专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2020043941A1 ELECTRICAL NODE, METHOD FOR MANUFACTURING AN ELECTRICAL NODE, ELECTRICAL NODE STRIP OR SHEET, AND MULTILAYER STRUCTURE COMPRISING THE NODE 审中-公开
公开(公告)号：WO2020043941A1
公开(公告)日：2020-03-05
申请号：PCT/FI2019/050603
申请日：2019-08-27
申请人： TACTOTEK OY
发明人： SIMULA, Tomi , BRÄYSY, Vinski , HEIKKINEN, Mikko , HINTIKKA, Juha-Matti , HARVELA, Juhani , PIRKONEN, Minna , RAAPPANA, Pasi , HEIKKILÄ, Tuomas , SÄÄSKI, Jarmo
IPC分类号： H05K1/02 , H05K1/18 , H05K1/11 , H05K1/09 , H05K3/00 , H05K3/12
摘要： An electrical node (100), a method, an electrical assembly such as a node strip or sheet, a related multilayer structure and a method of manufacture are presented. The electrical node comprises a first substrate film (10) defining a cavity, and a first material layer (30) arranged to at l east partly fill the cavity, and to embed or at l east partly cover at l east one electrical element (12) arranged into the cavity.

2. 发明申请

WO2020043939A2 INTERFACING ARRANGEMENT, METHOD FOR MANUFACTURING AN INTERFACING ARRANGEMENT, AND MULTILAYER STRUCTURE HOSTING AN INTERFACING ARRANGEMENT 审中-公开
公开(公告)号：WO2020043939A2
公开(公告)日：2020-03-05
申请号：PCT/FI2019/050601
申请日：2019-08-27
申请人： TACTOTEK OY
发明人： SIMULA, Tomi , BRÄYSY, Vinski , HEIKKINEN, Mikko , HINTIKKA, Juha-Matti , PIRKONEN, Minna , RAAPPANA, Pasi , HEIKKILÄ, Tuomas , SÄÄSKI, Jarmo , HARVELA, Juhani
IPC分类号： H05K3/28
摘要： Interface arrangement (1300, 1400, 1500, 1600, 2000), optionally consisting of or comprising an essentially electrical, or specifically, electronic node type component, for providing electrical or electromagnetic connection between an external system (46, 200) and a host structure (300) of the interface arrangement, the interface arrangement comprising a first substrate film (10) defining a cavity; a first material layer (30) arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element (12) at least partly arranged into the cavity, wherein the at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between said external system and electronics of the host structure; and a first connection element (45), preferably arranged at least partly into the cavity, and configured for connecting to the external system (46), wherein the first connection element is further at least functionally connected to the converter element. Related multilayer structure and method of manufacture are presented.

3. 发明申请

WO2014184445A1 ENABLING ARRANGEMENT FOR AN ELECTRONIC DEVICE WITH HOUSING-INTEGRATED FUNCTIONALITIES AND METHOD THEREFOR 审中-公开
标题翻译：为具有外壳集成功能的电子设备及其方法启用安装
公开(公告)号：WO2014184445A1
公开(公告)日：2014-11-20
申请号：PCT/FI2014/050370
申请日：2014-05-15
申请人： TACTOTEK OY
发明人： KERÄNEN, Antti , HARVELA, Juhani
IPC分类号： G06F1/16
CPC分类号： G06F13/40 , G06F13/385 , G06F13/4009
摘要： Electronic device 100 comprising a housing, or a 'cover', the housing material molded into a desired target shape and to at least partially embed a plurality of functional elements 102 and an enabling arrangement, optionally at least partially embedded in said housing, said enabling arrangement comprising: a first connector with a first plurality of connecting means 104 to establish a connection between the plurality of functional elements 102 and said enabling arrangement, a second connector with one or more second connecting means 112 to be connected to a host device 114 utilizing the functionalities associated with said functional elements 102, a memory for storing and retrieval of instructions, and processing means capable of transforming signals from a one known format to another predetermined format according to stored instructions. A corresponding method is presented.
摘要翻译：电子设备100包括壳体或“盖”，模制成所需目标形状的壳体材料并且至少部分地嵌入多个功能元件102和可选地至少部分地嵌入所述壳体中的使能装置，所述启用布置包括：第一连接器，具有第一多个连接装置104，以在多个功能元件102和所述启用装置之间建立连接;第二连接器，具有一个或多个第二连接装置112，以利用主机装置114连接与所述功能元件102相关联的功能，用于存储和检索指令的存储器，以及能够根据存储的指令将信号从一种已知格式转换成另一种预定格式的处理装置。提出了相应的方法。

