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1. 发明授权

US5483105A Module input-output pad having stepped set-back 失效
标题翻译：模块输入输出垫具有阶梯式回退
公开(公告)号：US5483105A
公开(公告)日：1996-01-09
申请号：US233025
申请日：1994-04-25
申请人： Suryanarayana Kaja , Eric D. Perfecto , William H. Price , Sampath Purushothaman , Srinivasa N. Reddy , Vivek M. Sura , George E. White
发明人： Suryanarayana Kaja , Eric D. Perfecto , William H. Price , Sampath Purushothaman , Srinivasa N. Reddy , Vivek M. Sura , George E. White
IPC分类号： H01R12/32 , H01L23/498 , H01R12/04 , H05K1/02 , H05K1/03 , H05K1/11 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/49811 , H05K1/111 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09736 , H05K2201/098 , Y02P70/611
摘要： A ceramic substrate pad used for establishing brazed connection between a pin and the substrate in the packaging of microelectronic semiconductor circuit chip. The pad is characterized by a stepped setback in the upper surface thereof which setback is oxidized to prevent wetting by the brazing alloy which bonds the pin to the pad. Stresses attributable to the brazing are isolated from the setback area and thus have reduced effect in causing cracking at the edges of the pad-substrate interface.
摘要翻译：一种用于在微电子半导体电路芯片的封装中在引脚和衬底之间建立钎焊连接的陶瓷衬底焊盘。该焊盘的特征在于在其上表面具有阶梯状的挫折，其挫折被氧化以防止通过将销钉固定到焊盘的钎焊合金的润湿。由于钎焊产生的应力与塌陷区域隔离，因此在焊盘 - 衬底界面的边缘处产生破裂的效果降低。

2. 发明授权

US6131796A Direct brazing of refractory metal features 失效
$Direct brazing of refractory metal features$
标题翻译：耐火金属特征的直接钎焊
公开(公告)号：US6131796A
公开(公告)日：2000-10-17
申请号：US960563
申请日：1997-10-30
申请人： Suryanarayana Kaja , Srinivasa N. Reddy , Donald Rene Wall
发明人： Suryanarayana Kaja , Srinivasa N. Reddy , Donald Rene Wall
IPC分类号： B23K1/19 , B23K35/00 , B23K35/30 , B23K20/22 , B23K31/02 , B23K35/24
CPC分类号： B23K1/19 , B23K35/005 , B23K35/3006 , B23K2201/40
摘要： A brazing method for the direct bonding of a metallic item to a refractory metal without the need for an adhesion layer. The direct brazing process uses a Cu--Ag--Ni alloy which eliminates the need for the steps of plating a refractory metal to be bonded to a metallic material with a nickel layer (or other nickel-containing adhesion layer) and diffusion annealing the plated refractory metal prior to brazing. The brazed joint produced by the direct brazing method between a refractory metal and a metallic item has a substantially reduced layer of nickel in the as-brazed joint which improves the mechanical properties of the joint.
摘要翻译：用于将金属物品直接接合到难熔金属而不需要粘合层的钎焊方法。直接钎焊工艺使用Cu-Ag-Ni合金，其不需要用镍层（或其它含镍粘合层）将待接合的难熔金属电镀到金属材料上，并且对镀层耐火材料进行扩散退火钎焊前的金属。在难熔金属和金属制品之间通过直接钎焊方法制造的钎焊接头在钎焊接头中具有大大降低的镍层，这提高了接头的机械性能。

