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1. 发明申请

US20120141851A1 SYSTEM AND METHOD FOR ENCLOSING AN ENERGY STORAGE DEVICE 审中-公开
标题翻译：用于封装能源储存装置的系统和方法
公开(公告)号：US20120141851A1
公开(公告)日：2012-06-07
申请号：US12960732
申请日：2010-12-06
申请人： Suyu Hou , Anthony Giammarise , John Dowell , Roland Sedziol , Peter Kalish , Kristopher Frutschy , Neil Anthony Johnson , David Vanderwerker , George Hansen
发明人： Suyu Hou , Anthony Giammarise , John Dowell , Roland Sedziol , Peter Kalish , Kristopher Frutschy , Neil Anthony Johnson , David Vanderwerker , George Hansen
IPC分类号： H01M2/10
CPC分类号： H01M2/1088 , H01M2/1094 , H01M2/208 , Y10T29/4911
摘要： An enclosure for an energy storage device is presently disclosed. The enclosure includes a cell housing having a base portion and at least one side portion seamlessly extending from the base portion to define a volume and having a peripheral edge defining an aperture distal from the base portion through which an electrochemical cell may be disposed within the volume, and a cover securable to the peripheral edge of the housing, where the housing and cover are configured to house at least one electrochemical cell at an operating temperature greater than about 100 degrees Celsius. The enclosure may also include an environmental housing configured to nestingly receive the cell housing, and an insulating element disposed between the environmental housing and the cell housing. Also disclosed is a method of packaging the energy storage device utilizing the enclosure.
摘要翻译：目前公开了一种用于储能装置的外壳。所述外壳包括电池壳体，所述电池壳体具有底座部分和至少一个侧部部分，所述至少一个侧部部分从所述基部部分无缝地延伸以限定容积并且具有限定远离所述基部的孔的周边边缘，电化学电池可以通过所述基部以及可固定到壳体的周边边缘的盖子，其中壳体和盖被构造成容纳在大于约100摄氏度的工作温度下的至少一个电化学电池。外壳还可以包括被配置为嵌套地容纳电池壳体的环境壳体，以及设置在环境壳体和电池壳体之间的绝缘元件。还公开了利用外壳封装储能装置的方法。

2. 发明申请

US20120129022A1 ELECTROCHEMICAL DEVICE, METHOD, AND ASSEMBLY 审中-公开
标题翻译：电化学装置，方法和装配
公开(公告)号：US20120129022A1
公开(公告)日：2012-05-24
申请号：US13189867
申请日：2011-07-25
申请人： Peter KALISH , Kashyap Shah , Kristopher Frutschy , Stuart Towie , James Browell , Roger Bull , Ajith Kuttannair Kumar , Michael Patrick Marley , John D. Butine , Harold Alan Ellsworth , John L. Donner , Stephen Pelkowski , Owen Scott Quirion , Neil A. Johnson
发明人： Peter KALISH , Kashyap Shah , Kristopher Frutschy , Stuart Towie , James Browell , Roger Bull , Ajith Kuttannair Kumar , Michael Patrick Marley , John D. Butine , Harold Alan Ellsworth , John L. Donner , Stephen Pelkowski , Owen Scott Quirion , Neil A. Johnson
IPC分类号： H01M2/10 , H01M10/04 , H01M10/50 , H01M2/30 , H01M10/48
CPC分类号： H01M2/1077 , H01M2/1088 , H01M2/206 , H01M2/208 , H01M10/39 , H01M10/613 , H01M10/625 , H01M10/647 , H01M10/6556 , H01M10/6557 , H01M10/6567 , H01M10/658 , Y10T29/49117
摘要： An electrochemical device is disclosed that includes a plurality of cells that each include a face, wherein a terminal is disposed on the faces of each respective cell. A bus bar has a bus bar height and electrically couples the terminals from cell-to-cell within the electrochemical device. A plurality of sheets are disposed between the plurality of cells, the plurality of sheets are substantially the same height as the combined, height of each cell and bus bar.
摘要翻译：公开了一种电化学装置，其包括多个单元，每个单元包括面，其中端子设置在每个相应单元的表面上。母线具有母线高度，并将端子与电化学装置内的电池电连接。多个片材被设置在多个单元之间，多个片材与每个单元和母线的组合高度基本相同。

