专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080198552A1 Package board and method for manufacturing thereof 失效
标题翻译：封装板及其制造方法
公开(公告)号：US20080198552A1
公开(公告)日：2008-08-21
申请号：US12010879
申请日：2008-01-30
申请人： Suk-Hyeon Cho , Je-Gwang Yoo , Min-Sang Lee , Seon-Goo Lee , Han-Seo Cho
发明人： Suk-Hyeon Cho , Je-Gwang Yoo , Min-Sang Lee , Seon-Goo Lee , Han-Seo Cho
IPC分类号： F21V29/00 , H05K7/20 , H01B13/00
CPC分类号： H01L23/3121 , H01L23/13 , H01L23/16 , H01L23/36 , H01L23/49833 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L31/0203 , H01L33/64 , H01L2224/05599 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/49109 , H01L2224/49175 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099
摘要： A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.
摘要翻译：公开了一种用于制造封装板的封装板和方法。一种封装板，其包括第一金属层，堆叠在第一金属层上的隔热层，其间插入有第一绝缘层，形成在所述隔热层中的空腔，形成在所述空腔中的安装层与第一绝缘层接触，安装在安装层上的第一部件和覆盖散热层和空腔的至少一部分的第二绝缘层可提供改进的散热和更小的厚度。

2. 发明授权

US07903410B2 Package board and method for manufacturing thereof 失效
标题翻译：封装板及其制造方法
公开(公告)号：US07903410B2
公开(公告)日：2011-03-08
申请号：US12010879
申请日：2008-01-30
申请人： Suk-Hyeon Cho , Je-Gwang Yoo , Min-Sang Lee , Seon-Goo Lee , Han-Seo Cho
发明人： Suk-Hyeon Cho , Je-Gwang Yoo , Min-Sang Lee , Seon-Goo Lee , Han-Seo Cho
IPC分类号： H05K7/20 , H01L23/34 , H01L33/00
CPC分类号： H01L23/3121 , H01L23/13 , H01L23/16 , H01L23/36 , H01L23/49833 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L31/0203 , H01L33/64 , H01L2224/05599 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/49109 , H01L2224/49175 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099
摘要： A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.
摘要翻译：公开了一种用于制造封装板的封装板和方法。一种封装板，其包括第一金属层，堆叠在第一金属层上的隔热层，其间插入有第一绝缘层，形成在所述隔热层中的空腔，形成在所述空腔中的安装层与第一绝缘层接触，安装在安装层上的第一部件和覆盖散热层和空腔的至少一部分的第二绝缘层可提供改进的散热和更小的厚度。

3. 发明申请

US20080055863A1 Method of manufacturing as component embedded printed circuit board 有权
标题翻译：作为组件嵌入式印刷电路板的制造方法
公开(公告)号：US20080055863A1
公开(公告)日：2008-03-06
申请号：US11896769
申请日：2007-09-05
申请人： Suk-Hyeon Cho , Je-Gwang Yoo , Byung-Moon Kim , Han-Seo Cho
发明人： Suk-Hyeon Cho , Je-Gwang Yoo , Byung-Moon Kim , Han-Seo Cho
IPC分类号： H05K7/00 , H05K3/44 , H05K7/20
CPC分类号： H05K1/185 , H01L24/97 , H01L31/0203 , H01L33/486 , H01L33/64 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H05K1/056 , H05K1/181 , H05K1/186 , H05K3/108 , H05K2201/0108 , H05K2201/0352 , H05K2201/09736 , H05K2201/10106 , H05K2201/10121 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2224/81 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/92247 , H01L2224/0401
摘要： A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component, provides a thin printed circuit board having a superb heat releasing effect.
摘要翻译：公开了一种制造光学元件嵌入式印刷电路板的方法。一种光学部件嵌入式印刷电路板，包括其中形成有至少一个空腔的金属芯，嵌入在所述空腔中的光学部件，堆叠在所述金属芯的一侧的第一绝缘层，在另一个上堆叠的第二绝缘层并且形成在第一绝缘层上并且与光学部件电连接的电路图案提供了具有优良散热效果的薄印刷电路板。

