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    • 1. 发明授权
    • Process and apparatus for cleaning exhaust gas
    • 废气净化工艺及设备
    • US06331281B1
    • 2001-12-18
    • US09414348
    • 1999-10-07
    • Suehachi TeruYasusada MiyanoNoboru AkitaKenji OtsukaTakashi Shimada
    • Suehachi TeruYasusada MiyanoNoboru AkitaKenji OtsukaTakashi Shimada
    • B01D5358
    • B01D53/8634Y02A50/2346
    • There are disclosed a process for cleaning ammonia-containing exhaust gas which comprises bringing the exhaust gas into contact with an ammonia decomposition catalyst (e.g. nickel, ruthenium) under heating to decompose most of the ammonia into nitrogen and hydrogen, subsequently bringing the resultant mixed gas into contact with an ammonia adsorbent (e.g. synthetic zeolite) for adsorbing undecomposed ammonia, and then heating regenerating the adsorbent, while bringing reproduced exhaust gas containing the ammonia desorbed from the adsorbent into contact under heating, with the ammonia decomposition catalyst or another ammonia decomposition catalyst; and an apparatus for carrying out the process. It is made possible by the process and apparatus to efficiently and completely clean ammonia-containing exhaust gas exhausted from a semiconductor manufacturing process and the like without generating useless byproduct and dispensing with secondary treatment.
    • 公开了一种清洗含氨废气的方法,该方法包括在加热下将废气与氨分解催化剂(例如镍,钌)接触以将大部分氨分解成氮和氢,随后将所得混合气体 与用于吸附未分解氨的氨吸附剂(例如合成沸石)接触,然后加热再生吸附剂,同时使含有从吸附剂解吸的氨的再生废气与加热下的氨分解催化剂或另一种氨分解催化剂接触 ; 以及用于执行该过程的装置。 通过该方法和装置可以有效且完全地清洁从半导体制造工艺等排出的含氨废气,而不会产生无用的副产物和分配二次处理。
    • 5. 发明授权
    • Process for cleaning harmful gas
    • 清洁有害气体的过程
    • US5378444A
    • 1995-01-03
    • US975698
    • 1992-11-13
    • Noboru AkitaToshiya HatakeyamaTakashi ShimadaKeiichi Iwata
    • Noboru AkitaToshiya HatakeyamaTakashi ShimadaKeiichi Iwata
    • B01D53/68C01B7/07
    • B01D53/68
    • There is disclosed a process for cleaning a harmful gas which comprises bringing a harmful gaseous halogenide such as chlorine, hydrogen chloride, dichlorosilane, silicon tetrachloride, phosphorus trichloride, chlorine trifluoride, boron trichloride, boron trifluoride, tungsten hexafluoride, silicon tetrafluoride, fluorine, hydrogen fluoride and hydrogen bromide into contact with a cleaning agent comprising zinc oxide, aluminum oxide and an alkali compound to remove the above halogenide. The above process is extremely effective for promptly and efficiently removing the above gaseous halogenide that is contained in the gas discharged from semiconductor manufacturing process or leaked suddenly from a gas bomb in an emergency.
    • 公开了一种清洁有害气体的方法,该方法包括使氯,氯化氢,二氯硅烷,四氯化硅,三氯化磷,三氟化氯,三氯化硼,三氟化硼,六氟化钨,四氟化硅,氟,氢等有害的气态卤化物 氟化物和溴化氢与包含氧化锌,氧化铝和碱性化合物的清洗剂接触以除去上述卤化物。 上述过程对于迅速有效地除去在半导体制造过程中排出的气体中所含的上述气态卤化物或在紧急情况下突然从气体炸弹泄漏而非常有效。