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1. 发明专利

JP2012064787A Method of manufacturing light-emitting device 审中-公开
标题翻译：制造发光装置的方法
公开(公告)号：JP2012064787A
公开(公告)日：2012-03-29
申请号：JP2010208147
申请日：2010-09-16
申请人： Sumita Optical Glass Inc , Toyoda Gosei Co Ltd , 株式会社住田光学ガラス , 豊田合成株式会社
发明人： YAMAGUCHI SEIJI , TAKAKU KOJI , TAJIMA HIROYUKI , WADA SATOSHI , MORIYAMA MIKI , AIDA KAZUYA , WATABE HIROMI
IPC分类号： H01L33/56
CPC分类号： C03C27/00 , H01L33/56 , H01L2224/13 , H01L2933/005
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting device in which thermal damage on a light-emitting element can be suppressed during hot press of the light-emitting device having a glass-sealed light-emitting element mounted on a substrate.SOLUTION: The method of manufacturing a light-emitting device comprises: a first step of heating a low melting point glass 4 arranged to face an upper die 61 by means of the upper die 61 heated to a temperature higher than the yield temperature of the low melting point glass 4; and a second step of sealing an LED element 2 mounted on an AlOsubstrate 3 with the low melting point glass 4 by pressing the low melting point glass 4 and the AlOsubstrate 3 supported on a lower die 51 while facing each other in a state where the low melting point glass 4 is heated above the yield temperature.
摘要翻译：解决的问题：提供一种制造发光器件的方法，其中在具有玻璃密封发光元件的发光器件的热压期间可以抑制发光元件的热损伤安装在基板上。解决方案：制造发光器件的方法包括：第一步骤，通过加热到高于屈服温度的上模61加热布置成面对上模61的低熔点玻璃4 的低熔点玻璃4; 以及用低熔点玻璃4密封安装在Al 2 O 3 衬底3上的LED元件2的第二步骤通过按压低熔点玻璃4和支撑在下模51上同时彼此面对的Al 2 O 3 在低熔点玻璃4被加热到高于屈服温度的状态下。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2017079311A 発光装置の製造方法审中-公开
公开(公告)号：JP2017079311A
公开(公告)日：2017-04-27
申请号：JP2015207974
申请日：2015-10-22
申请人：豊田合成株式会社 , Toyoda Gosei Co Ltd
发明人： TSUCHIYA YOSUKE , TAJIMA HIROYUKI , MORI TOSHIAKI
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L33/0095 , H01L33/502 , H01L33/56 , H01L33/62 , H01L2224/16245 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
摘要：【課題】リフレクタを備える発光装置の簡便な製造方法を提供する。【解決手段】基板20の上にLEDチップ10を載置するチップ載置ステップと、LEDチップを封止する透光性の封止層30を形成する封止層形成ステップと、封止層の上に保護層を形成する保護層形成ステップと、基板に対してLEDチップを載置した側とは反対の側から、基板および封止層を貫通する溝を刃によって形成する溝形成ステップであって、溝形成ステップは、刃として、その縁部へ向かって先細りとなる形状を有する刃を用いる。【選択図】図1

3. 发明专利

JP2014041993A Light-emitting device and method of manufacturing the same 审中-公开
标题翻译：发光装置及其制造方法
公开(公告)号：JP2014041993A
公开(公告)日：2014-03-06
申请号：JP2013031811
申请日：2013-02-21
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： TSUCHIYA YOSUKE , TAJIMA HIROYUKI , SHIMONISHI SHOTA , SENGOKU AKIRA
IPC分类号： H01L33/64 , H01L33/50 , H01L33/52
CPC分类号： H01L33/644 , H01L33/502 , H01L2224/48091 , H01L2224/48247 , H01L2924/1301 , H05B33/04 , H05B33/10 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve heat generation from phosphor particles in a light-emitting device.SOLUTION: A light-emitting device, in which a light-emitting element mounted on a substrate having on its surface a conductor layer connected to the outside is sealed, includes: a phosphor layer arranged above the light-emitting element; and a resin layer which is in contact with both the phosphor layer and the conductor layer and in which thermally conductive particles having a thermal conductivity of 100 W/m K or more and insulator or semiconductor characteristics are dispersed. Since the thermally conductive particles are dispersedly arranged between the phosphor layer as a heating element and the conductor layer as a heat dissipation path, thermal resistance between phosphor particles and the conductor layer is reduced to promote heat dissipation from the phosphor particles. Thus, deterioration due to heat of a member constituting the light-emitting device can be suppressed.
摘要翻译：要解决的问题：为了改善发光装置中的荧光体颗粒的发热。解决方案：一种发光装置，其中安装在其表面上具有连接到外部的导体层的表面的基板上的发光元件是包括：配置在发光元件上方的荧光体层; 以及与荧光体层和导体层接触的树脂层，其中分散有导热率为100W / m·K以上的导热性粒子和绝缘体或半导体特性。由于导热粒子分散配置在作为加热元件的荧光体层和作为散热路径的导体层之间，因此降低了荧光体粒子与导体层之间的热阻，促进了荧光体粒子的散热。因此，可以抑制由构成发光装置的构件的热引起的劣化。