3. 发明授权

US08665591B2 Systems and methods to thermally manage electronic devices 有权
标题翻译：用于热管理电子设备的系统和方法
公开(公告)号：US08665591B2
公开(公告)日：2014-03-04
申请号：US12974512
申请日：2010-12-21
申请人： Richard Bourgeois , Kristopher Frutschy , Mohamed Sakami , William Waters , Mao Leng
发明人： Richard Bourgeois , Kristopher Frutschy , Mohamed Sakami , William Waters , Mao Leng
IPC分类号： H05K7/20
CPC分类号： H01M10/399 , H01M10/425 , H01M10/486 , H01M10/617 , H01M10/6563 , H01M10/6568
摘要： A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.
摘要翻译：一种用于电子设备的系统包括具有限定内部区域的一个或多个壁的壳体。出口端口流体耦合到壳体的内部区域，这允许从壳体的内部区域排出流体作为第一温度的第一流量。流体耦合到出口的合并元件将第一流与第二流合并，第二流具有小于第一温度的第二温度。

4. 发明申请

US20120155025A1 SYSTEMS AND METHODS TO THERMALLY MANAGE ELECTRONIC DEVICES 有权
标题翻译：用于热电子管理的系统和方法
公开(公告)号：US20120155025A1
公开(公告)日：2012-06-21
申请号：US12974512
申请日：2010-12-21
申请人： Richard Bourgeois , Kristopher Frutschy , Mohamed Sakami , William Waters , Mao Leng
发明人： Richard Bourgeois , Kristopher Frutschy , Mohamed Sakami , William Waters , Mao Leng
IPC分类号： H05K7/20
CPC分类号： H01M10/399 , H01M10/425 , H01M10/486 , H01M10/617 , H01M10/6563 , H01M10/6568
摘要： A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.
摘要翻译：一种用于电子设备的系统包括具有限定内部区域的一个或多个壁的壳体。出口端口流体耦合到壳体的内部区域，这允许从壳体的内部区域排出流体作为第一温度的第一流量。流体耦合到出口的合并元件将第一流与第二流合并，第二流具有小于第一温度的第二温度。

5. 发明申请

US20060060979A1 Radiant energy heating for die attach 失效
标题翻译：辐射能量加热用于芯片附着
公开(公告)号：US20060060979A1
公开(公告)日：2006-03-23
申请号：US10947515
申请日：2004-09-22
申请人： Kristopher Frutschy
发明人： Kristopher Frutschy
IPC分类号： H01L23/52
CPC分类号： H01L24/81 , H01L21/563 , H01L24/10 , H01L24/13 , H01L24/97 , H01L2224/0554 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2224/13147 , H01L2224/16 , H01L2224/7598 , H01L2224/81011 , H01L2224/81024 , H01L2224/81191 , H01L2224/81224 , H01L2224/8123 , H01L2224/81801 , H01L2224/83192 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , H01L2224/81 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described.
摘要翻译：描述了通过在芯片背面引导辐射能而基本上防止下一级封装的照射来将芯片附接到下一级封装的方法和系统。

