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1. 发明授权

US5473118A Printed circuit board with a coverlay film 失效
标题翻译：带有覆膜的印刷电路板
公开(公告)号：US5473118A
公开(公告)日：1995-12-05
申请号：US268602
申请日：1994-06-30
申请人： Sunao Fukutake , Kazuhiko Ohashi , Akira Urakami
发明人： Sunao Fukutake , Kazuhiko Ohashi , Akira Urakami
IPC分类号： C09J7/02 , C09J201/00 , H05K3/28 , H05K3/38 , H05K1/00
CPC分类号： H05K3/281 , H05K2201/0116 , H05K2201/015 , H05K2201/0195 , H05K2203/1311 , H05K3/386
摘要： A printed circuit board assembly having a coverlay film which is a composite film consisting of a porous fluoropolymer film coated with a thermoplastic or heat-curing adhesive is disclosed. The coverlay film has excellent conformability and adhesion to the printed circuit board and low dielectric constant.
摘要翻译：公开了一种印刷电路板组件，其具有覆盖膜，该覆盖膜是由涂覆有热塑性或热固化粘合剂的多孔含氟聚合物膜构成的复合膜。覆盖膜具有优异的贴合性和对印刷电路板的粘合性和低介电常数。

2. 发明授权

US5294487A Composite layered material containing a silicone resin substrate 失效
标题翻译：含有硅树脂基材的复合层状材料
公开(公告)号：US5294487A
公开(公告)日：1994-03-15
申请号：US016481
申请日：1993-02-10
申请人： Kazuhiko Ohashi , Sunao Fukutake
发明人： Kazuhiko Ohashi , Sunao Fukutake
IPC分类号： B01D69/12 , B01D71/70 , B32B5/18 , B32B27/00 , B32B27/08 , C01B3/50
CPC分类号： B01D71/70 , B01D69/12 , B32B5/18 , C01B3/501 , C01B2203/0405 , C01B2203/048 , Y10T428/249958 , Y10T428/249982 , Y10T428/249985 , Y10T428/3154 , Y10T428/31663
摘要： A composite material comprising a porous polymeric material bonded to a silicone resin substrate with a silicone-based adhesive agent, wherein only part of the pores of said porous material in the thickness direction thereof contain said silicone-based adhesive agent.
摘要翻译：一种复合材料，其包含用有机硅类粘合剂粘合到有机硅树脂基材上的多孔聚合物材料，其中所述多孔材料的厚度方向上只有部分孔包含所述硅氧烷基粘合剂。

3. 发明授权

US5252383A Carrier sheet for printed circuits and semiconductor chips 失效
标题翻译：用于印刷电路和半导体芯片的载体片
公开(公告)号：US5252383A
公开(公告)日：1993-10-12
申请号：US906230
申请日：1992-06-29
申请人： Sunao Fukutake , Kazuhiko Ohashi , Takayuki Wani
发明人： Sunao Fukutake , Kazuhiko Ohashi , Takayuki Wani
IPC分类号： H01L23/12 , C23C18/20 , H01L21/48 , H01L23/14 , H05K1/03 , H05K3/18 , H05K3/38 , H05K3/42 , B32B9/00
CPC分类号： H05K3/422 , C23C18/208 , C23C18/30 , H01L21/481 , H01L23/145 , H05K1/0353 , H05K3/386 , H01L2924/0002 , H05K2201/0116 , H05K2201/015 , H05K2201/0355 , H05K2201/09581 , H05K3/427 , Y10S428/901 , Y10T428/24917 , Y10T428/24926 , Y10T428/3154
摘要： A carrier sheet for printed circuits and semiconductor chips having enhanced adhesion of conductive metal layers to a fluororesin surface resulting from rendering the fluororesin surface hydrophilic by a hydrophilic macromolecule before plating the metal onto the surface.

