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1. 发明申请

US20060051021A1 Waveguide coupling mechanism 有权
公开(公告)号：US20060051021A1
公开(公告)日：2006-03-09
申请号：US10934858
申请日：2004-09-03
申请人： Henning Braunisch , Steven Towle , Daoqiang Lu , Gilroy Vandentop , Anna George
发明人： Henning Braunisch , Steven Towle , Daoqiang Lu , Gilroy Vandentop , Anna George
IPC分类号： G02B6/32
CPC分类号： G02B6/30 , G02B6/32
摘要： A system is disclosed. The system includes an external waveguide and an IC coupled to the external waveguide. The IC includes at least two lenses and a second waveguide. The lenses couple radiant energy from the external waveguide to the second waveguide.

2. 发明申请

US20060067606A1 On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device 有权
标题翻译：将衬底上发光器和/或接收器与衬底上的光学器件耦合的衬底上微透镜
公开(公告)号：US20060067606A1
公开(公告)日：2006-03-30
申请号：US10955553
申请日：2004-09-30
申请人： Steven Towle , Henning Braunisch , Daoqiang Lu , Gilroy Vandentop , Anna George
发明人： Steven Towle , Henning Braunisch , Daoqiang Lu , Gilroy Vandentop , Anna George
IPC分类号： G02B6/12
CPC分类号： G02B6/42 , G02B6/4206
摘要： Optical apparatus, methods of forming the apparatus, and methods of using the apparatus are disclosed herein. In one aspect, an optical apparatus may include a substrate, an on-substrate microlens coupled with the substrate to receive light from an off-substrate light emitter and focus the light toward a focal point, and an on-substrate optical device coupled with the substrate proximate the focal point to receive the focused light. Communication of light in the reverse direction is also disclosed. Systems including the optical apparatus are also disclosed.
摘要翻译：本文公开了光学设备，形成设备的方法以及使用该设备的方法。在一个方面，光学装置可以包括衬底，与衬底耦合的衬底上的微透镜以接收来自离衬底光发射器的光并将光聚焦到焦点，以及与衬底上的光学器件耦合的衬底上的光学器件靠近焦点的基板以接收聚焦光。还公开了相反方向的光的通信。还公开了包括光学装置的系统。

3. 发明申请

US20060251360A1 Flip-chip mountable optical connector for chip-to-chip optical interconnectability 失效
标题翻译：用于芯片到芯片光学互连的倒装芯片安装光学连接器
公开(公告)号：US20060251360A1
公开(公告)日：2006-11-09
申请号：US11124033
申请日：2005-05-06
申请人： Daoqiang Lu , Gilroy Vandentop , Henning Braunisch
发明人： Daoqiang Lu , Gilroy Vandentop , Henning Braunisch
IPC分类号： G02B6/36
CPC分类号： G02B6/4232 , G02B6/4214 , G02B6/4292 , G02B6/43 , H01L2224/16225 , H05K1/0274 , H05K3/3436
摘要： An optical connector comprises a housing having a cavity extending there through to accept a mating connector. The connector comprises no optical components. Dummy solder bonding pads positioned on the connector allow the connector to be automated flip-chip bonded over a substrate waveguide.
摘要翻译：光学连接器包括壳体，该壳体具有在其上延伸以容纳匹配连接器的空腔。连接器不包括光学部件。定位在连接器上的虚拟焊接焊盘允许连接器在衬底波导上自动倒装芯片结合。

4. 发明申请

US20060067609A1 Optical package 失效
标题翻译：光学包装
公开(公告)号：US20060067609A1
公开(公告)日：2006-03-30
申请号：US10954903
申请日：2004-09-30
申请人： Daoqiang Lu , Henning Braunisch , Gilroy Vandentop
发明人： Daoqiang Lu , Henning Braunisch , Gilroy Vandentop
IPC分类号： G02B6/26 , G02B6/12 , G02B6/42
CPC分类号： G02B6/1228 , G02B6/24 , G02B2006/12147
摘要： Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.
摘要翻译：公开了光学封装。在一个方面，光学封装可以包括表面，与表面耦合的微电子器件，与微电子器件耦合的第一波导，具有与第一波导ev逝地耦合的第一端和第二端的第二波导，设置在第二端和表面之间的包层材料的第一厚度，以及设置在第一端和第一波导之间的包层材料的第二厚度。第一厚度可以大于第二厚度。还公开了制造光学封装件的方法。还公开了在光学封装上对准操作的装置和方法。

