专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06370027B1 Semiconductor module and heat sink used in such module 失效
标题翻译：这种模块中使用的半导体模块和散热器
公开(公告)号：US06370027B1
公开(公告)日：2002-04-09
申请号：US09925706
申请日：2001-08-10
申请人： Shoji Koizumi , Hiroyuki Komatsu
发明人： Shoji Koizumi , Hiroyuki Komatsu
IPC分类号： H05H720
CPC分类号： H05K7/20509 , H05K1/0204 , H05K3/0061 , H05K2201/10401 , H05K2201/10598 , H05K2203/1572
摘要： A semiconductor module includes a circuit board provided with a plurality of attachment holes and semiconductor elements or semiconductor devices mounted on the circuit board and a pair of metallic plates. The circuit board is disposed, between the pair of metallic plates, in such a manner that spaces are defined between the circuit board and the pair of metallic plates for accommodating the semiconductor elements or semiconductor devices when the pair of metallic plates are attached to the circuit board. One of the metallic plates is provided at positions corresponding to the attachment holes with through holes and the other metallic plate is provided at positions corresponding to the attachment holes with tubular projections having a length larger than a sum of a thickness of the circuit board and a thickness of the one metallic plate. The tubular projections are inserted into the attachment holes and the through holes and tip ends of the tubular projections are enlarged to firmly attach the pair of metallic plates to the circuit board.
摘要翻译：半导体模块包括设置有多个安装孔的电路板和安装在电路板上的半导体元件或半导体器件以及一对金属板。电路板设置在一对金属板之间，使得当一对金属板附接到电路时，在电路板和一对金属板之间限定用于容纳半导体元件或半导体器件的空间板。金属板之一设置在与具有通孔的附接孔对应的位置处，另一个金属板设置在与安装孔相对应的位置，管状突起的长度大于电路板的厚度和一块金属板的厚度。管状突起插入到安装孔中，并且扩大了管状突起的通孔和末端，以将一对金属板牢固地连接到电路板。

2. 发明授权

US4399445A Recorder for an underwater detection system 失效
标题翻译：水下检测系统的记录仪
公开(公告)号：US4399445A
公开(公告)日：1983-08-16
申请号：US198033
申请日：1980-10-17
申请人： Yuji Sato , Shoji Koizumi
发明人： Yuji Sato , Shoji Koizumi
IPC分类号： G01D15/28 , G01S7/60 , G01D15/24
CPC分类号： G01S7/60 , G01D15/28
摘要： The present invention is directed to a recording apparatus comprising feeding and receiving means for recording paper that are positioned under a recording surface and rollers, whereby either the feeding means and/or the receiving means can be removed from or installed through the top of the recording apparatus for changing the recording paper.
摘要翻译：本发明涉及一种记录装置，包括用于记录位于记录表面下方的纸张的进给和接收装置和辊，由此可以将进给装置和/或接收装置从记录的顶部移除或安装用于更换记录纸的装置。

3. 发明授权

US09101981B2 Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating component 有权
标题翻译：制造金属复合材料的方法，金属复合材料，制造散热部件的方法和散热部件
公开(公告)号：US09101981B2
公开(公告)日：2015-08-11
申请号：US13315546
申请日：2011-12-09
申请人： Syuzo Aoki , Takuya Oda , Takuya Kurosawa , Shoji Koizumi , Hidekazu Takizawa , Yutaka Komatsu , Shinichi Anzawa
发明人： Syuzo Aoki , Takuya Oda , Takuya Kurosawa , Shoji Koizumi , Hidekazu Takizawa , Yutaka Komatsu , Shinichi Anzawa
IPC分类号： B32B9/00 , B22F7/08 , C01B31/02 , C22C1/04 , C22C1/10 , C22C26/00 , F28F21/02 , F28F21/08 , F28D15/04 , C01B31/04
CPC分类号： C09K5/14 , B22F3/10 , B22F7/08 , B22F9/04 , C01B32/158 , C01B32/182 , C01B2202/00 , C22C1/0425 , C22C1/1084 , C22C26/00 , F28D15/046 , F28F21/02 , F28F21/08 , F28F2245/02 , F28F2255/18 , H01L2924/0002 , Y02P20/124 , Y10T428/25 , Y10T428/256 , Y10T428/30 , H01L2924/00
摘要： A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.
摘要翻译：制造金属复合材料的方法包括以能够粉碎碳材料的强度对碳材料和金属粉末施加机械冲击力，从而将碳材料粘附到金属粉末的表面。