4. 发明授权

US5580618A LCD article from liquid crystal filled, hydrophilically-coated, porous PTFE film 失效
标题翻译：液晶物品由液晶填充，亲水涂层，多孔PTFE膜
公开(公告)号：US5580618A
公开(公告)日：1996-12-03
申请号：US495066
申请日：1995-06-26
申请人： Kouichi Okino , Kazuhiko Ohashi , Sunao Fukutake
发明人： Kouichi Okino , Kazuhiko Ohashi , Sunao Fukutake
IPC分类号： G02F1/1333 , C09K19/54 , C09K19/52
CPC分类号： C09K19/544 , C09K2019/546 , Y10T428/1077
摘要： A liquid crystal-containing precursor for a liquid crystal display device consisting of a porous polytetrafluoroethylene film which has the structure defining the pores treated with a hydrophilic substance. The pores of the treated porous film are substantially filled with liquid crystals. The hydrophilizing treatment increases the transition speed of the liquid crystals from light-scattering orientation to light-transmitting orientation. The liquid crystal-filled film can be covered with transparent non-porous layers of material, having an electrically-conductive film on at least one surface, which can be hermetically sealed at the edges, to permit long-term storage of the liquid crystals in ready-to-use sheet form and easy inclusion into a liquid crystal display device.
摘要翻译：一种液晶显示装置的含液晶的前体，其由具有限定用亲水物质处理的孔的结构的多孔聚四氟乙烯膜构成。经处理的多孔膜的孔基本上充满液晶。亲水化处理使液晶从光散射取向向透光取向的转变速度提高。液晶填充膜可以覆盖有透明无孔材料层，在至少一个表面上具有导电膜，其可以在边缘气密密封，以允许液晶长期储存在易于使用的片材形式并容易地包含在液晶显示装置中。

5. 发明授权

US06849934B2 Dielectric film for printed wiring board, multilayer printed board, and semiconductor device 有权
标题翻译：用于印刷电路板，多层印刷电路板和半导体器件的介电膜
公开(公告)号：US06849934B2
公开(公告)日：2005-02-01
申请号：US10382356
申请日：2003-03-05
申请人： Makoto Ogawa , Akira Urakami , Kazuhiko Ohashi
发明人： Makoto Ogawa , Akira Urakami , Kazuhiko Ohashi
IPC分类号： C09J7/02 , C09J7/04 , H01L23/12 , H01L23/14 , H01L23/498 , H05K1/03 , H05K3/46 , H01L23/02
CPC分类号： H05K3/4688 , C09J7/21 , C09J7/22 , C09J7/35 , C09J2400/263 , C09J2427/006 , H01L23/49894 , H01L2224/16 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01078 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K1/034 , H05K3/4605 , H05K2201/0116 , H05K2201/015 , H05K2203/1147 , Y10T428/24917 , Y10T428/249958
摘要： A dielectric film for a printed wiring board that has excellent heat resistance, moisture resistance, insulation properties, adhesiveness, ease of handling, ease of processing, and the like, and possesses low elasticity and high elongation as stress relief functions. The dielectric film has drawn porous polytetrafluoroethylene used as the base material; this is impregnated with an adhesive or fusible resin; the post-solidification tensile modulus of elasticity is 0.1 to 1.8 GPa; and the tensile elongation at break (at 25° C.) is at least 4.0%. A semiconductor device, comprising a multilayer printed board having a plurality of circuit layers, and a semiconductor element mounted on the multilayer printed board, this semiconductor device having an insulating/adhesive layer with a stress relief function between the outermost circuit layer of the multilayer board on the side of the semiconductor element, and the circuit layer adjacent thereto; and the insulating/adhesive layer is formed from the dielectric film. Also, a printed wiring board therefor.
摘要翻译：用于印刷电路板的电介质膜具有优异的耐热性，耐湿性，绝缘性，粘合性，易于操作，易于加工等优点，并且具有低弹性和高伸长率作为应力消除功能。电介质膜采用多孔聚四氟乙烯作为基材; 这是用粘合剂或可熔树脂浸渍的; 后凝固拉伸弹性模量为0.1〜1.8GPa; 拉伸断裂伸长率（25℃）至少为4.0％。一种半导体器件，包括具有多个电路层的多层印刷电路板和安装在多层印刷电路板上的半导体元件，该半导体器件具有在多层板的最外层电路层之间具有应力消除功能的绝缘/粘合层在半导体元件的一侧和与其相邻的电路层; 并且绝缘/粘合剂层由电介质膜形成。另外，也是印刷电路板。

