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1. 发明授权

US08213182B2 Housing case for housing electronic circuit board, and electronic apparatus 有权
标题翻译：电子电路板住宅外壳和电子设备
公开(公告)号：US08213182B2
公开(公告)日：2012-07-03
申请号：US12616971
申请日：2009-11-12
申请人： Syuzo Aoki , Meisou Chin
发明人： Syuzo Aoki , Meisou Chin
IPC分类号： H05K5/00
CPC分类号： H05K5/0269
摘要： A housing case housing an electronic circuit board, includes: a lower case portion which internally houses a circuit board for mounting electronic components; and an upper case portion which is externally fitted to the lower case portion to form a box-like member. Each of the lower case portion and the upper case portion includes a planar portion, and sidewall portions which stand from the peripheral edge of the planar portion. The planar portion and the sidewall portions are formed by using a plate-like member made of a metal material. Engaging projections which are outwardly projected are disposed on the sidewall portions of the lower case portion. Engaging holes which are passed through the sidewall portions of the upper case portion are disposed in the sidewall portions, in positions corresponding to the engaging projections of the lower case portion. The upper case portion is externally fitted to the lower case portion, and the engaging projections are engaged with the engaging holes, whereby the lower case portion and the upper case portion are fixed to each other.
摘要翻译：一种容纳电子电路板的外壳，包括：内壳体，用于安装用于安装电子部件的电路板; 以及外壳部分，其外部安装到下壳体部分以形成盒状构件。下壳体部分和上壳体部分中的每一个包括平面部分和从平面部分的周缘竖立的侧壁部分。平面部分和侧壁部分通过使用由金属材料制成的板状构件形成。向外突出的接合突起设置在下壳体部分的侧壁部分上。穿过上壳体部分的侧壁部分的接合孔设置在与下壳体部分的接合突起相对应的位置的侧壁部分中。上壳体部分外部装配到下壳体部分，并且接合突起与接合孔接合，由此下壳体部分和上壳体部分彼此固定。

2. 发明申请

US20100265675A1 HOUSING CASE FOR HOUSING ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC APPARATUS 有权
标题翻译：房屋电子电路板壳体和电子设备
公开(公告)号：US20100265675A1
公开(公告)日：2010-10-21
申请号：US12616971
申请日：2009-11-12
申请人： Syuzo Aoki , Meisou Chin
发明人： Syuzo Aoki , Meisou Chin
IPC分类号： H05K5/00
CPC分类号： H05K5/0269
摘要： A housing case housing an electronic circuit board, includes: a lower case portion which internally houses a circuit board for mounting electronic components; and an upper case portion which is externally fitted to the lower case portion to form a box-like member. Each of the lower case portion and the upper case portion includes a planar portion, and sidewall portions which stand from the peripheral edge of the planar portion. The planar portion and the sidewall portions are formed by using a plate-like member made of a metal material. Engaging projections which are outwardly projected are disposed on the sidewall portions of the lower case portion. Engaging holes which are passed through the sidewall portions of the upper case portion are disposed in the sidewall portions, in positions corresponding to the engaging projections of the lower case portion. The upper case portion is externally fitted to the lower case portion, and the engaging projections are engaged with the engaging holes, whereby the lower case portion and the upper case portion are fixed to each other.
摘要翻译：一种容纳电子电路板的外壳，包括：内壳体，用于安装用于安装电子部件的电路板; 以及外壳部分，其外部安装到下壳体部分以形成盒状构件。下壳体部分和上壳体部分中的每一个包括平面部分和从平面部分的周缘竖立的侧壁部分。平面部分和侧壁部分通过使用由金属材料制成的板状构件形成。向外突出的接合突起设置在下壳体部分的侧壁部分上。穿过上壳体部分的侧壁部分的接合孔设置在与下壳体部分的接合突起相对应的位置的侧壁部分中。上壳体部分外部装配到下壳体部分，并且接合突起与接合孔接合，由此下壳体部分和上壳体部分彼此固定。

