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1. 发明申请

US20070179660A1 Double side wafer grinder and methods for assessing workpiece nanotopology 有权
标题翻译：双面晶圆研磨机和评估工件纳米拓扑学的方法
公开(公告)号：US20070179660A1
公开(公告)日：2007-08-02
申请号：US11617433
申请日：2006-12-28
申请人： Sumeet Bhagavat , Milind Bhagavat , Roland Vandamme , Tomomi Komura
发明人： Sumeet Bhagavat , Milind Bhagavat , Roland Vandamme , Tomomi Komura
IPC分类号： B24B51/00 , B24B49/00 , B24B7/30 , B24B7/00
CPC分类号： B24B37/28 , B24B7/228 , B24B49/02
摘要： A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned between the hydrostatic pads. At least one sensor measures a distance between the workpiece and the respective sensor for assessing nanotopology of the workpiece. In a method of the invention, a distance to the workpiece is measured during grinding and used to assess nanotopology of the workpiece. For instance, a finite element structural analysis of the workpiece can be performed using sensor data to derive at least one boundary condition. The nanotopology assessment can begin before the workpiece is removed from the grinder, providing rapid nanotopology feedback. A spatial filter can be used to predict the likely nanotopology of the workpiece after further processing.
摘要翻译：双面研磨机包括一对砂轮和一对静压垫，其可操作以保持平坦工件（例如，半导体晶片），使得工件的一部分位于砂轮之间并且部分工件位于静水压垫至少一个传感器测量工件和相应传感器之间的距离，用于评估工件的纳米拓扑学。在本发明的方法中，在研磨期间测量与工件的距离，并用于评估工件的纳米拓扑学。例如，可以使用传感器数据来执行工件的有限元结构分析以导出至少一个边界条件。纳米技术评估可以在从研磨机上取出工件之前开始，提供快速的纳米拓扑反馈。可以使用空间滤波器来进一步处理后预测工件的可能纳米拓扑。

2. 发明申请

US20080020684A1 Wafer Clamping Device For A Double Side Grinder 有权
标题翻译：双面磨床用晶片夹紧装置
公开(公告)号：US20080020684A1
公开(公告)日：2008-01-24
申请号：US10598851
申请日：2005-01-20
申请人： Milind Bhagavat , Puneet Gupta , Roland Vandamme , Takuto Kazama , Noriyuki Tachi
发明人： Milind Bhagavat , Puneet Gupta , Roland Vandamme , Takuto Kazama , Noriyuki Tachi
IPC分类号： B24B37/04
CPC分类号： B24B7/228 , B24B7/17 , B24B37/08 , B24B37/28 , B24B41/061
摘要： A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.
摘要翻译：一种静压垫，用于在通过研磨轮磨削晶片时保持半导体晶片。衬垫包括形成在与晶片直接相对的身体的表面上的静压袋。凹穴适于接收通过本体并进入凹穴中的流体，以在身体表面和工件之间提供屏障，同时仍然施加压力以保持工件在研磨过程中。静压垫允许晶片相对于垫围绕其公共轴线旋转。当砂轮相对于静液压垫移动或倾斜时，袋被定向成减小在晶片中产生的流体静力弯矩，有助于防止通常由砂轮的移动和倾斜引起的晶片表面的纳米拓扑降解。

3. 发明申请

US20070179659A1 Double side wafer grinder and methods for assessing workpiece nanotopology 失效
公开(公告)号：US20070179659A1
公开(公告)日：2007-08-02
申请号：US11617430
申请日：2006-12-28
申请人： Roland Vandamme , Milind Bhagavat
发明人： Roland Vandamme , Milind Bhagavat
IPC分类号： B24B51/00 , B24B49/00 , B24B7/30 , B24B7/00 , B24B1/00
CPC分类号： B24B37/28 , B24B7/228 , B24B49/02
摘要： A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned between the hydrostatic pads. At least one sensor measures a distance between the workpiece and the respective sensor for assessing nanotopology of the workpiece. In a method of the invention, a distance to the workpiece is measured during grinding and used to assess nanotopology of the workpiece. For instance, a finite element structural analysis of the workpiece can be performed using sensor data to derive at least one boundary condition. The nanotopology assessment can begin before the workpiece is removed from the grinder, providing rapid nanotopology feedback. A spatial filter can be used to predict the likely nanotopology of the workpiece after further processing.

