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1. 发明专利

JP2012212532A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2012212532A
公开(公告)日：2012-11-01
申请号：JP2011076714
申请日：2011-03-30
申请人： Toyoda Gosei Co Ltd , Sumita Optical Glass Inc , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： SUEHIRO YOSHINOBU , TAKAKU KOJI , TERAJIMA TORU
IPC分类号： F21S2/00 , F21Y101/02 , G02F1/13357
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device that can enhance inner-face accuracy of a housing space formed in light guide plates for housing a light source, and thereby, with a distribution of emitting light from the light guide plate uniformalized.SOLUTION: The light-emitting device 1 includes: a light source 3A having an element-mounting substrate 33; LED elements 32 mounted on the element-mounting substrate 33, and a glass sealing part 34 for sealing the LED elements 32 on the element-mounting substrate 33; and light guide plates 2A, 2B made of a platy translucent member and having concave parts 20a, 20b housing at least a part of the light source 3A. The concave parts 20a, 20b are formed in notching to extend in a thickness direction of the light guide plates 2A, 2B from rear faces 23 toward surfaces 22 of the same 2A, 2B at positions corresponding to the light sources 3A in an extension direction of end faces 21a, 21b of the light guide plates 2A, 2B. The light source 3A has side faces 34b emitting light in a direction orthogonal to an optical axis parallel with the thickness direction of the light guide plates 2A, 2B.
摘要翻译：要解决的问题：提供一种能够提高形成在用于容纳光源的导光板中形成的容纳空间的内表面精度的发光装置，从而由来自导光体的发光的分布板均匀化。解决方案：发光装置1包括：具有元件安装基板33的光源3A; 安装在元件安装基板33上的LED元件32和用于密封元件安装基板33上的LED元件32的玻璃密封部34; 以及由板状半透明构件制成并具有容纳光源3A的至少一部分的凹部20a，20b的导光板2A，2B。凹部20a，20b形成为在导光板2A，2B的厚度方向上从后表面23朝向相同的2A，2B的表面22在与光源3A相对应的位置沿着延伸方向导光板2A，2B的端面21a，21b。光源3A具有在与导光板2A，2B的厚度方向平行的光轴正交的方向上发光的侧面34b。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012064787A Method of manufacturing light-emitting device 审中-公开
标题翻译：制造发光装置的方法
公开(公告)号：JP2012064787A
公开(公告)日：2012-03-29
申请号：JP2010208147
申请日：2010-09-16
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： YAMAGUCHI SEIJI , TAKAKU KOJI , TAJIMA HIROYUKI , WADA SATOSHI , MORIYAMA MIKI , AIDA KAZUYA , WATABE HIROMI
IPC分类号： H01L33/56
CPC分类号： C03C27/00 , H01L33/56 , H01L2224/13 , H01L2933/005
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting device in which thermal damage on a light-emitting element can be suppressed during hot press of the light-emitting device having a glass-sealed light-emitting element mounted on a substrate.SOLUTION: The method of manufacturing a light-emitting device comprises: a first step of heating a low melting point glass 4 arranged to face an upper die 61 by means of the upper die 61 heated to a temperature higher than the yield temperature of the low melting point glass 4; and a second step of sealing an LED element 2 mounted on an AlOsubstrate 3 with the low melting point glass 4 by pressing the low melting point glass 4 and the AlOsubstrate 3 supported on a lower die 51 while facing each other in a state where the low melting point glass 4 is heated above the yield temperature.
摘要翻译：解决的问题：提供一种制造发光器件的方法，其中在具有玻璃密封发光元件的发光器件的热压期间可以抑制发光元件的热损伤安装在基板上。解决方案：制造发光器件的方法包括：第一步骤，通过加热到高于屈服温度的上模61加热布置成面对上模61的低熔点玻璃4 的低熔点玻璃4; 以及用低熔点玻璃4密封安装在Al 2 O 3 衬底3上的LED元件2的第二步骤通过按压低熔点玻璃4和支撑在下模51上同时彼此面对的Al 2 O 3 在低熔点玻璃4被加热到高于屈服温度的状态下。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011134485A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2011134485A
公开(公告)日：2011-07-07
申请号：JP2009291145
