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1. 发明申请

US20080145797A1 Method and apparatus for processing a wafer 审中-公开
公开(公告)号：US20080145797A1
公开(公告)日：2008-06-19
申请号：US11977878
申请日：2007-10-26
申请人： Steven Verha Verbeke , J. Kelly Truman , Christopher T. Lane , Sasson R. Somekh
发明人： Steven Verha Verbeke , J. Kelly Truman , Christopher T. Lane , Sasson R. Somekh
IPC分类号： G03F7/00
CPC分类号： H01L21/67207 , G03F7/16 , H01L21/67115 , H01L21/67161 , H01L21/67173 , H01L21/67184 , H01L21/6719 , Y10S414/135 , Y10S414/141 , Y10S438/905
摘要： A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.

2. 发明申请

US20080286697A1 Method and apparatus for processing a wafer 审中-公开
公开(公告)号：US20080286697A1
公开(公告)日：2008-11-20
申请号：US11977913
申请日：2007-10-26
申请人： Steven Verhaverbeke , J Kelly Truman , Christopher T. Lane , Sasson R. Somekh
发明人： Steven Verhaverbeke , J Kelly Truman , Christopher T. Lane , Sasson R. Somekh
IPC分类号： G03F7/20
CPC分类号： H01L21/67161 , H01L21/67069 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67225
摘要： A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.

3. 发明授权

US4911597A Semiconductor processing system with robotic autoloader and load lock 失效
标题翻译：带有机器人自动装载机和加载锁的半导体处理系统
公开(公告)号：US4911597A
公开(公告)日：1990-03-27
申请号：US89926
申请日：1987-08-25
申请人： Dan Maydan , Sasson R. Somekh , Charles Ryan-Harris , Richard A. Seilheimer , David Cheng , Edward M. Abolnikov , Lance S. Reinke , J. Christopher Moran , Richard M. Catlin, Jr. , Robert B. Lowrance , Gregory W. Ridgeway
发明人： Dan Maydan , Sasson R. Somekh , Charles Ryan-Harris , Richard A. Seilheimer , David Cheng , Edward M. Abolnikov , Lance S. Reinke , J. Christopher Moran , Richard M. Catlin, Jr. , Robert B. Lowrance , Gregory W. Ridgeway
IPC分类号： H01L21/677 , B65G49/07 , H01L21/67 , H01L21/683 , H05K13/02
CPC分类号： H05K13/021 , H01L21/67 , Y10S414/13 , Y10S414/135 , Y10S414/137 , Y10S414/139 , Y10S414/14 , Y10S414/141
摘要： A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.
摘要翻译：晶片处理系统包括安装在负载锁中的自动装载机，用于在半导体处理室和装载锁之间的卸载位置之间提供批处理，盒到盒自动晶片传送。该系统提供快速，无污染的半导体晶片装载和卸载。

4. 发明授权

US5643366A Wafer handling within a vacuum chamber using vacuum 失效
标题翻译：使用真空在真空室内处理晶片
公开(公告)号：US5643366A
公开(公告)日：1997-07-01
申请号：US189951
申请日：1994-01-31
申请人： Sasson R. Somekh , Philip M. Salzman , Oskar U. Vierny
发明人： Sasson R. Somekh , Philip M. Salzman , Oskar U. Vierny
IPC分类号： H01L21/677 , H01L21/683 , H01L21/687 , C23C16/00
CPC分类号： H01L21/67748 , H01L21/6838 , H01L21/68728 , H01L21/68735 , H01L21/68742 , Y10S414/135
摘要： A structure and method for handling and processing wafers in a face down configuration is disclosed. A robot insertion blade supports a wafer to be processed in a recess having conically sloping wafer holding surfaces which touch the wafer only at its outer periphery. Once positioned in the chamber, a set of three transfer finger with sloped contact surfaces supported from a "C" shaped support assembly raise the wafer adjacent to a susceptor bottom surface. A recess in the face of the susceptor covering a large portion of the wafer is evacuated, compared to process chamber pressure, and when the differential pressure between the processing chamber and the evacuated recess behind the wafer can support the wafer, the transfer finger supports are lower and rotated out from under the wafer and susceptor assembly. The susceptor with the wafer attached by vacuum is then lowered to a processing location in contact with shadow rings supported by the "C" shaped support assembly and opposite a gas distribution plate.
摘要翻译：公开了一种面朝下配置处理和处理晶片的结构和方法。机器人插入刀片在具有锥形倾斜的晶片保持表面的凹部中支撑要处理的晶片，其仅在其外周缘处接触晶片。一旦定位在腔室中，一组具有从“C”形支撑组件支撑的倾斜接触表面的三个转移手指将晶片靠近基座底表面提升。与处理室压力相比，在覆盖晶片的大部分的基座的表面上的凹部被抽真空，并且当处理室和晶片后面的抽真空凹槽之间的压差可以支撑晶片时，转印手指支撑件从晶片和基座组件下方旋转出来。然后将具有通过真空附接的晶片的感受器降低到与由“C”形支撑组件支撑并与气体分配板相对的阴影环接触的处理位置。

