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    • 4. 发明申请
    • Method of manufacturing mask structure
    • 掩模结构的制造方法
    • US20110065029A1
    • 2011-03-17
    • US12882652
    • 2010-09-15
    • Hwan-Seok SeoByoung-Sup AhnDong-Gun Lee
    • Hwan-Seok SeoByoung-Sup AhnDong-Gun Lee
    • G03F1/00
    • G03F1/24B82Y10/00B82Y40/00
    • A method of forming a mask structure for an extreme ultraviolet ray lithography (EUVL) process includes defining a substrate including a first area and a second area, such that the first area has a pattern structure configured to selectively transmit light for the EUVL process and the second area encloses the first area, forming a reflection layer on the substrate, the reflection layer including alternately stacked molybdenum layers and silicon layers on the substrate, forming a capping layer on the reflection layer, forming an absorption pattern on the capping layer, the absorption pattern including a central portion corresponding to the first area of the substrate and a peripheral portion corresponding to the second area of the substrate, and forming a blind layer on the peripheral portion of the absorption pattern.
    • 形成用于极紫外线光刻(EUVL)工艺的掩模结构的方法包括限定包括第一区域和第二区域的衬底,使得第一区域具有被配置为选择性地透射EUVL工艺的光的图案结构, 第二区域包围第一区域,在衬底上形成反射层,反射层在衬底上包括交替堆叠的钼层和硅层,在反射层上形成覆盖层,在覆盖层上形成吸收图案,吸收 图案包括对应于基板的第一区域的中心部分和对应于基板的第二区域的周边部分,并且在吸收图案的周边部分上形成盲层。