4. 发明专利

JP2014017415A Led mounting substrate and manufacturing method of the same 有权
标题翻译： LED安装基板及其制造方法
公开(公告)号：JP2014017415A
公开(公告)日：2014-01-30
申请号：JP2012154827
申请日：2012-07-10
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： TSUCHIYA YOSUKE , SHIMONISHI SHOTA , TAJIMA HIROYUKI , SENGOKU AKIRA
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L2224/13 , H05K1/0274 , H05K2201/09745 , H05K2201/2054
摘要： PROBLEM TO BE SOLVED: To provide an LED mounting substrate which forms a light emitting device achieving excellent light extraction efficiency, and to provide a manufacturing method of the LED mounting substrate.SOLUTION: An LED mounting substrate 10 according to one embodiment of this invention includes: a base substrate 11; a conductive pattern 12 which is located on the base substrate 11 and has recessed parts 12b on an upper surface; and a light reflection film 13 located in an inter-pattern gap 12a of the conductive pattern 12 on the base substrate 11 and the recessed parts 12b of the conductive pattern 12.
摘要翻译：要解决的问题：提供一种形成发光器件的LED安装基板，其获得优异的光提取效率，并提供LED安装基板的制造方法。解决方案：根据本发明的一个实施例的LED安装基板10包括基底基板11; 导电图案12，其位于基底基板11上并且在上表面上具有凹部12b; 以及位于基底基板11上的导电图案12的图案间间隙12a和导电图案12的凹部12b之间的光反射膜13。

5. 发明专利

JP2013157423A Semiconductor device manufacturing method and semiconductor device 有权
标题翻译：半导体器件制造方法和半导体器件
公开(公告)号：JP2013157423A
公开(公告)日：2013-08-15
申请号：JP2012016268
申请日：2012-01-30
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： SHIMONISHI SHOTA , TAJIMA HIROYUKI , TSUCHIYA YOSUKE , SENGOKU AKIRA
IPC分类号： H01L21/52
CPC分类号： H01L24/80 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/2908 , H01L2224/29144 , H01L2224/29294 , H01L2224/29339 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2224/81193 , H01L2224/83192 , H01L2224/83193 , H01L2224/83801 , H01L2224/83805 , H01L2224/92247 , H01L2924/00014 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/1033 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2933/0066 , H01L2924/0105 , H01L2924/01079 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device, which can bond a semiconductor element and a substrate at a low heating temperature and which have good reliability.SOLUTION: A semiconductor device manufacturing method comprises a mounting step of mounting a semiconductor element having an Au-Sn layer on a substrate. The mounting step includes: a paste supply step of supplying an Ag paste having Ag nanoparticles on the substrate; an element placement step of placing the Au-Sn layer side of the semiconductor element on the Ag paste; and a bonding step of bonding the semiconductor element and the substrate by alloying the Au-Sn layer and the Ag paste. With this bonding mechanism, bonding reliability can be improved and low-temperature bonding is enabled.
摘要翻译：要解决的问题：提供半导体器件制造方法和半导体器件，其可以在低加热温度下结合半导体元件和衬底，并且具有良好的可靠性。解决方案：半导体器件制造方法包括安装步骤在衬底上具有Au-Sn层的半导体元件。安装步骤包括：膏体供应步骤，在基底上提供具有Ag纳米颗粒的Ag浆料; 将所述半导体元件的Au-Sn层侧放置在所述Ag糊料上的元件配置工序; 以及通过使Au-Sn层和Ag浆料合金化来接合半导体元件和基板的接合工序。通过该接合机构，可以提高接合可靠性，能够实现低温接合。