6. 发明授权

US5191281A IC tester capable of changing strobe position in accordance with a predetermined reference signal 失效
标题翻译： IC测试器能够根据预定的参考信号改变频闪位置
公开(公告)号：US5191281A
公开(公告)日：1993-03-02
申请号：US747627
申请日：1991-08-20
申请人： Kazuhiko Ohashi
发明人： Kazuhiko Ohashi
IPC分类号： G01R31/28 , G01R31/3193
CPC分类号： G01R31/31937
摘要： An IC tester correctly carries out a function test on an integrated circuit (IC). The IC tester selects one of two strobe position signals depending on whether an expected value is for testing a rise or a fall of an output signal of the tested IC, and compares the expected value with the output signal at a proper timing specified by the selected strobe position signal. The IC tester avoids an error of test due to a deviation between the positions of the rise and fall of the output signal of the tested IC.
摘要翻译： IC测试仪正确地对集成电路（IC）执行功能测试。 IC测试者根据预期值是否用于测试被测IC的输出信号的上升或下降来选择两个选通位置信号中的一个，并且在所选择的适当时刻将期望值与输出信号进行比较选通位置信号。 IC测试仪由于测试IC的输出信号的上升和下降位置之间的偏差而避免了测试误差。

7. 发明授权

US5190813A Porous fluorores in material plated with a metal 失效
标题翻译：多孔氟化物镀金属材料
公开(公告)号：US5190813A
公开(公告)日：1993-03-02
申请号：US916924
申请日：1992-07-20
申请人： Kazuhiko Ohashi , Hiroshi Kato , Takayuki Wani
发明人： Kazuhiko Ohashi , Hiroshi Kato , Takayuki Wani
IPC分类号： B01D71/02 , B01D71/36 , B01J31/06 , B01J31/08 , B01J35/06 , B32B5/18 , B32B15/08 , B32B15/082 , B32B27/30 , D06M11/00 , D06M11/83 , D06M15/21 , D06M101/00 , D06M101/16 , D06M101/18 , D06M101/22 , G01N27/30 , H01B1/22 , H01M4/88 , H05K1/03 , H05K3/18 , H05K3/38 , H05K9/00
CPC分类号： H01M4/8668 , B01D67/0009 , B01D67/0069 , B01D69/145 , B01D71/022 , B01J31/08 , B01J35/065 , H01M4/8853 , B01D2323/02 , B01D2325/04 , B01D2325/16 , B01D2325/36 , H05K1/034 , H05K3/181 , H05K3/387 , Y10T428/249978 , Y10T428/24998 , Y10T428/249991 , Y10T428/249992 , Y10T428/31544
摘要： A platinum or platinum-alloy plated porous fluoropolymer membrane where the plated metal adheres to the membrane through a coating of a cation-exchange material on the membrane.
摘要翻译：铂或铂合金电镀的多孔含氟聚合物膜，其中电镀金属通过膜上阳离子交换材料的涂层粘附在膜上。

8. 发明授权

US5398252A Integrated circuit tester 失效
标题翻译：集成电路测试仪
公开(公告)号：US5398252A
公开(公告)日：1995-03-14
申请号：US794894
申请日：1991-11-20
申请人： Kazuhiko Ohashi
发明人： Kazuhiko Ohashi
IPC分类号： G01R31/28 , G01R31/3193 , G06F11/00
CPC分类号： G01R31/31935 , G06F2201/865
摘要： An integrated circuit tester uses the information compared between a test executed result and an expected value, for the operation of a driver, which applies test patterns to a device under test. Once a test executed result obtained from the device is compared with an expected value, the compared information is fedback to the driver so as to specify, for example, test cycles and test patterns. Therefore, in an evaluation of maximum operating frequencies, the failure which occurs in the (n+1)th lower frequency can be effectively observed without being masked by other failures which occur in the nth lower frequency or less.
摘要翻译：集成电路测试仪使用将测试模式应用于被测设备的驱动程序的操作的测试执行结果与期望值之间的信息进行比较。将从设备获得的测试执行结果与预期值进行比较后，将比较的信息反馈给驱动器，以指定例如测试周期和测试模式。因此，在最大工作频率的评价中，可以有效地观察发生在第（n + 1）低频中的故障，而不会被发生在第n次以下频率以下的其他故障所掩盖。

