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1. 发明申请

US20090212798A1 PROBE CARD, MANUFACTURING METHOD OF PROBE CARD, SEMICONDUCTOR INSPECTION APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 失效
标题翻译：探针卡，半导体检测装置制造方法及半导体器件的制造方法
公开(公告)号：US20090212798A1
公开(公告)日：2009-08-27
申请号：US12253271
申请日：2008-10-17
申请人： Susumu KASUKABE , Yasunori Narizuka
发明人： Susumu KASUKABE , Yasunori Narizuka
IPC分类号： G01R1/073 , G01R3/00
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R1/07378 , Y10T29/49204
摘要： A silicon substrate is used as a mold, and thin films such as metal films and polyimide films are sequentially stacked on the silicon substrate by using photolithography techniques, thereby forming a probe sheet having contact terminals having a pyramidal shape or a truncated pyramidal shape disposed at distal ends of cantilever beam structures. A fixing substrate is further fixed to the probe sheet, and then, the formed probe sheet is sequentially stacked and formed on the silicon substrate, the substrate is fixed, and the silicon substrate and predetermined polyimide films are removed by etching, thereby forming the group of contact terminals with the cantilever beam structures at a time.
摘要翻译：使用硅衬底作为模具，并且通过使用光刻技术将诸如金属膜和聚酰亚胺膜的薄膜依次堆叠在硅衬底上，从而形成具有接触端子的探针片，该接触端子具有锥形或截锥形形状悬臂梁结构的末端。将固定基板进一步固定在探针片上，然后将形成的探针片依次层叠并形成在硅基片上，固定基片，通过蚀刻除去硅基片和预定的聚酰亚胺膜，从而形成基片的接触端子与悬臂梁结构一次。

2. 发明申请

US20070279074A1 Probe Cassette, Semiconductor Inspection Apparatus And Manufacturing Method Of Semiconductor Device 失效
标题翻译：探针盒，半导体检测装置及半导体装置的制造方法
公开(公告)号：US20070279074A1
公开(公告)日：2007-12-06
申请号：US11572033
申请日：2005-07-14
申请人： Susumu Kasukabe , Yasunori Narizuka
发明人： Susumu Kasukabe , Yasunori Narizuka
IPC分类号： G01R31/26 , G01R1/073 , H01L21/66
CPC分类号： G01R1/07314 , G01R31/2863 , G01R31/2886
摘要： A full wafer inspection apparatus and a manufacturing method of a semiconductor device capable of collectively and precisely inspecting semiconductor elements formed on a wafer, while securing the positional accuracy of tip portions of contact terminals are provided. A probe cassette used in a semiconductor inspection apparatus includes: a probe sheet 31 having a plurality of contact terminals 7 which contact electrodes 3 of a wafer 1 and a plurality of contact bumps 20b electrically connected to respective contact terminals 7; and a probe sheet 34 having a plurality of contact electrodes 34a which contact the contact bumps 20b of the probe sheet 31 and a plurality of peripheral electrodes 27b electrically connected to the respective contact electrodes 34a, wherein the wafer 1 is interposed between the probe sheet 34 and the supporting member 33 via the probe sheet 31 by reducing pressure through vacuuming, and the contact terminals 7 are contacted to the electrodes 3 of the wafer 1 at a desired atmospheric pressure, thereby performing the inspection. The contact terminals 7 are formed to have a pyramidal or truncated pyramidal shape, and the probe sheet 34 is backed by a metal film 30b.
摘要翻译：提供了一种确保接触端子的末端部分的位置精度的全晶片检查装置和能够共同且精确地检查在晶片上形成的半导体元件的半导体器件的制造方法。在半导体检查装置中使用的探针盒包括：探针片31，其具有与晶片1的电极3接触的多个接触端子7和与各接触端子7电连接的多个接触凸块20b; 以及探针片34，其具有与探针片31的接触凸块20b接触的多个接触电极34a和电连接到各个接触电极341的多个周边电极27b，其中晶片1介于探针片34和支撑部件33，通过抽真空降低压力，并且接触端子7以期望的大气压力与晶片1的电极3接触，从而进行检查。接触端子7形成为具有金字塔形或截锥形的金字塔形状，探针片34由金属膜30b支承。