3. 发明授权

US5130067A Method and means for co-sintering ceramic/metal MLC substrates 失效
标题翻译：用于共烧陶瓷/金属MLC衬底的方法和手段
公开(公告)号：US5130067A
公开(公告)日：1992-07-14
申请号：US859093
申请日：1986-05-02
申请人： Philip L. Flaitz , Arlyne M. Flanagan , Joseph M. Harvilchuck , Lester W. Herron , John U. Knickerbocker , Robert W. Nufer , Charles H. Perry , Srinivasa N. Reddy , Steven P. Young
发明人： Philip L. Flaitz , Arlyne M. Flanagan , Joseph M. Harvilchuck , Lester W. Herron , John U. Knickerbocker , Robert W. Nufer , Charles H. Perry , Srinivasa N. Reddy , Steven P. Young
IPC分类号： C04B35/638 , C04B35/64 , H01L21/48
CPC分类号： C04B35/64 , C04B35/638 , H01L21/4807
摘要： A method for co-sintering ceramic/metal multi-layered ceramic substrates wherein X-Y shrinkage is controlled and X-Y distortion and Z-direction chamber are substantially eliminated. Binder-burnoff is substantially not aggravated during this process as well. The process is accomplished by applying selective forces to the surfaces of the ceramic substrates to control lateral movement while allowing Z direction shrinkage movement. Frictional force means, pneumatic forced means and weights are among the means used to supply forces. Cerium oxide is used in certain embodiments to enhance binder-burnoff.
摘要翻译：一种陶瓷/金属多层陶瓷基板的共烧结方法，其中X-Y收缩被控制，并且基本上消除了X-Y变形和Z方向室。在此过程中，粘结剂 - 烧毁也基本上不会加剧。该过程通过向陶瓷基底的表面施加选择力来实现，以控制横向运动，同时允许Z方向收缩运动。摩擦力意味着，气动强制手段和重量是用于供应力的手段之一。在某些实施方案中使用氧化铈以增强粘合剂 - 燃烧。

4. 发明授权

US08268716B2 Creation of lead-free solder joint with intermetallics 有权
标题翻译：用金属间化合物制造无铅焊点
公开(公告)号：US08268716B2
公开(公告)日：2012-09-18
申请号：US12894231
申请日：2010-09-30
申请人： Charles L. Arvin , Valerie Oberson , Srinivasa N. Reddy , Krystyna W. Semkow , Richard A. Shelleman , Kamalesh K. Srivistava
发明人： Charles L. Arvin , Valerie Oberson , Srinivasa N. Reddy , Krystyna W. Semkow , Richard A. Shelleman , Kamalesh K. Srivistava
IPC分类号： H01L21/44
CPC分类号： H01L24/16 , H01L23/15 , H01L23/49811 , H01L24/13 , H01L24/81 , H01L2224/13166 , H01L2224/16237 , H01L2224/16238 , H01L2224/16507 , H01L2224/81191 , H01L2224/81192 , H01L2224/81444 , H01L2224/81815 , H01L2924/01327 , H01L2924/14 , H01L2924/00012 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： A method of coupling an integrated circuit to a substrate includes providing the substrate, forming a contact pad in the substrate, contacting the contact pad with a solder ball, and repeatedly exposing the solder ball to a thermal process to cause intermetallics based on a metal in the contact pad to be formed in the thermal ball.
摘要翻译：将集成电路耦合到衬底的方法包括提供衬底，在衬底中形成接触焊盘，使接触焊盘与焊球接触，并且将焊球重复地暴露于热处理以引起基于金属的金属间化合物接触垫将形成在热球中。

5. 发明申请

US20120083113A1 CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS 有权
标题翻译：创建无铅焊接接头与INTERMETALLICS
公开(公告)号：US20120083113A1
公开(公告)日：2012-04-05
申请号：US12894231
申请日：2010-09-30
申请人： Charles L. Arvin , Valerie Oberson , Srinivasa N. Reddy , Krystyna W. Semkow , Richard A. Shelleman , Kamalesh K. Srivastava
发明人： Charles L. Arvin , Valerie Oberson , Srinivasa N. Reddy , Krystyna W. Semkow , Richard A. Shelleman , Kamalesh K. Srivastava
IPC分类号： H01L21/768
CPC分类号： H01L24/16 , H01L23/15 , H01L23/49811 , H01L24/13 , H01L24/81 , H01L2224/13166 , H01L2224/16237 , H01L2224/16238 , H01L2224/16507 , H01L2224/81191 , H01L2224/81192 , H01L2224/81444 , H01L2224/81815 , H01L2924/01327 , H01L2924/14 , H01L2924/00012 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： A method of coupling an integrated circuit to a substrate includes providing the substrate, forming a contact pad in the substrate, contacting the contact pad with a solder ball, and repeatedly exposing the solder ball to a thermal process to cause intermetallics based on a metal in the contact pad to be formed in the thermal ball.
摘要翻译：将集成电路耦合到衬底的方法包括提供衬底，在衬底中形成接触焊盘，使接触焊盘与焊球接触，并且将焊球重复地暴露于热处理以引起基于金属的金属间化合物接触垫将形成在热球中。