4. 发明授权

US08683684B2 Method of manufacturing component embedded printed circuit board 有权
标题翻译：组件嵌入式印刷电路板的制造方法
公开(公告)号：US08683684B2
公开(公告)日：2014-04-01
申请号：US13200920
申请日：2011-10-05
申请人： Suk-Hyeon Cho , Je-Gwang Yoo , Byung-Moon Kim , Han-Seo Cho
发明人： Suk-Hyeon Cho , Je-Gwang Yoo , Byung-Moon Kim , Han-Seo Cho
IPC分类号： H05K3/30
CPC分类号： H05K1/185 , H01L24/97 , H01L31/0203 , H01L33/486 , H01L33/64 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H05K1/056 , H05K1/181 , H05K1/186 , H05K3/108 , H05K2201/0108 , H05K2201/0352 , H05K2201/09736 , H05K2201/10106 , H05K2201/10121 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2224/81 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/92247 , H01L2224/0401
摘要： A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.
摘要翻译：一种制造光学部件嵌入式印刷电路板的方法，所述方法包括：在金属芯的一侧上堆叠第一绝缘层; 将光学部件嵌入形成在所述金属芯中的空腔中; 在金属芯的另一侧堆叠透明材料的第二绝缘层; 以及在所述第一绝缘层上形成电路图案，所述电路图案与所述光学部件电连接。

5. 发明授权

US08064217B2 Component embedded printed circuit board 有权
标题翻译：组件嵌入式印刷电路板
公开(公告)号：US08064217B2
公开(公告)日：2011-11-22
申请号：US11896769
申请日：2007-09-05
申请人： Suk-Hyeon Cho , Je-Gwang Yoo , Byung-Moon Kim , Han-Seo Cho
发明人： Suk-Hyeon Cho , Je-Gwang Yoo , Byung-Moon Kim , Han-Seo Cho
IPC分类号： H05K1/16
CPC分类号： H05K1/185 , H01L24/97 , H01L31/0203 , H01L33/486 , H01L33/64 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H05K1/056 , H05K1/181 , H05K1/186 , H05K3/108 , H05K2201/0108 , H05K2201/0352 , H05K2201/09736 , H05K2201/10106 , H05K2201/10121 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2224/81 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/92247 , H01L2224/0401
摘要： A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.
摘要翻译：公开了一种制造光学元件嵌入式印刷电路板的方法。一种光学部件嵌入式印刷电路板，包括其中形成有至少一个空腔的金属芯，嵌入在所述空腔中的光学部件，堆叠在所述金属芯的一侧的第一绝缘层，在另一个上堆叠的第二绝缘层金属芯的侧面，以及形成在第一绝缘层上并与光学部件电连接的电路图案。

6. 发明申请

US20120030940A1 Method of manufacturing component embedded printed circuit board 有权
标题翻译：组件嵌入式印刷电路板的制造方法
公开(公告)号：US20120030940A1
公开(公告)日：2012-02-09
申请号：US13200920
申请日：2011-10-05
申请人： Suk-Hyeon Cho , Je-Gwang Yoo , Byung-Moon Kim , Han-Seo Cho
发明人： Suk-Hyeon Cho , Je-Gwang Yoo , Byung-Moon Kim , Han-Seo Cho
IPC分类号： H05K3/30
CPC分类号： H05K1/185 , H01L24/97 , H01L31/0203 , H01L33/486 , H01L33/64 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H05K1/056 , H05K1/181 , H05K1/186 , H05K3/108 , H05K2201/0108 , H05K2201/0352 , H05K2201/09736 , H05K2201/10106 , H05K2201/10121 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2224/81 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/92247 , H01L2224/0401
摘要： A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.
摘要翻译：一种制造光学部件嵌入式印刷电路板的方法，所述方法包括：在金属芯的一侧上堆叠第一绝缘层; 将光学部件嵌入形成在所述金属芯中的空腔中; 在金属芯的另一侧堆叠透明材料的第二绝缘层; 以及在所述第一绝缘层上形成电路图案，所述电路图案与所述光学部件电连接。

7. 发明申请

US20110007999A1 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US20110007999A1
公开(公告)日：2011-01-13
申请号：US12923143
申请日：2010-09-03
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Jae-Hyun Jung , Han-Seo Cho
IPC分类号： G02B6/12
CPC分类号： G02B6/12002 , G02B6/13 , G02B6/43 , H05K1/0274 , H05K3/4652 , H05K3/4691
摘要： A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.
摘要翻译：一种印刷电路板，包括具有电路图案的第一光波导和埋在其一侧的焊盘，堆叠在所述第一光波导的一侧上的第一绝缘层，堆叠在所述第一绝缘层上的第一绝缘材料，布线层堆叠在第一绝缘材料上，具有电路图案和埋在其一侧的焊盘的第二光波导，堆叠在第二光波导的一侧上的第二绝缘层，堆叠在第二绝缘层上的第二绝缘材料层叠在所述第二绝缘材料上的第二电布线层，插入在所述第一光波导的另一侧和所述第二光波导的另一侧之间的中间层，使得附接所述第一光波导和所述第二光波导;以及穿过第一光波导和第二光波导的通孔。