申请日：2009-12-22
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： TERAJIMA TORU , SUEHIRO YOSHINOBU , TAKAKU KOJI
IPC分类号： F21S2/00 , F21Y101/02 , H01L33/58
CPC分类号： H01L2224/4809 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device housing in a housing hole extending, to a thickness direction of a light guide plate, a light source for emitting light not only from a side but also from an upper side without impairing luminous efficiency.
SOLUTION: The light-emitting device 100 includes: a light source 3 having an element mounting substrate 33, an LED element 32 mounted on the element mounting substrate 33 by flip-chip bonding, and a sealing part 34 to seal the LED element 32 on the element mounting substrate 33; and a light guide plate 1 having a housing hole 2 in which the light source is housed. The housing hole 2 extends from one face 11 of the light guide plate 1 to the other face 12 side, a range out of an inner face 21 where the light from the light source 3 enters is in parallel with a thickness direction of the light guide plate 1, and the light source 3 is housed in the housing hole 2 so that the element mounting substrate 33 may be on the other face 12 side of the light guide plate 1 and emits light to the one face 11 side of the light guide plate 1 of the housing hole 2 and to the inner face 21 side of the housing hole 2. Moreover, an optical axis is in parallel with a thickness direction of the light guide plate 1 and a solid angle of the inner face 21 of the housing hole 2 against a central part of an upper face 34a of the light guide plate 1 in the light source 3 is 4.44 steradian or more.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种发光装置壳体，其在沿导光板的厚度方向延伸的壳体孔中，不仅从一侧发射光，而且从上侧发射光，而不用损害发光效率。解决方案：发光装置100包括：具有元件安装基板33的光源3，通过倒装芯片接合安装在元件安装基板33上的LED元件32和密封LED 元件32在元件安装基板33上; 以及具有容纳孔2的导光板1，容纳孔2容纳光源。壳体孔2从导光板1的一个面11延伸到另一个面12侧，来自光源3的光进入的内表面21的范围与光导的厚度方向平行板1，并且光源3容纳在容纳孔2中，使得元件安装基板33可以在导光板1的另一个面12侧上，并且向导光板的一个面11侧发光另外，光轴与导光板1的厚度方向平行，容纳孔的内表面21的立体角 2相对于光源3中的导光板1的上表面34a的中心部分为4.44度以上。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2011204566A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2011204566A
公开(公告)日：2011-10-13
申请号：JP2010072479
申请日：2010-03-26
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： SUEHIRO YOSHINOBU , TERAJIMA TORU , TAKAKU KOJI
IPC分类号： F21S2/00 , F21Y101/02 , H01L33/48
CPC分类号： H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device in which, without damaging light-emitting efficiency, a light source to emit light not only sideward but also upward is housed in a through hole extended in a direction of thickness of a light-guide plate.SOLUTION: The light-emitting device includes: the light source 3 having an element mounting substrate 33, an LED element 32 mounted on the element mounting substrate 33 by flip chip connection, and a sealing portion 34 for sealing the LED element 32 on the element mounting substrate 33; and the light-guide plate 2 having the through hole 21 in which the light source 3 is housed. When an angle of the inner face 24 of the through hole 21 against the other face 23 of the light-guide plate 2 is denoted by α, and a refraction index of the light-guide plate 2 is denoted by n, a relational expression of 90°-Sin[{sin(90°-α)}/n]+α≥Sin(1/n) is satisfied.
摘要翻译：要解决的问题：提供一种发光装置，其不损害发光效率，光源不仅侧向发光，而且向上容纳在沿着发光元件的厚度方向延伸的通孔中，导光板。解决方案：发光装置包括：具有元件安装基板33的光源3，通过倒装连接安装在元件安装基板33上的LED元件32和用于密封LED元件32的密封部34 在元件安装基板33上; 导光板2具有容纳光源3的通孔21。当通孔21的内表面24相对于导光板2的另一面23的角度被表示为α时，导光板2的折射率由n表示，关系式表示为 90°-Sin [{sin（90°-α）} / n] +α≥Sin（1 / n）。