4. 发明申请

WO2020043939A3 INTERFACING ARRANGEMENT, METHOD FOR MANUFACTURING AN INTERFACING ARRANGEMENT, AND MULTILAYER STRUCTURE HOSTING AN INTERFACING ARRANGEMENT 审中-公开
公开(公告)号：WO2020043939A3
公开(公告)日：2020-03-05
申请号：PCT/FI2019/050601
申请日：2019-08-27
申请人： TACTOTEK OY
发明人： SIMULA, Tomi , BRÄYSY, Vinski , HEIKKINEN, Mikko , HINTIKKA, Juha-Matti , PIRKONEN, Minna , RAAPPANA, Pasi , HEIKKILÄ, Tuomas , SÄÄSKI, Jarmo , HARVELA, Juhani
IPC分类号： H05K3/28 , H05K1/02 , H01R13/6591 , H05K1/14 , H01R12/52 , H01R12/71
摘要： Interface arrangement (1300, 1400, 1500, 1600, 2000), optionally consisting of or comprising an essentially electrical, or specifically, electronic node type component, for providing electrical or electromagnetic connection between an external system (46, 200) and a host structure (300) of the interface arrangement, the interface arrangement comprising a first substrate film (10) defining a cavity; a first material layer (30) arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element (12) at least partly arranged into the cavity, wherein the at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between said external system and electronics of the host structure; and a first connection element (45), preferably arranged at least partly into the cavity, and configured for connecting to the external system (46), wherein the first connection element is further at least functionally connected to the converter element. Related multilayer structure and method of manufacture are presented.

6. 发明公开

EP3832473A1 ENABLING ARRANGEMENT FOR AN ELECTRONIC DEVICE WITH HOUSING-INTEGRATED FUNCTIONALITIES AND METHOD THEREFOR 审中-公开
公开(公告)号：EP3832473A1
公开(公告)日：2021-06-09
申请号：EP21154316.0
申请日：2014-05-15
申请人： TactoTek Oy
发明人： KERÄNEN, Antti , HARVELA, Juhani
IPC分类号： G06F13/38 , G06F13/40 , H01Q1/24
摘要： Electronic device (100) comprising a housing, or a 'cover', the housing material molded into a desired target shape and to at least partially embed a plurality of functional elements (102) and an enabling arrangement, optionally at least partially embedded in said housing, said enabling arrangement comprising: a first connector with a first plurality of connecting means (104) to establish a connection between the plurality of functional elements (102) and said enabling arrangement, a second connector with one or more second connecting means (112) to be connected to a host device (114) utilizing the functionalities associated with said functional elements (102), a memory for storing and retrieval of instructions, and processing means capable of transforming signals from a one known format to another predetermined format according to stored instructions. A corresponding method is presented.

8. 发明公开

EP2997437A1 ENABLING ARRANGEMENT FOR AN ELECTRONIC DEVICE WITH HOUSING-INTEGRATED FUNCTIONALITIES AND METHOD THEREFOR 无效转让
标题翻译：激活装置与外壳一体功能和方法及其电子设备
公开(公告)号：EP2997437A1
公开(公告)日：2016-03-23
申请号：EP14797889.4
申请日：2014-05-15
申请人： TactoTek Oy
发明人： KERÄNEN, Antti , HARVELA, Juhani
IPC分类号： G06F1/16
CPC分类号： G06F13/40 , G06F13/385 , G06F13/4009
摘要： Electronic device 100 comprising a housing, or a 'cover', the housing material molded into a desired target shape and to at least partially embed a plurality of functional elements 102 and an enabling arrangement, optionally at least partially embedded in said housing, said enabling arrangement comprising: a first connector with a first plurality of connecting means 104 to establish a connection between the plurality of functional elements 102 and said enabling arrangement, a second connector with one or more second connecting means 112 to be connected to a host device 114 utilizing the functionalities associated with said functional elements 102, a memory for storing and retrieval of instructions, and processing means capable of transforming signals from a one known format to another predetermined format according to stored instructions. A corresponding method is presented.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式