3. 发明申请

US20110127013A1 HEAT-RADIATING COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：热释放元件及其制造方法
公开(公告)号：US20110127013A1
公开(公告)日：2011-06-02
申请号：US12951357
申请日：2010-11-22
申请人： Kenji KAWAMURA , Syuzo Aoki , Atsushi Shimazaki
发明人： Kenji KAWAMURA , Syuzo Aoki , Atsushi Shimazaki
IPC分类号： F28D15/04 , B21D53/02
CPC分类号： H01L23/427 , B22F7/08 , C25D15/02 , F28D15/0233 , F28D15/046 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A heat-radiating component includes a wick layer formed on an inner wall of a hermetically sealed container made of metal and a working fluid encapsulated in the hermetically sealed container. In the wick layer, micro carbon fiber is mixed into metal powder. In one aspect, the wick layer is a structure combined by a first wick and a second wick, the first wick being formed of sintered metal powder, and the second wick being a plating layer into which micro carbon fiber is mixed so as to partially fill air space inside the first wick while covering a surface of the first wick. The first wick is preferably a body sintered copper powder, and the second wick is preferably made of a copper plating layer into which carbon nanotube or carbon nanofiber is mixed.
摘要翻译：散热部件包括形成在由金属制成的气密密封容器的内壁上的芯吸层和密封在密封容器中的工作流体。在芯层中，将微碳纤维混合成金属粉末。一方面，芯层是由第一芯和第二芯组合的结构，第一芯由烧结金属粉末形成，第二芯为镀层，微碳纤维混入其中以部分填充第一个灯芯内的空气空间，同时覆盖第一个灯芯的表面。第一芯体优选为主体烧结铜粉末，第二芯线优选由碳纳米管或碳纳米纤维混合在其中的铜镀层构成。

4. 发明申请

US20120216997A1 COMPOSITE PLATING LIQUID 有权
标题翻译：复合镀液
公开(公告)号：US20120216997A1
公开(公告)日：2012-08-30
申请号：US13403331
申请日：2012-02-23
申请人： Yoriyuki Suwa , Kenji Kawamura , Syuzo Aoki , Masao Nakazawa , Susumu Arai
发明人： Yoriyuki Suwa , Kenji Kawamura , Syuzo Aoki , Masao Nakazawa , Susumu Arai
IPC分类号： F28F7/00 , C25D15/00
CPC分类号： C25D15/00 , C25D3/02 , C25D3/12
摘要： In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method.
摘要翻译：在一个实施例中，提供了复合电镀液。复合电镀液包括：电镀金属盐; 选自碱金属和碱土金属的至少一种元素的硫酸盐; 硼酸碳纳米管; 和分散剂。此外，提供了使用复合电镀液对构件进行电镀的电镀方法，以及通过电镀法形成的复合镀膜。

5. 发明申请

US20060268524A1 SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE HEAT RADIATION PLATE 失效
标题翻译：半导体模块和半导体模块热辐射板
公开(公告)号：US20060268524A1
公开(公告)日：2006-11-30
申请号：US11420583
申请日：2006-05-26
申请人： Sumio Uehara , Syuzo Aoki
发明人： Sumio Uehara , Syuzo Aoki
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , G11C5/04 , G11C5/143 , H01L23/3672 , H01L2023/405 , H01L2023/4056 , H01L2023/4062 , H01L2924/0002 , H05K1/181 , H01L2924/00
摘要： In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates 12a, 12b are fitted is formed in the circuit board 11, and a housing recess portion 18 in which the semiconductor devices 11 are housed is provided to both heat radiation plates 12a, 12b fitted to both surfaces of the circuit board 11 respectively and a fitting edge portion 25 is provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing means 20 for fixing both heat radiation plates 12a, 12b to the circuit board 11 by caulking to align with the fitting hole is provided to fitting edge portions 25 integrally with the heat radiation plates 12a, 12b.
摘要翻译：在其中半导体器件17安装在电路板11的两个表面上的半导体模块10中，并且散热板12a，12b设置在电路板的两个表面以覆盖半导体器件，在电路板11中形成有散热板12a，12b，并且在两个安装有半导体装置11的两个表面上的两个散热板12a，12b上设置容纳有半导体装置11的容纳凹部18 电路板11和配合边缘部分25设置在与形成有嵌合孔的位置重叠的两个散热板的位置上，还有一个用于固定两个散热板12a，12的固定装置20 b通过铆接与配合孔对准的电路板11设置成与散热板12a，12b一体地配合到边缘部分25。

