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1. 发明专利

JP2000204125A PHOTOSETTING RESIN COMPOSITION EXCELLENT IN HEAT RESISTANCE 失效
公开(公告)号：JP2000204125A
公开(公告)日：2000-07-25
申请号：JP349999
申请日：1999-01-08
申请人： TEIJIN SEIKI CO LTD , TAKEMOTO OIL & FAT CO LTD , SHIN NAKAMURA CHEMICAL
发明人： TAMURA JUNICHI , HAGIWARA TSUNEO , OTAKE MAKOTO , SHINODA MINORU , SUZUKI TOSHIJI , OZAKI TATSUHIKO , ISHIHAMA YASUSHI , NAKAMURA TAKAYUKI
IPC分类号： C09K21/14 , C08F2/00 , C08F2/48 , C08F220/36 , C08F290/06 , C08G18/67 , C08K5/54 , C08K7/02 , C08K7/16 , C08L33/14 , C08L75/16 , G03F7/00 , G03F7/027
摘要： PROBLEM TO BE SOLVED: To obtain a photosetting resin composition exhibiting low-viscosity liquid, excellent in handling property, capable of curing in a short photosetting time, excellent in dimensional accuracy and useful as a coating agent, etc., by adding a radically polymerizable compound other than an urethanated acrylic compound and a photopolymerization initiator to the urethanated acrylic compound. SOLUTION: This photosetting resin composition comprises (A) at least one kind of urethanated acrylic compound of the formula a-C-(R)4-a R is H or an alkyl; a is 3 or 4; A is the formula [D is CH2CH2O or the like; E is CH2CH2 O or the like; G is a diol, a triol residue; J is a divalent or trivalent hydrocarbon; L is (CH2CH2O)h (h is 1-4)]; b, c, d and f are each 0 or 1; e is 0, 1 or 2; g is 1 or 2; b+c+d is 1 to 3; etf is 1 or 2) and (B) a radically polymerizable compound other than the component A and (C) a photopolymerization initiator at (80:20) to (10:90) weight ratio of the component A to the component B.

2. 发明专利

JP2002060435A PHOTO-SETTING RESIN COMPOSITION 失效
公开(公告)号：JP2002060435A
公开(公告)日：2002-02-26
申请号：JP2000249356
申请日：2000-08-21
申请人： TEIJIN SEIKI CO LTD , TOAGOSEI CO LTD , TAKEMOTO OIL & FAT CO LTD
发明人： TAMURA JUNICHI , HAGIWARA TSUNEO , OTAKE MAKOTO , OKAZAKI EIICHI , MURAMATSU YASUNORI , SUZUKI TOSHIJI , SHINODA MINORU
IPC分类号： C07D403/14 , C08F2/50 , C08F220/34 , C08F290/06 , C08J5/00
摘要： PROBLEM TO BE SOLVED: To obtain a photo-setting resin composition which can produce a three-dimensional shaped article excellent in dimensional accuracy because of a low volumetric shrinkage factor, excellent in heat resistance because of a high heat distortion temperature, and excellent in transparency and mechanical characteristics. SOLUTION: This resin composition contains (i) at least one imidated acrylic compound represented by formula (I) (wherein R1 is an optionally substituted alicyclic, aromatic or aliphatic group and may have an ether oxygen atom; R2 is a divalent diamine residue; R3 is a divalent aminoalcohol residue; R4 is H or methyl; (m) is an integer of 1 to 6; and (n) is an integer of 1 to 5); (ii) a radical-polymerizable compound other than the imidated acrylic compound and/or a compound undergoing cationic polymerization; and (iii) a photopolymerization initiator.