4. 发明申请

US20120112765A1 MEMS In-Plane Resonators 有权
标题翻译： MEMS平面谐振器
公开(公告)号：US20120112765A1
公开(公告)日：2012-05-10
申请号：US12853619
申请日：2010-08-10
申请人： Andrew Sparks , Milind Bhagavat
发明人： Andrew Sparks , Milind Bhagavat
IPC分类号： G01R27/04 , G01H13/00 , H01L41/04
CPC分类号： G01N29/022 , G01N29/036 , G01N2291/014 , G01N2291/0256 , G01N2291/0422 , H03H9/1057 , H03H9/2463 , H03H2009/02511
摘要： MEMS in-plane resonators include a substrate wafer, at least one resonant mass supported by the substrate wafer and configured to resonate substantially in-plane, and at least one transducer coupled to the at least one resonant mass for at least one of driving and sensing in-plane movement of the at least one resonant mass, wherein at least part of one surface of the resonant mass is configured for exposure to an external environment and wherein the at least one transducer is isolated from the external environment. Such MEMS in-plane resonators may be fabricated using conventional surface micromachining techniques and high-volume wafer fabrication processes and may be configured for liquid applications (e.g., viscometry, densitometry, chemical/biological sensing), gas sensing (e.g., where a polymer film is added to the sensor surface, further degrading the damping performance), or other applications.
摘要翻译： MEMS平面内谐振器包括衬底晶片，由衬底晶片支撑并被配置为基本上共面谐振的至少一个谐振块，以及耦合到至少一个谐振块的至少一个谐振器，用于至少一个驱动和感测所述至少一个谐振质量块的平面内运动，其中所述谐振块的一个表面的至少一部分被配置为暴露于外部环境，并且其中所述至少一个换能器与所述外部环境隔离。这样的MEMS平面内谐振器可以使用传统的表面微加工技术和大容量晶片制造工艺来制造，并且可以被配置用于液体应用（例如，粘度测定，密度测定，化学/生物感测），气体感测（例如，其中聚合物膜被添加到传感器表面，进一步降低阻尼性能）或其他应用。

5. 发明申请

US20090294879A1 Method for Capping a MEMS Wafer 有权
标题翻译：封装MEMS晶圆的方法
公开(公告)号：US20090294879A1
公开(公告)日：2009-12-03
申请号：US12468185
申请日：2009-05-19
申请人： Milind Bhagavat , Erik Tarvin , Firas Sammoura , Kuang Yang , Andrew Sparks
发明人： Milind Bhagavat , Erik Tarvin , Firas Sammoura , Kuang Yang , Andrew Sparks
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： H01L23/10 , B81C1/00269 , B81C1/00293 , B81C2203/0109 , H01L2924/0002 , H01L2924/00
摘要： A method for capping a MEMS wafer to form a hermetically sealed device. The method includes applying a glass bonding agent to the cap wafer and burning off organic material in the glass bonding agent. The cap wafer/glass bonding agent combination is then cleaned to reduce lead in the combination. The cleaning is preferably accomplished using an oxygen plasma. The MEMS device is coated with a WASA agent. The cap wafer is then bonded to the MEMS wafer by heating this combination in a capping gas atmosphere of hydrogen molecules in a gas such as nitrogen, argon or neon. This method of capping the MEMS wafer can reduce stiction in the MEMS device.
摘要翻译：一种用于封装MEMS晶片以形成密封装置的方法。该方法包括将玻璃粘合剂施加到盖晶片上并在玻璃粘合剂中烧掉有机材料。然后清洁盖片/玻璃粘合剂组合以减少组合中的铅。清洁优选使用氧等离子体实现。 MEMS器件涂覆有WASA试剂。然后通过在诸如氮气，氩气或氖气体中的氢分子的封盖气体气氛中加热该组合，将盖晶片结合到MEMS晶片。这种封装MEMS晶片的方法可以降低MEMS器件中的静电。