6. 发明授权

US09101981B2 Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating component 有权
标题翻译：制造金属复合材料的方法，金属复合材料，制造散热部件的方法和散热部件
公开(公告)号：US09101981B2
公开(公告)日：2015-08-11
申请号：US13315546
申请日：2011-12-09
申请人： Syuzo Aoki , Takuya Oda , Takuya Kurosawa , Shoji Koizumi , Hidekazu Takizawa , Yutaka Komatsu , Shinichi Anzawa
发明人： Syuzo Aoki , Takuya Oda , Takuya Kurosawa , Shoji Koizumi , Hidekazu Takizawa , Yutaka Komatsu , Shinichi Anzawa
IPC分类号： B32B9/00 , B22F7/08 , C01B31/02 , C22C1/04 , C22C1/10 , C22C26/00 , F28F21/02 , F28F21/08 , F28D15/04 , C01B31/04
CPC分类号： C09K5/14 , B22F3/10 , B22F7/08 , B22F9/04 , C01B32/158 , C01B32/182 , C01B2202/00 , C22C1/0425 , C22C1/1084 , C22C26/00 , F28D15/046 , F28F21/02 , F28F21/08 , F28F2245/02 , F28F2255/18 , H01L2924/0002 , Y02P20/124 , Y10T428/25 , Y10T428/256 , Y10T428/30 , H01L2924/00
摘要： A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.
摘要翻译：制造金属复合材料的方法包括以能够粉碎碳材料的强度对碳材料和金属粉末施加机械冲击力，从而将碳材料粘附到金属粉末的表面。

7. 发明申请

US20120064361A1 HEAT RADIATING COMPONENT AND METHOD OF PRODUCING SAME 有权
标题翻译：热辐射元件及其制造方法
公开(公告)号：US20120064361A1
公开(公告)日：2012-03-15
申请号：US13228992
申请日：2011-09-09
申请人： Yoriyuki SUWA , Kenji Kawamura , Syuzo Aoki , Masao Nakazawa
发明人： Yoriyuki SUWA , Kenji Kawamura , Syuzo Aoki , Masao Nakazawa
IPC分类号： B32B3/26 , B05D1/36 , B32B15/00 , B05D5/00 , B82Y40/00 , B82Y30/00
CPC分类号： H01L23/373 , B32B15/01 , B82Y30/00 , C23C28/023 , H01L23/3733 , H01L23/3736 , H01L2924/0002 , Y10T428/12389 , H01L2924/00
摘要： A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal. The second plating layer is formed on the first plating layer to cover surfaces of the protruding parts and the surface of the second metal without filling spaces between the protruding parts.
摘要翻译：散热部件包括：基体，包括第一金属，形成在基底上的第一镀层，并且包括分散在第二金属中的第二金属和碳材料结构;以及形成在第一镀层上的第二镀层。第一镀层包括作为从第二金属的表面突出的碳材料结构的部分的突出部。第二镀层形成在第一镀层上，以覆盖突出部分的表面和第二金属的表面，而不会在突出部分之间填充空间。