3. 发明专利

JP2000094453A MOLD FOR MOLDING RESIN AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000094453A
公开(公告)日：2000-04-04
申请号：JP28476198
申请日：1998-09-22
申请人： TEIJIN SEIKI CO LTD , TEIJIN LTD
发明人： MAEDA KUNIO , ODA SANEO , OTAKE MAKOTO , HAGIWARA TSUNEO
IPC分类号： B29C33/40 , B29C45/26 , B29C67/00
摘要： PROBLEM TO BE SOLVED: To provide excellent strength and durability without damaging a mold for molding a resin at the time of taking out a molding by setting a laminating direction of resin materials in the mold obliquely or perpendicularly to a drawing direction of the molding from the mold. SOLUTION: The mold for molding a resin is manufactured by executing a photo-setting resin in a predetermined thickness on a working surface, giving an optical energy under the control of an optical computer or the like to photo- set the resin, then laminating the photo-setting resin further on the cured layer, and repeating the steps of emitting the optical energy to curing the resin. The resin is cured so that a laminating direction A of the photo-setting resin at the time of its shaping becomes perpendicular to a drawing direction B of the molding from the mold. Thus in the case of further drawing the molding from the mold in the case of opening a male mold 1 and a female mold 2 in the direction B for drawing the molding, even when an external stress of the direction B is applied to the mold an interlayer release scarcely occurs between thin layers L1, L2,..., Ln for constituting the mold to prevent a breakage of the mold and to provide excellent strength and durability.

4. 发明专利

JP2001079855A MOLD FOR PHOTO FABRICATION 失效
公开(公告)号：JP2001079855A
公开(公告)日：2001-03-27
申请号：JP25729299
申请日：1999-09-10
申请人： TEIJIN SEIKI CO LTD , TEIJIN LTD
发明人： IWASAKI KUNIO , ODA SANEO , OTAKE MAKOTO , HAGIWARA TSUNEO
IPC分类号： B29C33/40 , B29C67/00
摘要： PROBLEM TO BE SOLVED: To provide a mold for photo fabrication excellent in strength and durability. SOLUTION: In a mold for photo fabrication having a coating layer on the molding surface of the main body of the mold which is produced by a repeated process in which a photo-curable resin material is laminated and photo-cured, a material forming the coating layer penetrates to the depth of at least 500 μm from the molding surface of the main body.

5. 发明专利

JP2000143740A PHOTO-CURING RESIN COMPOSITION 失效
公开(公告)号：JP2000143740A
公开(公告)日：2000-05-26
申请号：JP31935198
申请日：1998-11-10
申请人： TEIJIN SEIKI CO LTD
发明人： TAMURA JUNICHI , HAGIWARA TSUNEO , OTAKE MAKOTO
IPC分类号： B29C67/00 , C08F2/00 , C08F2/46 , C08F2/50 , C08F220/34 , C08F220/36 , C08F222/22 , C08F290/06
摘要： PROBLEM TO BE SOLVED: To obtain the subject composition excellent in handling property, capable of curing in a short period of time, having a small volume contraction rate on curing and excellent in dimensional stability by containing an imide- modified acrylic compound, a specific polymerizable compound and a photopolymerization initiator. SOLUTION: This photo-curing resin composition contains (A) an imide- modified acrylic compound of the formula [R1 is a (substituted) alicyclic group, a (substituted) aromatic group or a (substituted) aliphatic group; R2 is an aminoalcohol residue: R3 is H or methyl; (n) is 1, 2], (B) a radically polymerizable compound and/or cationically polymerizable compound other than the component A in (80:20)-(10:90), preferably (65:35)-(25:75), more preferably (60:40)-(35:65) weight ratio of (A:B) and (C) 0.1-10 wt.%, preferably 1-5 wt.% photopolymerization initiator based on the total weight of the components A and B. By using the above composition and performing a photo three- dimensional molding, a three-dimensional molded article is obtained.