6. 发明授权

US07981723B2 Capped wafer method and apparatus 有权
标题翻译：带盖的晶圆方法和装置
公开(公告)号：US07981723B2
公开(公告)日：2011-07-19
申请号：US12268605
申请日：2008-11-11
申请人： Xue'en Yang , Milind Bhagavat , Erik Tarvin
发明人： Xue'en Yang , Milind Bhagavat , Erik Tarvin
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： B81C1/00873 , B81C1/00269 , B81C2203/0118 , B81C2203/019 , H01L23/10 , H01L2924/16235
摘要： A capped wafer includes a device wafer and an opposing cap wafer with an annular glass frit disposed between the device wafer and the cap wafer. The glass frit and the opposing wafers define a sealed volume that encloses the capped devices, and the glass frit may support the wafer cap during removal of excess wafer cap material from the capped wafer. A method of fabricating a capped wafer includes fabricating an annular intermediate layer between a device wafer and a cap wafer. In an alternate embodiment, a plurality of unsingulated dice each contains bond pads along a single edge and are arranged on a device wafer in an alternating order so that the bond pads of a first die are adjacent to the bond pads of a second die. Removing excess cap wafer material involves making a first cut in the cap wafer near a first row of bond pads and a second cut near the adjacent row of bond pads, such that a strip of wafer cap material is suspended from portions of an underlying supporting member near the edge of the capped wafer, and then removing the wafer cap material suspended from the portions of the supporting glass frit using an adhesive tape.
摘要翻译：封盖晶片包括器件晶片和相对的盖晶片，其具有设置在器件晶片和盖晶片之间的环形玻璃料。玻璃料和相对的晶片限定了封闭封盖器件的密封体积，并且玻璃料可以在从封盖晶片去除多余的晶片盖材料期间支撑晶片盖。制造封盖晶片的方法包括在器件晶片和盖晶片之间制造环形中间层。在替代实施例中，多个未插拔的裸片各自包含沿着单个边缘的接合焊盘，并且以交替顺序布置在器件晶片上，使得第一管芯的接合焊盘与第二管芯的接合焊盘相邻。去除多余的盖晶片材料包括在第一排接合焊盘附近在盖晶片中进行第一切割，并且在相邻排的接合焊盘附近进行第二切割，使得晶片盖材料条从下面的支撑构件的部分悬挂靠近加盖晶片的边缘，然后使用胶带从支撑玻璃料的部分上移除晶片盖材料。

7. 发明授权

US08593155B2 MEMS in-plane resonators 有权
标题翻译： MEMS平面内谐振器
公开(公告)号：US08593155B2
公开(公告)日：2013-11-26
申请号：US12853619
申请日：2010-08-10
申请人： Andrew Sparks , Milind Bhagavat
发明人： Andrew Sparks , Milind Bhagavat
IPC分类号： G01R27/04
CPC分类号： G01N29/022 , G01N29/036 , G01N2291/014 , G01N2291/0256 , G01N2291/0422 , H03H9/1057 , H03H9/2463 , H03H2009/02511
摘要： MEMS in-plane resonators include a substrate wafer, at least one resonant mass supported by the substrate wafer and configured to resonate substantially in-plane, and at least one transducer coupled to the at least one resonant mass for at least one of driving and sensing in-plane movement of the at least one resonant mass, wherein at least part of one surface of the resonant mass is configured for exposure to an external environment and wherein the at least one transducer is isolated from the external environment. Such MEMS in-plane resonators may be fabricated using conventional surface micromachining techniques and high-volume wafer fabrication processes and may be configured for liquid applications (e.g., viscometry, densitometry, chemical/biological sensing), gas sensing (e.g., where a polymer film is added to the sensor surface, further degrading the damping performance), or other applications.
摘要翻译： MEMS平面内谐振器包括衬底晶片，由衬底晶片支撑并被配置为基本上共面谐振的至少一个谐振块，以及耦合到至少一个谐振块的至少一个谐振器，用于至少一个驱动和感测所述至少一个谐振质量块的平面内运动，其中所述谐振块的一个表面的至少一部分被配置为暴露于外部环境，并且其中所述至少一个换能器与所述外部环境隔离。这样的MEMS平面内谐振器可以使用传统的表面微加工技术和大容量晶片制造工艺来制造，并且可以被配置用于液体应用（例如，粘度测定，密度测定，化学/生物感测），气体感测（例如，其中聚合物膜被添加到传感器表面，进一步降低阻尼性能）或其他应用。