3. 发明授权

US07219422B2 Fabrication method of semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US07219422B2
公开(公告)日：2007-05-22
申请号：US10765917
申请日：2004-01-29
申请人： Yuji Wada , Susumu Kasukabe , Takehiko Hasebe , Yasunori Narizuka , Akira Yabushita , Terutaka Mori , Akio Hasebe , Yasuhiro Motoyama , Teruo Shoji , Masakazu Sueyoshi
发明人： Yuji Wada , Susumu Kasukabe , Takehiko Hasebe , Yasunori Narizuka , Akira Yabushita , Terutaka Mori , Akio Hasebe , Yasuhiro Motoyama , Teruo Shoji , Masakazu Sueyoshi
IPC分类号： H05K3/00 , H01R9/00
CPC分类号： G01R1/07314 , G01R31/2872 , Y10T29/41 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49169 , Y10T29/49798
摘要： The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coefficient) almost equal to that of a wafer to be tested; forming a groove in the reinforcing material above a contact terminal; placing an elastomer in the groove so that a predetermined amount projects out of the groove; and disposing a pusher and another elastomer to sandwich the pusher between the elastomers. With the use of such a probe, it is possible to improve the throughput of wafer-level electrical testing of a semiconductor integrated circuit.
摘要翻译：半导体集成电路器件的制造包括使用推压机构进行测试，所述推压机构通过在薄膜探针的上表面上形成具有几乎等于晶片的线性膨胀系数（热膨胀系数）的增强材料而构成待测在接触端子上方的增强材料中形成凹槽; 将弹性体放置在所述槽中，使得预定量突出到所述凹槽中; 并且设置推进器和另一种弹性体以将推进器夹在弹性体之间。通过使用这样的探针，可以提高半导体集成电路的晶片级电气测试的吞吐量。

4. 发明授权

US07049837B2 Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method 失效
标题翻译：探头片，探针卡，半导体测试设备和半导体器件制造方法
公开(公告)号：US07049837B2
公开(公告)日：2006-05-23
申请号：US10676609
申请日：2003-10-02
申请人： Susumu Kasukabe , Takehiko Hasebe , Yasunori Narizuka , Akio Hasebe
发明人： Susumu Kasukabe , Takehiko Hasebe , Yasunori Narizuka , Akio Hasebe
IPC分类号： G01R31/02
CPC分类号： G01R1/06744 , G01R1/06711 , G01R1/0735 , G01R3/00 , G01R31/2874 , H01L24/05 , H01L2224/04042 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48453 , H01L2224/48463 , H01L2224/48465 , H01L2224/73265 , H01L2924/00011 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01033
摘要： A probe card has first contact terminals electrically connected to the fine-pitch electrodes of a test target; wirings drawn from the first contact terminals; and second contact terminals electrically connected to the wirings, wherein the first contact terminals are formed each using an anisotropically etched hole in a crystalline substrate, and a semiconductor device test method (fabrication method) using the probe card.
摘要翻译：探针卡具有电连接到测试对象的细间距电极的第一接触端子; 从第一接触端子抽出的接线; 以及电连接到所述布线的第二接触端子，其中，使用所述探针卡的半导体器件测试方法（制造方法）在所述晶体衬底中各自使用各向异性蚀刻的孔来形成所述第一接触端子。

5. 发明申请

US20110014727A1 THIN FILM PROBE SHEET AND SEMICONDUCTOR CHIP INSPECTION SYSTEM 审中-公开
标题翻译：薄膜探针片和半导体芯片检查系统
公开(公告)号：US20110014727A1
公开(公告)日：2011-01-20
申请号：US12883982
申请日：2010-09-16
申请人： Akira YABUSHITA , Yasunori Narizuka , Susumu Kasukabe , Terutaka Mori , Etsuko Takane , Akio Hasebe , Kenji Kawakami
发明人： Akira YABUSHITA , Yasunori Narizuka , Susumu Kasukabe , Terutaka Mori , Etsuko Takane , Akio Hasebe , Kenji Kawakami
IPC分类号： H01L21/66 , H05K3/02
CPC分类号： G01R1/0735 , Y10T29/49156
摘要： In the highly accurate thin film probe sheet which is used for the contact to electrode pads disposed in high density with narrow pitches resulting from the increase in integration degree of semiconductor chips and for the inspection of semiconductor chips, a large spatial region in which a metal film selectively removable relative to terminal metal is formed in advance is formed in the peripheral region around minute contact terminals having sharp tips and disposed in high density with narrow pitches equivalent to those of the electrode pads. Thus, occurrence of damage in an inspection process is significantly reduced, and an inspection device simultaneously achieving the miniaturization and the durability can be provided.
摘要翻译：在用于与由半导体芯片的集成度增加和半导体芯片的检查而产生的窄间距高密度设置的电极焊盘接触的高精度薄膜探针片中，其中金属在具有尖锐尖端的微小接触端子周围的周边区域中预先形成相对于端子金属可选择的膜，并以与电极焊盘相同的窄间距高密度地设置。因此，检查过程中的损坏的发生显着减少，并且可以提供同时实现小型化和耐久性的检查装置。