6. 发明专利

JP2000094471A METHOD FOR MOLDING RESIN 失效
公开(公告)号：JP2000094471A
公开(公告)日：2000-04-04
申请号：JP28476298
申请日：1998-09-22
申请人： TEIJIN SEIKI CO LTD , TEIJIN LTD
发明人： MAEDA KUNIO , ODA SANEO , OTAKE MAKOTO , HAGIWARA TSUNEO
IPC分类号： B29C33/38 , B29C35/08 , B29C45/00 , B29C45/26 , B29K67/00 , B29K105/24 , C08G63/66 , C08G64/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin molding which shows outstanding antistatic properties such as electrification prevention or static electricity dissipation and maintains the antistatic properties semipermanently. SOLUTION: A resin composition obtained by blending 10-200 pts.wt. antistatic polymer with 100 pts.wt. thermoplastic resin is molded using a resin mold with 0.1-0.9 W/m.K coefficient of thermal conductivity on the molding surface of the mold after filling the mold with the molten composition. The antistatic polymer has requirements such as 108-1011 Ω surface resistivity at 500 V measured voltage, 10-1000 Pa⊗s apparent melt viscosity at 260 deg.C temperature and 1000 sec-1 apparent shear rate and 0.01-1.3 times the apparent melt viscosity of the thermoplastic resin at 260 deg.C temperature and 1000 sec-1 apparent shear rate as the apparent melt viscosity under the described conditions.

7. 发明专利

JP2001342204A PHOTORESIST COMPOSITION FOR THREE-DIMENSIONAL PHOTO- FORMING 失效
公开(公告)号：JP2001342204A
公开(公告)日：2001-12-11
申请号：JP2000165685
申请日：2000-06-02
申请人： TEIJIN SEIKI CO LTD
发明人： TAMURA JUNICHI , HAGIWARA TSUNEO , OTAKE MAKOTO
IPC分类号： G03F7/027 , B29C67/00 , C08F2/50 , C08F290/06 , C08F299/00 , C08G65/26
摘要： PROBLEM TO BE SOLVED: To provide a photosetting resin composition capable of giving three- dimensional photo-molded form having an overhang part or another complex shape with ease by using only photosetting resin composition without arranging a separate support member in a molding bath nor integrally molding a supporting part in the form. SOLUTION: This photosetting resin composition for three-dimensional photo- molding is characterized by comprising (a) a polymerizable compound composed of at least one selected from radical-polymerizable compounds and cationically polymerizable compounds and (b) a photoinitiator and having 20-90 deg.C melting temperature.

8. 发明专利

JP2001310918A CURING COMPOSITION FOR PHOTOFORMING AND PRODUCT 失效
公开(公告)号：JP2001310918A
公开(公告)日：2001-11-06
申请号：JP2000126588
申请日：2000-04-26
申请人： MITSUBISHI RAYON CO , TEIJIN SEIKI CO LTD
发明人： FUKUSHIMA HIROSHI , NURISHI SEIJI , FUJIMOTO JUICHI , HAYAMA YASUSHI , TAMURA JUNICHI , HAGIWARA TSUNEO , OTAKE MAKOTO
IPC分类号： C08J5/00 , B29C67/00 , C08F2/46 , C08F290/06
摘要： PROBLEM TO BE SOLVED: To provide a curing composition for photoforming capable of forming a product excellent in transparency and in mechanical properties such as a tensile strength, and which is excellent in handling because of the liquid with a low viscosity, can be cured for a short photocuring time and excellent in dimensional accuracy because of little volumetric shrinkage when photocuring. SOLUTION: (A) component: an amide hydroxy compound, a diol, an organic diisocyanated alkylester with a hydroxy group of (meta)acrylic acid are reacted and are obtained, an urethane (meta)acrylate compound having a radical polymerizable (meta)acryloyl oxy group, an amide group and an urethane group, (B) component: a kind at least of compounds with an ethylenic unsaturated bond capable of radical polymerization at least one in the molecule, (However, the urethane (meta)acrylate compound is excepted.) and (C): a photopolymerization initiator, are contained.

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