8. 发明申请

US20200185366A1 CIRCUIT BOARD WITH COMPACT PASSIVE COMPONENT ARRANGEMENT 审中-公开
公开(公告)号：US20200185366A1
公开(公告)日：2020-06-11
申请号：US16213347
申请日：2018-12-07
申请人： Milind Bhagavat , Rahul Agarwal
发明人： Milind Bhagavat , Rahul Agarwal
IPC分类号： H01L25/16 , H01L21/56 , H01L23/498 , H05K1/02 , H05K3/30
摘要： Various circuit boards with mounted passive components and method of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes at least partially encapsulating a first plurality of passive components in a molding material to create a first molded passive component group. The first molded passive component group is mounted on a surface of a circuit board. The first plurality of passive components are electrically connected to the circuit board.

9. 发明申请

US20120299868A1 High Noise Immunity and High Spatial Resolution Mutual Capacitive Touch Panel 审中-公开
标题翻译：高抗扰度和高空间分辨率互电容触摸屏
公开(公告)号：US20120299868A1
公开(公告)日：2012-11-29
申请号：US13331337
申请日：2011-12-20
申请人： Milind Bhagavat , David Sobel , John Walley , Sumant Ranganathan
发明人： Milind Bhagavat , David Sobel , John Walley , Sumant Ranganathan
IPC分类号： G06F3/044
CPC分类号： G06F3/044
摘要： A mutual capacitive touch panel providing improved noise immunity and improved spatial resolution is described. The touch panel includes a drive line having a plurality of drive electrodes. The touch panel further includes a sense line arranged at an angle with respect to the drive line and the sense line having a plurality of sense electrodes, such that each of the plurality of sense electrodes overlies one of the plurality of drive electrodes. The touch panel is further configured such that a perimeter of each of the plurality of drive electrodes encompasses a perimeter of at least one of the plurality of sense electrodes.
摘要翻译：描述了提供改善的抗噪声性和改进的空间分辨率的互电容式触摸面板。触摸面板包括具有多个驱动电极的驱动线。触摸面板还包括感测线，其相对于驱动线成一定角度布置，感测线具有多个感测电极，使得多个感测电极中的每一个覆盖多个驱动电极中的一个。触摸面板被进一步配置成使得多个驱动电极中的每一个的周边包围多个感测电极中的至少一个的周边。

10. 发明授权

US08058144B2 Method for capping a MEMS wafer 有权
标题翻译：封装MEMS晶圆的方法
公开(公告)号：US08058144B2
公开(公告)日：2011-11-15
申请号：US12468185
申请日：2009-05-19
申请人： Milind Bhagavat , Erik Tarvin , Firas Sammoura , Kuang Yang , Andrew Sparks
发明人： Milind Bhagavat , Erik Tarvin , Firas Sammoura , Kuang Yang , Andrew Sparks
IPC分类号： H01L21/46 , C03B29/00
CPC分类号： H01L23/10 , B81C1/00269 , B81C1/00293 , B81C2203/0109 , H01L2924/0002 , H01L2924/00
摘要： A method for capping a MEMS wafer to form a hermetically sealed device. The method includes applying a glass bonding agent to the cap wafer and burning off organic material in the glass bonding agent. The cap wafer/glass bonding agent combination is then cleaned to reduce lead in the combination. The cleaning is preferably accomplished using an oxygen plasma. The MEMS device is coated with a WASA agent. The cap wafer is then bonded to the MEMS wafer by heating this combination in a capping gas atmosphere of hydrogen molecules in a gas such as nitrogen, argon or neon. This method of capping the MEMS wafer can reduce stiction in the MEMS device.
摘要翻译：一种用于封装MEMS晶片以形成密封装置的方法。该方法包括将玻璃粘合剂施加到盖晶片上并在玻璃粘合剂中烧掉有机材料。然后清洁盖片/玻璃粘合剂组合以减少组合中的铅。清洁优选使用氧等离子体实现。 MEMS器件涂覆有WASA试剂。然后通过在诸如氮气，氩气或氖气体中的氢分子的封盖气体气氛中加热该组合，将盖晶片结合到MEMS晶片。这种封装MEMS晶片的方法可以降低MEMS器件中的静电。

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