5. 发明授权

US07048837B2 End point detection for sputtering and resputtering 失效
标题翻译：溅射和再溅射的终点检测
公开(公告)号：US07048837B2
公开(公告)日：2006-05-23
申请号：US10659902
申请日：2003-09-11
申请人： Sasson R. Somekh , Marc O. Schweitzer , John C. Forster , Zheng Xu , Roderick C. Mosely , Barry L. Chin , Howard E. Grunes
发明人： Sasson R. Somekh , Marc O. Schweitzer , John C. Forster , Zheng Xu , Roderick C. Mosely , Barry L. Chin , Howard E. Grunes
IPC分类号： C23C14/35
CPC分类号： C23C14/544 , C23C14/046 , C23C14/165 , C23C14/5833 , C23C14/5873 , G01N21/68 , H01J37/321 , H01J37/32477 , H01J37/32935 , H01J37/32963 , H01J37/3455 , H01L21/2855 , H01L21/76814 , H01L21/76844 , H01L21/76846 , H01L21/76862 , H01L21/76865 , H01L22/26 , H01L2924/0002 , H01L2924/00
摘要： Plasma etching or resputtering of a layer of sputtered materials including opaque metal conductor materials may be controlled in a sputter reactor system. In one embodiment, resputtering of a sputter deposited layer is performed after material has been sputtered deposited and while additional material is being sputter deposited onto a substrate. A path positioned within a chamber of the system directs light or other radiation emitted by the plasma to a chamber window or other optical view-port which is protected by a shield against deposition by the conductor material. In one embodiment, the radiation path is folded to reflect plasma light around the chamber shield and through the window to a detector positioned outside the chamber window. Although deposition material may be deposited onto portions of the folded radiation path, in many applications, the deposition material will be sufficiently reflective to permit the emission spectra to be detected by a spectrometer or other suitable detector without significant signal loss. The etching or resputtering may be terminated when the detector detects that an underlying layer has been reached or when some other suitable process point has been reached.
摘要翻译：可以在溅射反应器系统中控制包括不透明金属导体材料的溅射材料层的等离子体蚀刻或再溅射。在一个实施例中，溅射沉积层的溅射在材料溅射沉积之后进行，并且另外的材料被溅射沉积到衬底上。位于系统的腔室内的路径将等离子体发射的光或其他辐射引导到腔室窗口或其他光学视图端口，其被屏蔽物保护以防止被导体材料沉积。在一个实施例中，辐射路径被折叠以将等离子体光围绕室屏蔽件并且通过窗口反射到位于室窗口外部的检测器。虽然沉积材料可以沉积在折叠辐射路径的部分上，但是在许多应用中，沉积材料将被充分反射，以允许发射光谱由光谱仪或其它合适的检测器检测，而没有显着的信号损失。当检测器检测到已经到达下层或者当达到某些其它合适的处理点时，蚀刻或再溅射可以被终止。