5. 发明授权

US07283699B2 Optical package 失效
标题翻译：光学包装
公开(公告)号：US07283699B2
公开(公告)日：2007-10-16
申请号：US10954903
申请日：2004-09-30
申请人： Daoqiang Lu , Henning Braunisch , Gilroy Vandentop
发明人： Daoqiang Lu , Henning Braunisch , Gilroy Vandentop
IPC分类号： G02B6/26 , G02B6/12
CPC分类号： G02B6/1228 , G02B6/24 , G02B2006/12147
摘要： Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.
摘要翻译：公开了光学封装。在一个方面，光学封装可以包括表面，与表面耦合的微电子器件，与微电子器件耦合的第一波导，具有与第一波导ev逝地耦合的第一端和第二端的第二波导，设置在第二端和表面之间的包层材料的第一厚度，以及设置在第一端和第一波导之间的包层材料的第二厚度。第一厚度可以大于第二厚度。还公开了制造光学封装件的方法。还公开了在光学封装上对准操作的装置和方法。

6. 发明申请

US20060067624A1 Manufacturable connectorization process for optical chip-to-chip interconnects 有权
标题翻译：用于光芯片到芯片互连的可制造的连接器化过程
公开(公告)号：US20060067624A1
公开(公告)日：2006-03-30
申请号：US10955897
申请日：2004-09-30
申请人： Steven Towle , Anne George , Daoqiang Lu , Henning Braunisch
发明人： Steven Towle , Anne George , Daoqiang Lu , Henning Braunisch
IPC分类号： G02B6/30
CPC分类号： G02B6/241 , G02B6/30
摘要： An apparatus comprising a substrate having a trench therein, the trench extending to an edge of the substrate, a waveguide array positioned in the trench, the waveguide array extending to the edge of the substrate, and a ferrule attached at or near the edge of the substrate and spanning a width of the waveguide array, the ferrule being directly in contact with a surface of the waveguide array. A process comprising positioning a waveguide in a trench on a substrate, the waveguide extending to an edge of the substrate, and attaching a ferrule at or near the edge of the substrate, the ferrule including a recess having a bottom, wherein the bottom is in direct contact with a surface of the waveguide.
摘要翻译：一种包括其中具有沟槽的衬底的器件，所述沟槽延伸到衬底的边缘，定位在沟槽中的波导阵列，延伸到衬底边缘的波导阵列以及附接在衬底的边缘处或附近的套圈衬底并跨越波导阵列的宽度，套圈直接与波导阵列的表面接触。一种方法，包括将波导定位在衬底上的沟槽中，波导延伸到衬底的边缘，以及在衬底的边缘处或附近附接套圈，套圈包括具有底部的凹部，其中底部处于与波导的表面直接接触。

7. 发明申请

US20050221598A1 Wafer support and release in wafer processing 有权
标题翻译：晶圆加工中的晶片支撑和释放
公开(公告)号：US20050221598A1
公开(公告)日：2005-10-06
申请号：US10816234
申请日：2004-03-31
申请人： Daoqiang Lu , Steven Towle , Anna George
发明人： Daoqiang Lu , Steven Towle , Anna George
IPC分类号： H01L21/00 , H01L21/30 , H01L21/44 , H01L21/46 , H01L21/68 , H01L21/76 , H01L23/485
CPC分类号： H01L24/10 , H01L21/6835 , H01L21/6836 , H01L24/13 , H01L24/27 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68368 , H01L2224/0401 , H01L2224/04026 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/274 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： Methods and apparatuses for wafer support and release using sacrificial materials in wafer processing. In one embodiment, a solution of a sacrificial polymer is spray-coated on the wafer bump side to form a thin layer of the sacrificial polymer after solvent vaporization. An adhesive layer is then used to attach the wafer bump side onto a wafer support substrate over the sacrificial polymer to support the wafer in backside processing. After wafer thinning and backside metal deposition, the wafer is exposed to heat to thermally decompose the sacrificial polymer into gases. The decomposition of the sacrificial polymer reduces the adhesion of the adhesive layer to the bump side of the wafer such that, when the support substrate is detached from the wafer, the adhesive layer is detached together with the support substrate from the wafer bump side, leaving almost no residual traces.
摘要翻译：在晶片加工中使用牺牲材料进行晶片支撑和释放的方法和装置。在一个实施方案中，将牺牲聚合物溶液喷涂在晶片凸点侧上，以在溶剂挥发后形成牺牲聚合物的薄层。然后使用粘合剂层将晶片凸块侧附着在牺牲聚合物上的晶片支撑基板上，以在背面处理中支撑晶片。在晶片变薄和背面金属沉积之后，将晶片暴露于热量以将牺牲聚合物热分解成气体。牺牲聚合物的分解降低了粘合剂层对晶片的凸块侧的粘合力，使得当支撑基板与晶片分离时，粘合剂层与晶片凸块侧与支撑基板一起脱离，留下几乎没有残留痕迹。