8. 发明申请

US20090133444A1 Method of manufacturing optical board 审中-公开
标题翻译：制造光板的方法
公开(公告)号：US20090133444A1
公开(公告)日：2009-05-28
申请号：US12149517
申请日：2008-05-02
申请人： Sang-Hoon Kim , Je-Gwang Yoo , Han-Seo Cho , Joon-Sung Kim
发明人： Sang-Hoon Kim , Je-Gwang Yoo , Han-Seo Cho , Joon-Sung Kim
IPC分类号： C03B37/022
CPC分类号： G02B6/136 , G02B6/4214 , G02B6/43 , H05K1/0274 , H05K3/4611
摘要： A method of manufacturing an optical board is disclosed. The method of manufacturing an optical board may include stacking an optical waveguide core layer over a first optical waveguide cladding layer, forming an inclined surface by diffracting a laser with a mask to remove a portion of the optical waveguide core layer, and stacking a reflective layer over the inclined surface.
摘要翻译：公开了一种制造光学板的方法。制造光学板的方法可以包括在第一光波导包层上层叠光波导芯层，通过用掩模衍射激光来形成倾斜表面以去除光波导芯层的一部分，并且将反射层在倾斜的表面上。

9. 发明申请

US20090130390A1 Optical wiring board and manufacturing method thereof 审中-公开
标题翻译：光接线板及其制造方法
公开(公告)号：US20090130390A1
公开(公告)日：2009-05-21
申请号：US12149952
申请日：2008-05-09
申请人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
发明人： Joon-Sung Kim , Je-Gwang Yoo , Chang-Sup Ryu , Han-Seo Cho , Sang-Hoon Kim
IPC分类号： B32B3/00 , B29D11/00
CPC分类号： B29D11/00663 , B29D11/00807 , G02B6/136 , H05K1/0274 , Y10T428/24612
摘要： An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.
摘要翻译：公开了一种光布线板及其制造方法。制造光布线板的方法可以包括在绝缘层上形成下包层; 在所述下包层上形成具有与所述芯对应的凹陷的侧包层; 填充压痕中的芯材; 并且形成上覆层，使得芯材被覆盖。本发明的实施例可用于容易地控制芯的厚度。

10. 发明授权

US07505661B2 Optical waveguide, package board having the same, and manufacturing method thereof 失效
标题翻译：光波导，具有该光波导的封装板及其制造方法
公开(公告)号：US07505661B2
公开(公告)日：2009-03-17
申请号：US12078948
申请日：2008-04-08
申请人： Han-Seo Cho , Je-Gwang Yoo , Joon-Sung Kim , Sang-Hoon Kim
发明人： Han-Seo Cho , Je-Gwang Yoo , Joon-Sung Kim , Sang-Hoon Kim
IPC分类号： G02B6/10 , H01L21/00
CPC分类号： B29D11/00663 , G02B6/136 , G02B6/43 , H05K1/0274 , H05K3/3436 , H05K2201/10121 , Y10T29/49155
摘要： An optical waveguide, a package board having the optical waveguide, and manufacturing methods thereof are disclosed. The method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on one side of a first cladding; forming a core between the first reflective bump and the second reflective bump; and stacking a second cladding over the one side of the first cladding such that the second cladding covers the first reflective bump, the second reflective bump, and the core. With this method, inclined surfaces can be formed by stacking a metal layer on the lower cladding and then selectively etching the metal layer, which can reduce lead time and enable a high degree of freedom in design.
摘要翻译：公开了一种光波导，具有光波导的封装板及其制造方法。制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在第一包层的一侧上以预定距离设置 ; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 以及在所述第一包层的所述一侧上堆叠第二包层，使得所述第二包层覆盖所述第一反射凸起，所述第二反射凸起和所述芯。利用该方法，可以通过在下包层上层叠金属层然后选择性地蚀刻金属层来形成倾斜表面，这可以减少交货时间并且能够在设计上实现高自由度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式