6. 发明授权

US4753694A Process for forming multilayered ceramic substrate having solid metal conductors 失效
标题翻译：用于形成具有固体金属导体的多层陶瓷基板的工艺
公开(公告)号：US4753694A
公开(公告)日：1988-06-28
申请号：US859092
申请日：1986-05-02
申请人： Lester W. Herron , Robert O. Lussow , Robert W. Nufer , Bernard Schwartz , John Acocella , Srinivasa N. Reddy
发明人： Lester W. Herron , Robert O. Lussow , Robert W. Nufer , Bernard Schwartz , John Acocella , Srinivasa N. Reddy
IPC分类号： H05K3/46 , H01L21/48 , H01L23/538 , H05K1/03 , H05K3/20 , C03B29/00
CPC分类号： H01L23/5383 , H01L21/4857 , H05K3/20 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K2201/0317 , H05K2203/0156 , H05K3/4611 , H05K3/4629
摘要： A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non-porous, homogeneous metal patterns, whereas the vertical interplanar connection conductors are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet having a release layer, then transferring the pattern to a ceramic green sheet. Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.
摘要翻译：一种多层陶瓷（MLC）衬底，其具有适于安装和互连其外部的多个电子器件的嵌入和暴露的导体。水平平面导体基本上包括多个固体，非多孔均质的金属图案，而垂直平面连接导体是通过诸如筛选的方法形成的基本上多孔的金属导体。形成MLC衬底的方法包括将固体，无孔导体的图案形成为具有剥离层的背衬片，然后将图案转移到陶瓷生片。零X-Y收缩烧结工艺允许MLC衬底和固体金属导体致密化而不会使固体金属图案或陶瓷变形。

7. 发明授权

US06987316B2 Multilayer ceramic substrate with single via anchored pad and method of forming 有权
标题翻译：具有单通孔锚固垫的多层陶瓷基板和成型方法
公开(公告)号：US06987316B2
公开(公告)日：2006-01-17
申请号：US10707810
申请日：2004-01-14
申请人： Srinivasa N. Reddy , Mukta G. Farooq , Kevin M. Prettyman
发明人： Srinivasa N. Reddy , Mukta G. Farooq , Kevin M. Prettyman
IPC分类号： H01L23/06 , H01L23/10 , H01L23/15
CPC分类号： H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H05K1/0298 , H05K1/0306 , H05K1/113 , H05K2201/096 , H01L2924/00
摘要： A multilayer ceramic substrate in which an outer metal pad is anchored to the substrate by a single metal-filled via in the first ceramic layer adjacent to the metal pad. In turn, this single metal-filled via is anchored to the substrate by a larger, single metal-filled via in the next ceramic layer adjacent to the first ceramic layer. Preferably, the metal-filled vias and metal pad are 100 volume percent metal.
摘要翻译：一种多层陶瓷基板，其中外金属焊盘通过与金属焊盘相邻的第一陶瓷层中的单个金属填充通孔锚定到基板。反过来，通过在与第一陶瓷层相邻的下一个陶瓷层中的较大的单个金属填充的通孔将该单个金属填充的通孔锚定到衬底。优选地，金属填充的通孔和金属垫是100体积％的金属。