6. 发明申请

US20070103178A1 Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device 失效
标题翻译：探针片粘合保持器，探针卡，半导体测试装置和半导体器件的制造方法
公开(公告)号：US20070103178A1
公开(公告)日：2007-05-10
申请号：US11543021
申请日：2006-10-05
申请人： Susumu Kasukabe , Teruo Shoji , Akio Hasebe , Yoshinori Deguchi , Yasunori Narizuka
发明人： Susumu Kasukabe , Teruo Shoji , Akio Hasebe , Yoshinori Deguchi , Yasunori Narizuka
IPC分类号： G01R31/02
CPC分类号： G01R1/0735 , G01R3/00
摘要： In a prove card comprising: a probe sheet having a contact terminal contacting with an electrode provided on a wafer, a wiring led from the contact terminal, and an electrode electrically connected to the wiring; and a multilayered wiring substrate having an electrode electrically connected to the electrode of the probe sheet, wherein a contact between the contact terminal and the electrode of the wafer is established by one or more adhesion holder for pressing, from the backside of a terminal group of the terminal contacts, the terminal group via a press block with a spring to contact with the electrode pad. A device in which the probe sheet is attached to the adhesion holder and a plurality of chips are tested simultaneously by combining the adhesion holder.
摘要翻译：一种证明卡，包括：探针片，其具有与设置在晶片上的电极接触的接触端子，从接触端子引出的布线和电连接到布线的电极; 以及多层布线基板，其具有与所述探针片的电极电连接的电极，其中，所述接触端子和所述晶片的电极之间的接触由一个或多个粘合保持器建立，所述粘合保持器从所述端子组的端子组的背面端子触点，端子组通过具有弹簧的压块与电极焊盘接触。通过组合粘合保持器，将探针片附接到粘合保持器和多个芯片的装置同时测试。

7. 发明授权

US07724006B2 Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device 失效
标题翻译：探针卡，探针卡的制造方法，半导体检查装置及半导体装置的制造方法
公开(公告)号：US07724006B2
公开(公告)日：2010-05-25
申请号：US12253271
申请日：2008-10-17
申请人： Susumu Kasukabe , Yasunori Narizuka
发明人： Susumu Kasukabe , Yasunori Narizuka
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R1/07378 , Y10T29/49204
摘要： A silicon substrate is used as a mold, and thin films such as metal films and polyimide films are sequentially stacked on the silicon substrate by using photolithography techniques, thereby forming a probe sheet having contact terminals having a pyramidal shape or a truncated pyramidal shape disposed at distal ends of cantilever beam structures. A fixing substrate is further fixed to the probe sheet, and then, the formed probe sheet is sequentially stacked and formed on the silicon substrate, the substrate is fixed, and the silicon substrate and predetermined polyimide films are removed by etching, thereby forming the group of contact terminals with the cantilever beam structures at a time.
摘要翻译：使用硅衬底作为模具，并且通过使用光刻技术将诸如金属膜和聚酰亚胺膜的薄膜依次堆叠在硅衬底上，从而形成具有接触端子的探针片，该接触端子具有锥形或截锥形形状悬臂梁结构的末端。将固定基板进一步固定在探针片上，然后将形成的探针片依次层叠并形成在硅基片上，固定基片，通过蚀刻除去硅基片和预定的聚酰亚胺膜，从而形成基片的接触端子与悬臂梁结构一次。

8. 发明授权

US07423439B2 Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device 失效
标题翻译：探针片粘合保持器，探针卡，半导体测试装置和半导体器件的制造方法
公开(公告)号：US07423439B2
公开(公告)日：2008-09-09
申请号：US11543021
申请日：2006-10-05
申请人： Susumu Kasukabe , Teruo Shoji , Akio Hasebe , Yoshinori Deguchi , Yasunori Narizuka
发明人： Susumu Kasukabe , Teruo Shoji , Akio Hasebe , Yoshinori Deguchi , Yasunori Narizuka
IPC分类号： G01R31/02
CPC分类号： G01R1/0735 , G01R3/00
摘要： In a prove card comprising: a probe sheet having a contact terminal contacting with an electrode provided on a wafer, a wiring led from the contact terminal, and an electrode electrically connected to the wiring; and a multilayered wiring substrate having an electrode electrically connected to the electrode of the probe sheet, wherein a contact between the contact terminal and the electrode of the wafer is established by one or more adhesion holder for pressing, from the backside of a terminal group of the terminal contacts, the terminal group via a press block with a spring to contact with the electrode pad. A device in which the probe sheet is attached to the adhesion holder and a plurality of chips are tested simultaneously by combining the adhesion holder.
摘要翻译：一种证明卡，包括：探针片，其具有与设置在晶片上的电极接触的接触端子，从接触端子引出的布线和电连接到布线的电极; 以及多层布线基板，其具有与所述探针片的电极电连接的电极，其中，所述接触端子和所述晶片的电极之间的接触由一个或多个粘合保持器建立，所述粘合保持器从所述端子组的端子组的背面端子触点，端子组通过具有弹簧的压块与电极焊盘接触。通过组合粘合保持器，将探针片附接到粘合保持器和多个芯片的装置同时测试。