6. 发明专利

JP2012134253A Led module for illumination 审中-公开
标题翻译： LED模块用于照明
公开(公告)号：JP2012134253A
公开(公告)日：2012-07-12
申请号：JP2010283739
申请日：2010-12-20
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： SHIMONISHI SHOTA , TAJIMA HIROYUKI , TSUCHIYA YOSUKE , KATO HIDEAKI
IPC分类号： H01L33/62
CPC分类号： H05K1/026 , F21K9/00 , F21V25/10 , F21Y2105/10 , F21Y2115/10 , H05B33/0821 , H05K1/0269 , H05K2201/09381 , H05K2201/10106 , H05K2201/2054 , H05K2203/162 , Y02B20/341
摘要： PROBLEM TO BE SOLVED: To provide an LED module for illumination capable of protecting LED chips from overvoltage at a low cost.SOLUTION: An LED module for illumination comprises: a wiring substrate on which a plurality of wiring patterns are formed; a plurality of LED chips that are connected to each of the wiring patterns and constitute a series circuit or a series-parallel circuit; and an anode-side wiring pattern constituting an anode-side electrode of the circuit and a cathode-side wiring pattern constituting a cathode-side electrode of the circuit in each of the wiring patterns. The anode-side wiring pattern and the cathode-side wiring pattern are disposed so as to surround connection regions between each of the wiring patterns and each of the LED chips to form a guard electrode, and both ends of the anode-side wiring pattern and both ends of the cathode-side wiring pattern are faced to each other with a space.
摘要翻译：要解决的问题：提供一种能够以低成本保护LED芯片免受过电压的照明的LED模块。解决方案：用于照明的LED模块包括：布线基板，其上形成有多个布线图案; 连接到每个布线图案并构成串联电路或串并联电路的多个LED芯片; 以及构成电路的阳极侧电极的阳极侧布线图案和构成每个布线图案中的电路的阴极侧电极的阴极侧布线图案。阳极侧布线图案和阴极侧布线图案被布置成围绕每个布线图案和每个LED芯片之间的连接区域以形成保护电极，并且阳极侧布线图案的两端和阴极侧布线图案的两端面对空间。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011066335A Method of manufacturing light-emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：JP2011066335A
公开(公告)日：2011-03-31
申请号：JP2009217721
申请日：2009-09-18
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： SHIMONISHI SHOTA , TAJIMA HIROYUKI , TSUCHIYA YOSUKE
IPC分类号： H01L33/50
摘要： PROBLEM TO BE SOLVED: To provide a method requiring only one type of die for molding, in a method of manufacturing a light-emitting device including a light-emitting element, a fluorescent material arranged in the vicinity of a surface of the light-emitting element, and a lens part formed of a first silicone resin covering the light-emitting element.
SOLUTION: The method is used for manufacturing a light-emitting device including a light-emitting element, a fluorescent material arranged in the vicinity of a surface of the light-emitting element, and a lens part formed of a first silicone resin covering the light-emitting element. The method of manufacturing the light-emitting device includes steps of: forming a primer layer formed of an uncured second silicone resin on a surface of the light-emitting element; supporting the fluorescent material to the primer layer; and setting the light-emitting element in a die in a state where the primer layer is not cured, and curing both the first silicone resin and the second silicone resin when forming the lens part by compressing and molding the first silicone resin.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种仅需要一种模具的模具的方法，在制造包括发光元件的发光装置的方法中，布置在该表面附近的荧光材料发光元件和由覆盖发光元件的第一硅树脂形成的透镜部分。解决方案：该方法用于制造包括发光元件，布置在发光元件的表面附近的荧光材料的发光器件和由第一有机硅树脂形成的透镜部分覆盖发光元件。制造发光器件的方法包括以下步骤：在发光元件的表面上形成由未固化的第二硅树脂形成的底漆层; 将荧光材料支撑到底漆层; 并且在底漆层未固化的状态下将发光元件设置在模具中，并且通过压缩和模塑第一有机硅树脂来形成透镜部分时，固化第一硅树脂和第二硅树脂。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2009048915A Led lamp, and led lamp module 审中-公开
标题翻译： LED灯和LED灯模块
公开(公告)号：JP2009048915A
公开(公告)日：2009-03-05
申请号：JP2007215252
申请日：2007-08-21
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： SHIMONISHI SHOTA , TAJIMA HIROYUKI , YAMAGUCHI TOSHIO
IPC分类号： F21V23/00 , F21V29/00 , H01L33/56 , H01L33/62 , H01L33/64
摘要： PROBLEM TO BE SOLVED: To achieve an LED lamp module in which the connection state between an LED lamp using a substrate made of ceramics and a wiring substrate is improved.