8. 发明申请

US20050127528A1 Underfill integration for optical packages 有权
标题翻译：光学封装的底部填充集成
公开(公告)号：US20050127528A1
公开(公告)日：2005-06-16
申请号：US11036302
申请日：2005-01-14
申请人： Daoqiang Lu , Steven Towle , Anna George
发明人： Daoqiang Lu , Steven Towle , Anna George
IPC分类号： G02B6/42 , H01L21/44 , H01L21/56 , H01L29/40
CPC分类号： G02B6/4214 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The application discloses an apparatus comprising an optical die flip-chip bonded to a substrate and defining a volume between the optical die and the substrate, the optical die including an optically active area on a surface of the die facing the substrate, an optically transparent material occupying at least those portions of the volume substantially corresponding with the optically active area, and an underfill material occupying portions of the volume not occupied by the optically transparent material. Also disclosed is a process comprising flip-chip bonding an optical die to a substrate, the optical die including at least one optically active area on a surface thereof facing the substrate, dispensing an optically transparent material between the optical die and the substrate, wherein the optically transparent material covers the at least one optically active area, dispensing an underfill material in the volume between the optical die and the substrate not occupied by the optically transparent material, and curing the optically transparent material and the underfill material. Other embodiments are described and claimed.
摘要翻译：本申请公开了一种装置，其包括结合到基板并限定光学管芯和基板之间的体积的光学晶片倒装芯片，光学管芯包括在面向基板的管芯的表面上的光学有效区域，光学透明材料占据至少基本对应于光学活性区域的那些部分，以及占据未被光学透明材料占据的部分体积的底部填充材料。还公开了一种包括将光学裸片倒装芯片结合到衬底的工艺，该光学裸片在其面向衬底的表面上包括至少一个光学活性区域，在光学裸片和衬底之间分配光学透明材料，其中，光学透明材料覆盖至少一个光学活性区域，在光学裸片和未被光学透明材料占据的基底之间的体积中分配底部填充材料，并固化光学透明材料和底部填充材料。描述和要求保护其他实施例。

9. 发明申请

US20070075420A1 Microelectronic package having direct contact heat spreader and method of manufacturing same 有权
标题翻译：具有直接接触式散热器的微电子封装及其制造方法
公开(公告)号：US20070075420A1
公开(公告)日：2007-04-05
申请号：US11242176
申请日：2005-09-30
申请人： Daoqiang Lu , Chuan Hu , Gilroy Vandentop , Shriram Ramanathan , Rajashree Baskaran , Valery Dubin
发明人： Daoqiang Lu , Chuan Hu , Gilroy Vandentop , Shriram Ramanathan , Rajashree Baskaran , Valery Dubin
IPC分类号： H01L23/34
CPC分类号： H01L24/83 , H01L21/4871 , H01L23/3735 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/18161 , H01L2924/19106 , H01L2924/00
摘要： A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.
摘要翻译：一种制造具有直接接触散热器的微电子封装的方法，根据该方法形成的封装，根据该方法形成的模具散热器组合以及包含封装的系统。该方法包括金属化微电子管芯的背面以形成直接接触并固定到管芯背面的散热器主体，从而产生模具散热器组合。该封装包括模具散热器组合和与模具结合的衬底。

10. 发明授权

US07195941B2 Optical devices and methods to construct the same 失效
标题翻译：光学器件和方法构造相同
公开(公告)号：US07195941B2
公开(公告)日：2007-03-27
申请号：US10397580
申请日：2003-03-26
申请人： Daoqiang Lu , Gilroy Vandentop
发明人： Daoqiang Lu , Gilroy Vandentop
IPC分类号： H01L21/00 , H32B6/36
CPC分类号： G02B6/423 , G02B6/4232
摘要： Optical devices and methods for constructing the same are disclosed. An example optical device includes an optical transmitter, a photodetector and a waveguide optically coupling the optical transmitter and the photodetector. It also includes a substrate having a first cavity to receive the optical transmitter and a second cavity to receive the second transmitter. The first and second cavities are located and dimensioned to passively align the optical transmitter, the waveguide and the photodetector when the transmitter is inserted into the first cavity and the photodetector is inserted into the second cavity.
摘要翻译：公开了用于构造它们的光学器件和方法。一种示例性的光学器件包括光发射器，光电检测器和光学耦合光发射器和光电检测器的波导。其还包括具有用于接收光发射器的第一腔体和用于接收第二发射器的第二腔体的衬底。第一和第二空腔的位置和尺寸被定位成当发射器被插入到第一空腔中并且光电检测器被插入到第二腔中时被动对准光发射器，波导和光电检测器。

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