9. 发明申请

US20080284539A1 HIGH FREQUENCY CIRCUIT, SEMICONDUCTOR DEVICE, AND HIGH FREQUENCY POWER AMPLIFICATION DEVICE 有权
标题翻译：高频电路，半导体器件和高频功率放大器件
公开(公告)号：US20080284539A1
公开(公告)日：2008-11-20
申请号：US12118803
申请日：2008-05-12
申请人： Kazuki TATEOKA , Masahiko Inamori , Shingo Matsuda , Kazuhiko Ohashi , Haruhiko Koizumi
发明人： Kazuki TATEOKA , Masahiko Inamori , Shingo Matsuda , Kazuhiko Ohashi , Haruhiko Koizumi
IPC分类号： H03H7/38
CPC分类号： H03F3/189 , H03F1/56 , H03F2200/222 , H03F2200/255 , H03F2200/387 , H03F2200/423 , H03F2203/7233
摘要： A small, high performance, multifunctional high frequency circuit that is multiband and multimode compatible reduces loss from a switch formed on the output side of a final stage amplification unit. The final stage amplification unit power amplifies an input signal and outputs an amplified signal. A first matching circuit impedance converts the amplified signal input thereto at a first input impedance, and outputs a first impedance-converted signal at a first output impedance. A control unit that generates a control signal denoting signal path selection information. A switch unit selects one of at least two signal paths based on the control signal, passes the first impedance-converted signal at an on impedance through the selected path, and outputs the pass signal. A second matching circuit impedance converts a pass signal input thereto at a second input impedance, and outputs a second impedance-converted signal at a second output.
摘要翻译：多频和多模兼容的小型，高性能，多功能高频电路可以减少在最终级放大单元输出侧形成的开关损耗。最终级放大单元功率放大输入信号并输出放大信号。第一匹配电路阻抗以第一输入阻抗转换输入到其的放大信号，并输出第一输出阻抗的第一阻抗转换信号。控制单元，其生成表示信号路径选择信息的控制信号。开关单元基于控制信号选择至少两个信号路径中的一个，将通过所选路径的导通阻抗的第一阻抗转换信号传递，并输出通过信号。第二匹配电路阻抗以第二输入阻抗转换输入到其的通过信号，并在第二输出端输出第二阻抗转换信号。

10. 发明授权

US07307350B2 Integrated circuit chip bonding sheet and integrated circuit package 失效
标题翻译：集成电路芯片贴片和集成电路封装
公开(公告)号：US07307350B2
公开(公告)日：2007-12-11
申请号：US10175141
申请日：2002-06-19
申请人： Kazuhiko Ohashi , Osamu Yokomizo , Koji Yoshida
发明人： Kazuhiko Ohashi , Osamu Yokomizo , Koji Yoshida
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/83 , C08K3/016 , C08K5/0066 , C09J7/245 , C09J7/26 , C09J2201/128 , C09J2203/326 , C09J2205/102 , C09J2427/006 , H01L24/32 , H01L24/50 , H01L24/73 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/83194 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , Y10T428/249953 , Y10T428/249958 , Y10T428/249982 , Y10T428/249985 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512
摘要： An IC chip bonding sheet having adhesive resin layers formed on both faces of a porous polytetrafluoroethylene layer comprising a porous polytetrafluoroethylene sheet, the porous polytetrafluoroethylene layer retaining porous voids, and the adhesive resin layers comprising a bromine-free flame retardant resin composition.
摘要翻译：一种具有粘合树脂层的IC芯片接合片，其在包含多孔聚四氟乙烯片的多孔聚四氟乙烯层的两个表面上形成，所述多孔聚四氟乙烯层保持多孔性空隙，并且所述粘合树脂层包含无溴阻燃树脂组合物。

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