8. 发明授权

US06461493B1 Decoupling capacitor method and structure using metal based carrier 有权
标题翻译：使用金属载体去耦电容器的方法和结构
公开(公告)号：US06461493B1
公开(公告)日：2002-10-08
申请号：US09472136
申请日：1999-12-23
申请人： Mukta S. Farooq , Shaji Farooq , John U. Knickerbocker , Robert A. Rita , Srinivasa N. Reddy
发明人： Mukta S. Farooq , Shaji Farooq , John U. Knickerbocker , Robert A. Rita , Srinivasa N. Reddy
IPC分类号： C25D502
CPC分类号： H05K3/445 , H01G4/10 , H05K1/053 , H05K1/162 , H05K3/4069 , H05K2201/09554 , H05K2203/0315 , H05K2203/1142
摘要： A process for fabricating a structure using a metal carrier and forming a double capacitor structure. The process comprises forming a first via hole through the metal carrier, forming a dielectric layer around the metal carrier and inside the first via hole, forming a second via hole through the dielectric layer and the metal carrier, and filling at least one of the via holes with conductive material. In one preferred embodiment, the process further comprises forming a third via hole through the metal carrier before the forming of a dielectric layer, wherein the dielectric layer is formed around the metal carrier, inside the first via hole, and inside the third via hole. The first via hole, the second via hole, and the third via hole are all filled with a conductive material. In one preferred embodiment, the dielectric layer comprises a top surface opposed to a bottom surface, and electrodes are formed on at least one of the top surface and the bottom surface of the dielectric layer.
摘要翻译：一种使用金属载体制造结构并形成双电容器结构的方法。该工艺包括形成通过金属载体的第一通孔，在金属载体周围形成电介质层，并在第一通孔内部形成介电层，形成穿过电介质层和金属载体的第二通孔，并填充至少一个通孔孔与导电材料。在一个优选实施例中，该方法还包括在形成电介质层之前通过金属载体形成第三通孔，其中介电层围绕金属载体形成在第一通孔的内部，以及在第三通孔的内部。第一通孔，第二通孔和第三通孔均填充有导电材料。在一个优选实施例中，电介质层包括与底表面相对的顶表面，并且在介电层的顶表面和底表面中的至少一个上形成电极。

9. 发明授权

US4879156A Multilayered ceramic substrate having solid non-porous metal conductors 失效
标题翻译：具有固体无孔金属导体的多层陶瓷基片
公开(公告)号：US4879156A
公开(公告)日：1989-11-07
申请号：US167607
申请日：1988-03-14
申请人： Lester W. Herron , Robert O. Lussow , Robert W. Nufer , Bernard Schwartz , John Acocella , Srinivasa N. Reddy
发明人： Lester W. Herron , Robert O. Lussow , Robert W. Nufer , Bernard Schwartz , John Acocella , Srinivasa N. Reddy
IPC分类号： H01L21/48 , H01L23/538 , H05K1/03 , H05K3/20 , H05K3/46
CPC分类号： H01L21/4857 , H01L23/5383 , H05K3/20 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K2201/0317 , H05K2203/0156 , H05K3/4611 , H05K3/4629 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/26
摘要： A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non-porous, homogeneous metal patterns, whereas the vertical interplanar connection conductors are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet having a release layer, then transferring the pattern to a ceramic green sheet. Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.
摘要翻译：一种多层陶瓷（MLC）衬底，其具有适于安装和互连其外部的多个电子器件的嵌入和暴露的导体。水平平面导体基本上包括多个固体，非多孔均质的金属图案，而垂直平面连接导体是通过诸如筛选的方法形成的基本上多孔的金属导体。形成MLC衬底的方法包括将固体，无孔导体的图案形成为具有剥离层的背衬片，然后将图案转移到陶瓷生片。零X-Y收缩烧结工艺允许MLC衬底和固体金属导体致密化而不会使固体金属图案或陶瓷变形。

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