value or higher, the wire blanks 3 or the blank 3 and the spool 1 are fixed with a predetermined value or larger compressing force. Accordingly, the blank does not move radially nor move axially by a stationary frictional force to eliminate a quench due to the movement of the blank. Thus, the compressing force applied to the coil spool 1 is reduced smaller than that of a coil wound in all layers by the tension of the innermost layer to reduce the thickness of the spool, thereby increasing the effective inner diameter.

10. 发明专利

JPH07273243A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH07273243A
公开(公告)日：1995-10-20
申请号：JP6049294
申请日：1994-03-30
申请人： TOSHIBA CORP
发明人： MAEDA HIDEAKI , IWASAKI HIROSHI
IPC分类号： H01L21/60 , H01L21/82 , H01L23/12 , H01L23/15
摘要： PURPOSE:To provide a semiconductor package which is low in cost, compact in structure, and high in reliability. CONSTITUTION:A semiconductor package is equipped with a board 7 provided with a wiring circuit 7a which includes a connector 7b formed on its primary surface, a semiconductor chip 8 mounted on the primary surface of the board 7 in a face-down manner, a resin layer 11 filled between the semiconductor chip 8 and the board 7, and a plane-type outer connection terminal 9 led out and exposed on the other primary surface of the board 7, wherein a dummy wiring pattern 7c is disposed, at least, on the peripheral edge of the primary surface of the board 7 or an inner wiring layer. The connector 7b of the board 7 and the electrode 8a of the semiconductor chip 8 are joined together by diffusion, or the plane-type outer connection terminals 9 led out and exposed on the other primary surface of the board 7 are arranged in grid at a regular pitch.

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