4. 发明授权

US06297961B1 Semiconductor module and heat sink used in such module 失效
标题翻译：这种模块中使用的半导体模块和散热器
公开(公告)号：US06297961B1
公开(公告)日：2001-10-02
申请号：US09438408
申请日：1999-11-12
申请人： Shoji Koizumi , Hiroyuki Komatsu
发明人： Shoji Koizumi , Hiroyuki Komatsu
IPC分类号： H05K720
CPC分类号： H05K7/20509 , H05K1/0204 , H05K3/0061 , H05K2201/10401 , H05K2201/10598 , H05K2203/1572
摘要： A semiconductor module includes a circuit board provided with a plurality of attachment holes and semiconductor elements or semiconductor devices mounted on the circuit board and a pair of metallic plates. The circuit board is disposed, between the pair of metallic plates, in such a manner that spaces are defined between the circuit board and the pair of metallic plates for accommodating the semiconductor elements or semiconductor devices when the pair of metallic plates are attached to the circuit board. One of the metallic plates is provided at positions corresponding to the attachment holes with through holes and the other metallic plate is provided at positions corresponding to the attachment holes with tubular projections having a length larger than a sum of a thickness of the circuit board and a thickness of the one metallic plate. The tubular projections are inserted into the attachment holes and the through holes and tip ends of the tubular projections are enlarged to firmly attach the pair of metallic plates to the circuit board.
摘要翻译：半导体模块包括设置有多个安装孔的电路板和安装在电路板上的半导体元件或半导体器件以及一对金属板。电路板设置在一对金属板之间，使得当一对金属板附接到电路时，在电路板和一对金属板之间限定用于容纳半导体元件或半导体器件的空间板。金属板之一设置在与具有通孔的附接孔相对应的位置处，另一个金属板设置在与安装孔相对应的位置，管状突起的长度大于电路板的厚度和一块金属板的厚度。管状突起插入到安装孔中，并且扩大了管状突起的通孔和末端，以将一对金属板牢固地连接到电路板。

5. 发明申请

US20120189839A1 METHOD OF MANUFACTURING METAL COMPOSITE MATERIAL, METAL COMPOSITE MATERIAL, METHOD OF MANUFACTURING HEAT DISSIPATING COMPONENT, AND HEAT DISSIPATING COMPONENT 有权
标题翻译：制造金属复合材料的方法，金属复合材料，制造热消散部件的方法和热消散部件
公开(公告)号：US20120189839A1
公开(公告)日：2012-07-26
申请号：US13315546
申请日：2011-12-09
申请人： Syuzo AOKI , Takuya Oda , Takuya Kurosawa , Shoji Koizumi , Hidekazu Takizawa , Yutaka Komatsu , Shinichi Anzawa
发明人： Syuzo AOKI , Takuya Oda , Takuya Kurosawa , Shoji Koizumi , Hidekazu Takizawa , Yutaka Komatsu , Shinichi Anzawa
IPC分类号： C09K5/14 , B05D3/02 , B05D7/14 , B32B5/16
CPC分类号： C09K5/14 , B22F3/10 , B22F7/08 , B22F9/04 , C01B32/158 , C01B32/182 , C01B2202/00 , C22C1/0425 , C22C1/1084 , C22C26/00 , F28D15/046 , F28F21/02 , F28F21/08 , F28F2245/02 , F28F2255/18 , H01L2924/0002 , Y02P20/124 , Y10T428/25 , Y10T428/256 , Y10T428/30 , H01L2924/00
摘要： A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.
摘要翻译：制造金属复合材料的方法包括以能够粉碎碳材料的强度对碳材料和金属粉末施加机械冲击力，从而将碳材料粘附到金属粉末的表面。

6. 发明授权

US4346391A Recorder 失效
标题翻译：录音机
公开(公告)号：US4346391A
公开(公告)日：1982-08-24
申请号：US193973
申请日：1980-10-06
申请人： Yuji Sato , Shoji Koizumi
发明人： Yuji Sato , Shoji Koizumi
IPC分类号： G01D15/00 , G01D15/06 , G01D15/28 , G01S7/60 , G01D15/34 , B65H17/02 , B65H27/00
CPC分类号： G01D15/06 , G01D15/00 , G01D15/28 , G01S7/60
摘要： The present invention is directed to a recorder having recorded paper mounted to advance from a body with a curved surface to a roller lengthwise, and with at least one recording stylus mounted to move transversally across the width of the recording paper as it moves lengthwise. Additionally, a lead piece is placed in the path of the recording stylus extending over the edge of the recording paper to smoothly lead the recording stylus into the recording paper. This lead piece is rotatably supported on the recorder, with a means for continuously biasing the lead piece in a direction to withdraw the lead piece from the path of the recording paper, along with an obstruction positioned to push the biasing means to retain the lead piece over said recording paper.
摘要翻译：本发明涉及一种具有记录纸的记录器，其具有安装成从具有弯曲表面的主体前进到长度方向的滚筒，并且至少一个记录触针安装成横向跨越记录纸宽度移动。此外，引线片放置在记录笔的路径上，延伸到记录纸的边缘上，以便将记录笔平滑地引导到记录纸中。该引导片被可旋转地支撑在记录器上，具有用于沿着从记录纸的路径退回引导片的方向连续偏置引线片的装置，以及定位成推动偏置装置以将引导片在所述记录纸上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式