5. 发明专利

JP2007080994A Solid element device and light emitting device employing it 有权
标题翻译：固体元件装置和使用其的发光装置
公开(公告)号：JP2007080994A
公开(公告)日：2007-03-29
申请号：JP2005264896
申请日：2005-09-13
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： SAWANOBORI SHIGETO , OTSUKA MASAAKI , AIDA KAZUYA , SAKAJI HIROKO , WATABE HIROMI , YAMAGUCHI SEIJI , SUEHIRO YOSHINOBU , TAKAKU KOJI
IPC分类号： H01L33/32 , H01L33/40 , H01L33/46 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L33/505 , H01L25/0753 , H01L33/486 , H01L33/507 , H01L33/56 , H01L33/60 , H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a solid element device capable of dispersing fluorescent body uniformly into glass, and the light emitting device employing it.
SOLUTION: An LED (light emitting diode) element 12 is mounted on a ceramic substrate 11 while the LED element 12 is sealed by a wavelength changing unit 20 consisting of a fluorescent layer 13 provided in sealing glass 14. The fluorescent layer 13 is formed by mixing fluorescent body into glass filler to apply or print it on the inner surface of one sheet in two sheets of sealing glasses before effecting hot press.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够将荧光体均匀地分散在玻璃中的固体元件装置和使用它的发光装置。解决方案：LED（发光二极管）元件12安装在陶瓷基板11上，而LED元件12被由设置在密封玻璃14中的荧光层13组成的波长改变单元20密封。荧光层13 通过将荧光体混合到玻璃填料中以在进行热压之前在两片密封玻璃的一片的内表面上进行涂布或印刷而形成。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2011210674A Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2011210674A
公开(公告)日：2011-10-20
申请号：JP2010079391
申请日：2010-03-30
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： SUEHIRO YOSHINOBU , TERAJIMA TORU , TAKAKU KOJI
IPC分类号： F21S2/00 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device which can house a light source in a hole part of a light guide plate without losing light emission efficiency.SOLUTION: The light emitting device 1 includes: the light source 3 having an LED element 32 mounted on an element mounting substrate 33 by flip-chip connection, and a sealing portion 34 for sealing the LED element 32 on the element mounting substrate 33; and the light guide plate 2 having the hole part 21 for housing the light source 3. The light emitting device 1 further includes a reflection surface 26a which blocks the hole part 21 at the other surface 22 side of the light guide plate 2 and reflects at least a part of light emitted from the light source 3.
摘要翻译：要解决的问题：提供一种可以将光源容纳在导光板的孔部分中而不丧失发光效率的发光器件。解决方案：发光器件1包括：光源3，其具有LED元件32 通过倒装芯片连接安装在元件安装基板33上，以及用于密封元件安装基板33上的LED元件32的密封部34; 以及具有用于容纳光源3的孔部21的导光板2.发光装置1还包括反射面26a，该反射面26a阻挡导光板2的另一面22侧的孔部21，从光源3发射的光的至少一部分。

7. 发明专利

JP2008288543A Solid-state element device 有权
标题翻译：固态元件设备
公开(公告)号：JP2008288543A
公开(公告)日：2008-11-27
申请号：JP2007190627
申请日：2007-07-23
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： OTSUKA MASAAKI , SAWANOBORI SHIGETO , AIDA KAZUYA , WATABE HIROMI , SUEHIRO YOSHINOBU , YAMAGUCHI SEIJI , TAKAKU KOJI
IPC分类号： H01L31/02 , H01L33/32 , H01L33/44 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/62
CPC分类号： H01L24/97 , H01L2224/16225 , H01L2924/15787 , H01L2924/181 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide excellent weather resistance as well as stability of a glass sealing part. SOLUTION: The device includes an LED element 2; an Al 2 O 3 board 3 and a circuit pattern 4 for mounting the LED element 2 and performing reception and supply of electric power; and a glass sealing part 6 consisted of heat fused glass of a B 2 O 3 -SiO 2 -Li 2 O-Na 2 O-ZnO-Nb 2 O 5 system and sealing the LED element 2. The heat fused glass contains 21 to 23 wt.% B 2 O 3 , 11 to 13 wt.% SiO 2 , 1 to 1.5 wt.% Li 2 O, and 2 to 2.5 wt.% Na 2 O. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供优异的耐候性以及玻璃密封部件的稳定性。
解决方案：该装置包括LED元件2; 基板3和用于安装LED元件2并执行电力接收和供电的电路图案4; 以及玻璃密封部6，由玻璃密封部6组成，该玻璃密封部6由B＆lt; SB＆gt; 3＆lt; SB＆gt; -SiO＆lt; SB＆gt; > O-Na 2 O-ZnO-Nb 2 5 系统并密封LED元件2.热熔玻璃包含21至23 重量％B 2 3，SB 11，13〜13重量％SiO 2，1〜1.5重量％Li < / SB> O和2〜2.5重量％的Na 2 SBB。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2014022055A Light emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2014022055A
公开(公告)日：2014-02-03
申请号：JP2012156413
申请日：2012-07-12
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： YABUTA YUKIKO , ITO HIROSHI , TAKAKU KOJI , TERAUE KOJI
IPC分类号： F21S2/00 , F21V7/00 , F21Y101/02 , H01L33/60
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device with a wide light distribution range.SOLUTION: A light emitting device 10 according to one embodiment of the present invention has: a substrate 11 having a first region 11a, and a second annular region 11b surrounding the first region 11a; a first LED chip 12 arranged on the first region 11a of the substrate 11; a second LED chip 13 arranged on the second region 11b of the substrate 11; and an annular reflection member 14 for reflecting at least one part of light emitted from the second LED chip 13 to a side of the substrate 11.
摘要翻译：要解决的问题：提供具有宽的配光范围的发光器件。解决方案：根据本发明的一个实施例的发光器件10具有：具有第一区域11a和第二环形区域11b的衬底11 围绕第一区域11a; 布置在基板11的第一区域11a上的第一LED芯片12; 布置在基板11的第二区域11b上的第二LED芯片13; 以及用于将从第二LED芯片13发射的光的至少一部分反射到基板11的一侧的环形反射部件14。