8. 发明授权

US09476138B2 Composite plating liquid 有权
标题翻译：复合电镀液
公开(公告)号：US09476138B2
公开(公告)日：2016-10-25
申请号：US13403331
申请日：2012-02-23
申请人： Yoriyuki Suwa , Kenji Kawamura , Syuzo Aoki , Masao Nakazawa , Susumu Arai
发明人： Yoriyuki Suwa , Kenji Kawamura , Syuzo Aoki , Masao Nakazawa , Susumu Arai
IPC分类号： F28F13/18 , C25D15/00 , C25D3/02 , C25D3/12 , F28F7/00
CPC分类号： C25D15/00 , C25D3/02 , C25D3/12
摘要： In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method.
摘要翻译：在一个实施例中，提供了复合电镀液。复合电镀液包括：电镀金属盐; 选自碱金属和碱土金属的至少一种元素的硫酸盐; 硼酸碳纳米管; 和分散剂。此外，提供了使用复合电镀液对构件进行电镀的电镀方法，以及通过电镀法形成的复合镀膜。

9. 发明授权

US09136200B2 Heat radiating component and method of producing same 有权
标题翻译：散热部件及其制造方法
公开(公告)号：US09136200B2
公开(公告)日：2015-09-15
申请号：US13228992
申请日：2011-09-09
申请人： Yoriyuki Suwa , Kenji Kawamura , Syuzo Aoki , Masao Nakazawa
发明人： Yoriyuki Suwa , Kenji Kawamura , Syuzo Aoki , Masao Nakazawa
IPC分类号： B32B15/00 , H01L23/00 , H01L23/373 , B32B15/01 , B82Y30/00 , C23C28/02 , C23C28/00
CPC分类号： H01L23/373 , B32B15/01 , B82Y30/00 , C23C28/023 , H01L23/3733 , H01L23/3736 , H01L2924/0002 , Y10T428/12389 , H01L2924/00
摘要： A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal. The second plating layer is formed on the first plating layer to cover surfaces of the protruding parts and the surface of the second metal without filling spaces between the protruding parts.
摘要翻译：散热部件包括：基体，包括第一金属，形成在基底上的第一镀层，并且包括分散在第二金属中的第二金属和碳材料结构;以及形成在第一镀层上的第二镀层。第一镀层包括作为从第二金属的表面突出的碳材料结构的部分的突出部。第二镀层形成在第一镀层上，以覆盖突出部分的表面和第二金属的表面，而不会在突出部分之间填充空间。

10. 发明授权

US07483273B2 Semiconductor module and semiconductor module heat radiation plate 失效
标题翻译：半导体模块和半导体模块散热板
公开(公告)号：US07483273B2
公开(公告)日：2009-01-27
申请号：US11420583
申请日：2006-05-26
申请人： Sumio Uehara , Syuzo Aoki
发明人： Sumio Uehara , Syuzo Aoki
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/4093 , G11C5/04 , G11C5/143 , H01L23/3672 , H01L2023/405 , H01L2023/4056 , H01L2023/4062 , H01L2924/0002 , H05K1/181 , H01L2924/00
摘要： In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates 12a, 12b are fitted is formed in the circuit board 11, and a housing recess portion 18 in which the semiconductor devices 11 are housed is provided to both heat radiation plates 12a, 12b fitted to both surfaces of the circuit board 11 respectively and a fitting edge portion 25 is provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing means 20 for fixing both heat radiation plates 12a, 12b to the circuit board 11 by caulking to align with the fitting hole is provided to fitting edge portions 25 integrally with the heat radiation plates 12a, 12b.
摘要翻译：在半导体模块10中，半导体装置17安装在电路板11的两个表面上并且散热板12a，12b设置在电路板的两个表面以覆盖半导体器件，辐射板12a，12b被装配在电路板11中，并且其中容纳有半导体器件11的容纳凹部18分别设置在安装在电路板11的两个表面上的两个散热板12a，12b上，在与形成有嵌合孔的位置重叠的两个散热板的位置设置有嵌合边缘部25，以及用于通过铆接将两个散热板12a，12b固定到电路板11的固定装置20 与散热板12a，12b一体地配合边缘部25设置有与安装孔对准的配合孔。

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