6. 发明授权

US5280983A Semiconductor processing system with robotic autoloader and load lock 失效
标题翻译：带有机器人自动装载机和加载锁的半导体处理系统
公开(公告)号：US5280983A
公开(公告)日：1994-01-25
申请号：US963006
申请日：1992-10-19
申请人： Dan Maydan , Sasson R. Somekh , Charles Ryan-Harris , Richard A. Seilheimer , David Cheng , Edward M. Abolnikov , Lance S. Reinke , J. Christopher Moran , Richard M. Catlin, Jr. , Robert B. Lowrance , Gregory W. Ridgeway
发明人： Dan Maydan , Sasson R. Somekh , Charles Ryan-Harris , Richard A. Seilheimer , David Cheng , Edward M. Abolnikov , Lance S. Reinke , J. Christopher Moran , Richard M. Catlin, Jr. , Robert B. Lowrance , Gregory W. Ridgeway
IPC分类号： H01L21/67 , H02H9/00 , H05K13/02 , B66C1/42
CPC分类号： H05K13/021 , H01L21/67 , H02H9/005 , Y10S294/902
摘要： A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.
摘要翻译：晶片处理系统包括安装在负载锁中的自动装载机，用于在半导体处理室和装载锁之间的卸载位置之间提供批处理，盒到盒自动晶片传送。该系统提供快速，无污染的半导体晶片装载和卸载。

7. 发明授权

US5224809A Semiconductor processing system with robotic autoloader and load lock 失效
标题翻译：带有机器人自动装载机和加载锁的半导体处理系统
公开(公告)号：US5224809A
公开(公告)日：1993-07-06
申请号：US816525
申请日：1991-12-30
申请人： Dan Maydan , Sasson R. Somekh , Charles Ryan-Harris , Richard A. Seilheimer , David Cheng , Edward M. Abolnikov , Lance S. Reinke , J. Christopher Moran , Richard M. Catlin, Jr. , Robert B. Lowrance , Gregory W. Ridgeway
发明人： Dan Maydan , Sasson R. Somekh , Charles Ryan-Harris , Richard A. Seilheimer , David Cheng , Edward M. Abolnikov , Lance S. Reinke , J. Christopher Moran , Richard M. Catlin, Jr. , Robert B. Lowrance , Gregory W. Ridgeway
IPC分类号： B65G49/07 , H01L21/67 , H05K13/02
CPC分类号： H01L21/67 , H05K13/021 , Y10S414/13
摘要： A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.
摘要翻译：晶片处理系统包括安装在负载锁中的自动装载机，用于在半导体处理室和装载锁之间的卸载位置之间提供批处理，盒到盒自动晶片传送。该系统提供快速，无污染的半导体晶片装载和卸载。

8. 发明授权

US06900135B2 Buffer station for wafer backside cleaning and inspection 失效
标题翻译：用于晶片背面清洁和检查的缓冲站
公开(公告)号：US06900135B2
公开(公告)日：2005-05-31
申请号：US10330810
申请日：2002-12-27
申请人： Sasson R. Somekh , Yoram Uziel , Raphy Adout
发明人： Sasson R. Somekh , Yoram Uziel , Raphy Adout
IPC分类号： H01L21/00 , H01L21/302 , H01L21/461
CPC分类号： H01L21/67253 , H01L21/67051
摘要： A wafer processing station includes an air gap chuck and a light emitter/collector assembly configured to gather light when scattered or reflected by contaminants on the wafer. The light emitter/collector assembly is driven by an actuator so that it passes across a backside surface of a wafer when supported within the chuck during wafer inspection. The wafer processing station may also include a cleaning module configured to clean the backside surface of the wafer when contaminants are discovered during wafer inspection. A computer system may be coupled to receive one or more signals from the light emitter/collector assembly that are indicative of contaminants on the backside surface of the wafer and to provide one or more control signals to the cleaning module in accordance therewith. The cleaning module may be used independently of the light emitter/collector assembly and vice-versa.
摘要翻译：晶片处理站包括气隙卡盘和发光体/集电器组件，其配置成当散射或在晶片上被污染物反射时收集光。光发射器/集电器组件由致动器驱动，使得当在晶片检查期间支撑在卡盘内时，其穿过晶片的背面。晶片处理站还可以包括清洁模块，该清洁模块被配置为当在晶片检查期间发现污染物时清洁晶片的背面。计算机系统可以被耦合以从光发射器/收集器组件接收指示晶片的背面上的污染物的一个或多个信号，并根据其提供一个或多个控制信号给清洁模块。清洁模块可以独立于光发射器/收集器组件使用，反之亦然。

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