9. 发明专利

JP2013033890A Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2013033890A
公开(公告)日：2013-02-14
申请号：JP2011170074
申请日：2011-08-03
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： SUEHIRO YOSHINOBU , TAKAKU KOJI
IPC分类号： H01L33/58 , H01L33/50
CPC分类号： H01L33/46 , H01L33/507 , H01L2224/16225 , H01L2924/181 , H01L2933/0091 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device which reduces the optical loss and enhances the light extraction efficiency.SOLUTION: A light emitting device 1 comprises: an element mounting substrate 2 having circuit patterns 20, 21 on an element mounting surface 2a; an LED element 3 mounted on the element mounting side of the element mounting substrate 2 and connecting with the circuit patterns 20, 21; a seal member 4 sealing the LED element 3 and joined to the element mounting surface 2a; and a coating layer 5 coating the element mounting side of the element mounting substrate 2 in the seal member 4. The refraction index of the coating layer 5 is set so as to be lower than the refraction index of the seal member 4.
摘要翻译：解决的问题：提供减少光损耗并提高光提取效率的发光装置。解决方案：发光器件1包括：元件安装基板2，其在元件安装表面2a上具有电路图案20,21; 安装在元件安装基板2的元件安装侧并与电路图案20,21连接的LED元件3; 密封件4，密封LED元件3并连接到元件安装表面2a; 以及在元件安装基板2的元件安装面上涂覆密封部件4的涂布层5.涂布层5的折射率设定为低于密封部件4的折射率。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2010199203A Light-emitting device and method of manufacturing the same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：JP2010199203A
公开(公告)日：2010-09-09
申请号：JP2009040765
申请日：2009-02-24
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： SUEHIRO YOSHINOBU , TAKAKU KOJI
IPC分类号： H01L33/64 , F21S2/00 , F21V19/00 , F21V29/00 , F21Y101/02 , H01L23/36
CPC分类号： H01L33/64 , F21S4/28 , F21S48/328 , F21V7/005 , F21V29/004 , F21V29/75 , F21V29/76 , F21V29/763 , F21Y2103/10 , F21Y2115/10 , Y10S362/80
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device and a method for manufacturing the same which can enhance heat dissipation efficiency, without increasing the number of components and the number of manufacturing processes, even when using a heat dissipation member made of aluminum, an aluminum alloy, a magnesium or a magnesium alloy. SOLUTION: This light-emitting device 1 includes: a light-emitting part 2, having a metal part 26 made of a metal jointable with solder material 3; and a heat-dissipating member 4 having a film for heat dissipation made of the aluminum, aluminum alloy, magnesium, or magnesium alloy, and formed on the surface, and a jointing part 43 which is formed inside the film for heat dissipation on the surface, and is performed processing in which the jointing part 43 is jointable to the solder material. The metal part 26 of the light-emitting part 2 is jointed to the jointing part of the heat-dissipating member 4 by the solder material 3. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种可以提高散热效率的发光装置及其制造方法，而不增加部件的数量和制造工艺的数量，即使使用制造的散热构件的铝，铝合金，镁或镁合金。解决方案：该发光装置1包括：发光部2，具有由与焊料3接合的金属制成的金属部26; 以及形成在表面上的具有由铝，铝合金，镁或镁合金制成的散热用薄膜的散热构件4，以及形成在膜内部的用于散热表面的接合部43 并且执行其中接合部43可与焊料材料接合的处理。发光部2的金属部26通过焊料3与散热构件4的接合部接合。（C）2010，JPO＆INPIT

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