SOLUTION: The LED lamp module 10 is composed of an LED lamp 100 and a wiring substrate 150. The LED lamp 100 is disposed in a recess 151 formed in the wiring substrate 150. A ceramic substrate 101 of the LED lamp 100 has a two-layer structure formed of an upper layer 104 and a lower layer 105, and an external connection terminal 112 is formed on a side surface 104a of the upper layer 104. A through hole 111 is formed to penetrate the ceramic substrate 101, and a heat dissipation plate 113 is formed all over the rear surface of the lower layer 105. A plate spring-shaped terminal 153 is formed in the vicinity of the recess 151 of the wiring substrate 150. The plate spring-shaped terminal 153 is pressed against and is in contact with the external connection terminal 112.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：为了实现其中使用由陶瓷制成的基板的LED灯和布线基板之间的连接状态得到改善的LED灯模块。 LED灯模块10由LED灯100和布线基板150构成.LED灯100设置在形成在布线基板150上的凹部151中。LED灯100的陶瓷基板101具有由上层104和下层105形成的两层结构，以及外部连接端子112形成在上层104的侧面104a上。通孔111形成为穿透陶瓷基板101，并且在下层105的整个后表面上形成散热板113.在布线基板150的凹部151附近形成有板簧形端子153.板簧端子153被压靠并与外部连接端子112接触。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2009026846A Led package, and display device 审中-公开
标题翻译： LED封装和显示设备
公开(公告)号：JP2009026846A
公开(公告)日：2009-02-05
申请号：JP2007186672
申请日：2007-07-18
申请人： Toyoda Gosei Co Ltd , 豊田合成株式会社
发明人： TAJIMA HIROYUKI , ANDO YOSHIHISA , DEMUKAI YUKIHIRO
IPC分类号： H01L33/32 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an LED package and a display device which have excellent light extraction efficiency and a sufficient view angle.
SOLUTION: An LED element mounted surface 11D is made close to the optical shape surface 15A of an elliptically formed lens 15 and is disposed above the surface 15A in a (z) direction, and a filler 2 is injected below a reflector tip surface 11B in the (z) direction to seal the LED package 1. Consequently, the light extraction efficiency is improved as compared with the conventional LED package. Further, an interface 11C between a case 11 and the lens 15 is provided below the LED element mounted surface 11D in the (z) direction, and the filler 2 is injected above the interface 11C in the (z) direction to seal the LED package 1. Consequently, intrusion of a foreign substance from the interface 11C can be prevented and the display device having the LED package 1 can withstand the outdoor use.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供具有优异的光提取效率和足够的视角的LED封装和显示装置。解决方案：将LED元件安装表面11D制成靠近椭圆形透镜15的光学形状表面15A，并且沿着（z）方向设置在表面15A的上方，并且将填料2注入反射器尖端（z）方向的表面11B以密封LED封装1.因此，与传统的LED封装相比，光提取效率提高。此外，在LED元件安装面11D的（z）方向的下方设置有壳体11和透镜15之间的界面11C，并且在（z）方向上将填充物2注入到界面11C的上方，以密封LED封装因此，可以防止异物从界面11C的侵入，并且具有LED封装1的显示装置能够经受室外使用。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2005280466A Knee protective device 有权
标题翻译： KNEE保护装置
公开(公告)号：JP2005280466A
公开(公告)日：2005-10-13
申请号：JP2004096402
申请日：2004-03-29
申请人： Toyoda Gosei Co Ltd , Toyota Motor Corp , トヨタ自動車株式会社 , 豊田合成株式会社
发明人： TAJIMA HIROYUKI , SATO TAKAHIKO , FUKAWATASE OSAMU , KATO TAKEAKI
IPC分类号： B60R21/045 , B60K37/00
摘要： PROBLEM TO BE SOLVED: To provide a knee protective device capable of precisely protecting not only knees but also shins under the knees at the time of vehicle collision.
SOLUTION: The knee protective device S is provided with a knee protective panel 21 which is drawn out to a front side of the knees of an occupant by a driving mechanism at the time of the vehicle collision and restrains the knees moving forward to absorb kinetic energy of the knees. The knee protective panel 21 has a vertical dimension for interfering with the knees and shins under the knees of the occupant, and is constituted so that a shock absorbing part 25 plastically deformed when interfering with the knees and shins to absorb the kinetic energy thereof is provided. The shock absorbing part 25 is constituted so that a load in plastic deformation for reducing vertical thickness is set to be larger on an upper part 25a side interfering with the knees than that on a lower part 25b side interfering with the shins.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种膝盖保护装置，其能够在车辆碰撞时不仅可以精确地保护膝盖，而且可以在膝盖下方保持松弛。解决方案：膝盖保护装置S设置有膝部保护面板21，膝盖保护面板21在车辆碰撞时通过驱动机构被拉出到乘员的膝盖的前侧，并且限制膝盖向前移动吸收膝盖的动能。膝盖保护面板21具有垂直尺寸，用于干扰乘员膝盖之下的膝盖和胫骨，并且被构造成使得当与膝盖和胫骨干涉以吸收其动能时塑性变形的冲击吸收部分25被设置。冲击吸收部25构成为，与干燥胫骨的下部25b侧相比，在与膝部相比干扰的上部25a侧的上部25a侧的垂直厚度减小的塑性变形的载荷被设定得较大。版权所有（C）2006，JPO＆NCIPI

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