6. 发明申请

US20070231952A1 Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method 失效
标题翻译：使用模具和衬底差分扩展的控制形成微电子封装的方法以及根据该方法形成的微电子封装
公开(公告)号：US20070231952A1
公开(公告)日：2007-10-04
申请号：US11395102
申请日：2006-03-31
申请人： Kristopher Frutschy , Sudarshan Rangaraj , Kevin George
发明人： Kristopher Frutschy , Sudarshan Rangaraj , Kevin George
IPC分类号： H01L21/00
CPC分类号： H05K3/3494 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81054 , H01L2224/81209 , H01L2224/8121 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01044 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H05K3/3436 , H05K2203/1121 , H01L2924/00 , H01L2924/3512
摘要： Method of forming a microelectronic package using control of die and substrate differential expansions. The method includes: providing a die-substrate combination including a substrate, a die disposed on the substrate, and plurality of solder paste disposed between the die and the substrate; reflowing the solder paste by exposing the die-substrate combination to temperatures changes including heating the die-substrate combination to liquefy the solder paste, and cooling down the die-substrate combination until the solder paste has solidified to form solder joints to yield the package; and controlling an expansion of the die and the substrate at least during cooling down to mitigate a relative difference in volumetric strain between the die and the substrate. Controlling may comprise exposing the die-substrate combination to pressure changes at least during cooling down.
摘要翻译：使用管芯和衬底差分扩展的控制形成微电子封装的方法。该方法包括：提供包括基板，设置在基板上的管芯和设置在管芯和基板之间的多个焊膏的管芯基板组合; 通过将模具 - 基板组合暴露于包括加热模具 - 基板组合以液化焊膏的温度变化，以及冷却模具 - 基板组合直到焊膏固化形成焊点以产生封装，来回流焊膏; 以及至少在冷却期间控制模具和基材的膨胀以减轻模头和基板之间的体积应变的相对差异。控制可以包括至少在冷却期间使模具 - 基板组合暴露于压力变化。

7. 发明授权

US07154175B2 Ground plane for integrated circuit package 有权
标题翻译：集成电路封装的接地层
公开(公告)号：US07154175B2
公开(公告)日：2006-12-26
申请号：US10873817
申请日：2004-06-21
申请人： Udy A. Shrivastava , Kristopher Frutschy
发明人： Udy A. Shrivastava , Kristopher Frutschy
IPC分类号： H01L23/34
CPC分类号： H01L23/4985 , H01L23/3128 , H01L23/50 , H01L23/5387 , H01L24/48 , H01L25/105 , H01L2224/05001 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05567 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package includes a first chip and a folded flexible substrate. The flexible substrate has a first surface and an opposing second surface and is disposed to partially surround the first chip. A first routing layer is formed on the first surface of the flexible substrate and a second routing layer is formed on the second surface of the flexible substrate. A metal ground plane is formed on a selected one of the first and the second surfaces.
摘要翻译：集成电路封装包括第一芯片和折叠的柔性基板。柔性基板具有第一表面和相对的第二表面，并且被设置成部分地围绕第一芯片。第一布线层形成在柔性基板的第一表面上，第二布线层形成在柔性基板的第二表面上。金属接地平面形成在所述第一和第二表面中的所选择的一个上。