9. 发明授权

US07351597B2 Fabrication method of semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US07351597B2
公开(公告)日：2008-04-01
申请号：US11750371
申请日：2007-05-18
申请人： Yuji Wada , Susumu Kasukabe , Takehiko Hasebe , Yasunori Narizuka , Akira Yabushita , Terutaka Mori , Akio Hasebe , Yasuhiro Motoyama , Teruo Shoji , Masakazu Sueyoshi
发明人： Yuji Wada , Susumu Kasukabe , Takehiko Hasebe , Yasunori Narizuka , Akira Yabushita , Terutaka Mori , Akio Hasebe , Yasuhiro Motoyama , Teruo Shoji , Masakazu Sueyoshi
IPC分类号： H01L21/66
CPC分类号： G01R1/07314 , G01R31/2872 , Y10T29/41 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49169 , Y10T29/49798
摘要： The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coefficient) almost equal to that of a wafer to be tested; forming a groove in the reinforcing material above a contact terminal; placing an elastomer in the groove so that a predetermined amount projects out of the groove; and disposing a pusher and another elastomer to sandwich the pusher between the elastomers. With the use of such a probe, it is possible to improve the throughput of wafer-level electrical testing of a semiconductor integrated circuit.
摘要翻译：半导体集成电路器件的制造包括使用推压机构进行测试，所述推压机构通过在薄膜探针的上表面上形成具有几乎等于晶片的线性膨胀系数（热膨胀系数）的增强材料而构成待测在接触端子上方的增强材料中形成凹槽; 将弹性体放置在所述槽中，使得预定量突出到所述凹槽中; 并且设置推进器和另一种弹性体以将推进器夹在弹性体之间。通过使用这样的探针，可以提高半导体集成电路的晶片级电气测试的吞吐量。

10. 发明申请

US20080029763A1 Transmission Circuit, Connecting Sheet, Probe Sheet, Probe Card, Semiconductor Inspection System and Method of Manufacturing Semiconductor Device 审中-公开
标题翻译：传输电路，连接片，探头片，探针卡，半导体检测系统及制造半导体器件的方法
公开(公告)号：US20080029763A1
公开(公告)日：2008-02-07
申请号：US11740301
申请日：2007-04-26
申请人： Susumu Kasukabe , Terutaka Mori , Yasunori Narizuka , Norio Chujo
发明人： Susumu Kasukabe , Terutaka Mori , Yasunori Narizuka , Norio Chujo
IPC分类号： H01L23/48 , G01R31/26 , H01L23/58 , H01L29/40
CPC分类号： G01R31/31905 , G01R1/0735 , G01R31/2874 , G01R31/2879 , G01R31/2889 , H01L2924/0002 , H01P3/081 , H01L2924/00
摘要： A probe sheet or a connecting sheet with good transmission characteristics and flexibility comprising contact terminals capable of contacting at a plurality of points and in high density, without applying damages on an electrode pad which is a contact subject is provided. Further, a high-speed transmission circuit capable of designing signal wirings with aligned impedance to have wide width even with a thin insulating film is achieved to provide a probe sheet or a connecting sheet with reduced loss of high-speed transmission signals. Moreover, the transmission circuit is applied to a probe card using a probe sheet, an inspecting method of (a method of manufacturing) a semiconductor device using the same, and a connecting sheet having an excellent high-frequency characteristic.
摘要翻译：提供了具有良好传输特性和柔性的探针片或连接片，包括能够在多个点和高密度下接触的接触端子，而不对作为接触物体的电极焊盘施加损伤。此外，实现了即使使用薄绝缘膜，能够设计具有均匀阻抗的宽度宽的宽度的高速传输电路，以提供具有降低的高速传输信号损失的探针片或连接片。此外，使用探针片将传输电路应用到探针卡，使用其的制造半导体器件的制造方法的检查方法以及具有优异的高频特性的连接片。

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