8. 发明授权

US06428358B1 Socket with embedded conductive structure and method of fabrication therefor 失效
标题翻译：嵌入式导电结构的插座及其制造方法
公开(公告)号：US06428358B1
公开(公告)日：2002-08-06
申请号：US09750419
申请日：2000-12-28
申请人： David G. Figueroa , Chee-Yee Chung , Kristopher Frutschy , Farzaneh Yahyaei-Moayyed
发明人： David G. Figueroa , Chee-Yee Chung , Kristopher Frutschy , Farzaneh Yahyaei-Moayyed
IPC分类号： H01R13648
CPC分类号： H01R13/6585 , Y10T29/49204 , Y10T29/49208 , Y10T29/49211 , Y10T29/49222
摘要： A socket (300, FIG. 3) includes a housing (302) with multiple openings (304) formed in the top surface. Each opening (304) provides access to conductive contacts (502, FIG. 5), which provide an electrical interface between a device that is inserted into the socket and the next level of interconnect (e.g., a PC board). Embedded within the socket is a conductive structure (310, FIG. 3). In one embodiment, the conductive structure is electrically connected to one or more ground conducting contacts (708, FIG. 7). The conductive structure includes column walls (312), which run in parallel with columns of contacts, and row walls (314), which run in parallel with rows of contacts and which intersect the column walls. In this manner, the conductive structure forms multiple chambers (402, FIG. 4). Each signal carrying and power conducting contact is positioned within a chamber. Accordingly, the walls of the conductive structure function as a ground plane that surrounds the signal carrying and power conducting contacts.
摘要翻译：插座（300，图3）包括具有形成在顶表面中的多个开口（304）的壳体（302）。每个开口（304）提供对导电触点（502，图5）的访问，其提供插入到插座中的装置与下一级互连（例如，PC板）之间的电接口。嵌入在插座内的是导电结构（图3中的310）。在一个实施例中，导电结构电连接到一个或多个接地导电触头（图7的708）。导电结构包括与触点列平行延伸的柱壁（312）和平行于触点行并与柱壁相交的行壁（314）。以这种方式，导电结构形成多个室（图4中的402）。每个信号承载和电力传导触点位于一个室内。因此，导电结构的壁用作围绕信号承载和电力传导触点的接地平面。

9. 发明申请

US20060044101A1 Integrated package inductor for integrated circuit devices 有权
标题翻译：用于集成电路器件的集成封装电感
公开(公告)号：US20060044101A1
公开(公告)日：2006-03-02
申请号：US10932396
申请日：2004-09-01
申请人： Kristopher Frutschy , Udbhava Shrivastava
发明人： Kristopher Frutschy , Udbhava Shrivastava
IPC分类号： H01F5/00
CPC分类号： H01L21/4857 , H01F17/0006 , H01F17/045 , H01F27/027 , H01L23/49822 , H01L23/66 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H05K1/165 , H01L2224/0401
摘要： Provided are methods and devices in which an inductor is embedded in a package adapted to carry an integrated circuit and a magnetically permeable material is also embedded in the package so that the inductor and the magnetically permeable material are magnetically coupled to each other. In one embodiment, the magnetic permeable material is shaped as a pin which is press-fit into the core of a helix-shaped inductor embedded in the package substrate.
摘要翻译：提供了一种方法和装置，其中电感器嵌入在适于承载集成电路的封装中，并且导磁材料也嵌入封装中，使得电感器和导磁材料彼此磁耦合。在一个实施例中，磁性可渗透材料成形为压入配合到嵌入在封装衬底中的螺旋形电感器的芯的引脚。

10. 发明申请

US20050280138A1 Ground plane for integrated circuit package 有权
标题翻译：集成电路封装的接地层
公开(公告)号：US20050280138A1
公开(公告)日：2005-12-22
申请号：US10873817
申请日：2004-06-21
申请人： Udy Shrivastava , Kristopher Frutschy
发明人： Udy Shrivastava , Kristopher Frutschy
IPC分类号： H01L23/31 , H01L23/498 , H01L23/50 , H01L23/52 , H01L23/538 , H01L25/10
CPC分类号： H01L23/4985 , H01L23/3128 , H01L23/50 , H01L23/5387 , H01L24/48 , H01L25/105 , H01L2224/05001 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05567 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package includes a first chip and a folded flexible substrate. The flexible substrate has a first surface and an opposing second surface and is disposed to partially surround the first chip. A first routing layer is formed on the first surface of the flexible substrate and a second routing layer is formed on the second surface of the flexible substrate. A metal ground plane is formed on a selected one of the first and the second surfaces.
摘要翻译：集成电路封装包括第一芯片和折叠的柔性基板。柔性基板具有第一表面和相对的第二表面，并且被设置成部分地围绕第一芯片。第一布线层形成在柔性基板的第一表面上，第二布线层形成在柔性基板的第二表面上。金属接地平面形成在所述第一和第二表面中的所选择的一个上。

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