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1. 发明申请

US20070075420A1 Microelectronic package having direct contact heat spreader and method of manufacturing same 有权
标题翻译：具有直接接触式散热器的微电子封装及其制造方法
公开(公告)号：US20070075420A1
公开(公告)日：2007-04-05
申请号：US11242176
申请日：2005-09-30
申请人： Daoqiang Lu , Chuan Hu , Gilroy Vandentop , Shriram Ramanathan , Rajashree Baskaran , Valery Dubin
发明人： Daoqiang Lu , Chuan Hu , Gilroy Vandentop , Shriram Ramanathan , Rajashree Baskaran , Valery Dubin
IPC分类号： H01L23/34
CPC分类号： H01L24/83 , H01L21/4871 , H01L23/3735 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/18161 , H01L2924/19106 , H01L2924/00
摘要： A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.
摘要翻译：一种制造具有直接接触散热器的微电子封装的方法，根据该方法形成的封装，根据该方法形成的模具散热器组合以及包含封装的系统。该方法包括金属化微电子管芯的背面以形成直接接触并固定到管芯背面的散热器主体，从而产生模具散热器组合。该封装包括模具散热器组合和与模具结合的衬底。

2. 发明申请

US20060251360A1 Flip-chip mountable optical connector for chip-to-chip optical interconnectability 失效
标题翻译：用于芯片到芯片光学互连的倒装芯片安装光学连接器
公开(公告)号：US20060251360A1
公开(公告)日：2006-11-09
申请号：US11124033
申请日：2005-05-06
申请人： Daoqiang Lu , Gilroy Vandentop , Henning Braunisch
发明人： Daoqiang Lu , Gilroy Vandentop , Henning Braunisch
IPC分类号： G02B6/36
CPC分类号： G02B6/4232 , G02B6/4214 , G02B6/4292 , G02B6/43 , H01L2224/16225 , H05K1/0274 , H05K3/3436
摘要： An optical connector comprises a housing having a cavity extending there through to accept a mating connector. The connector comprises no optical components. Dummy solder bonding pads positioned on the connector allow the connector to be automated flip-chip bonded over a substrate waveguide.
摘要翻译：光学连接器包括壳体，该壳体具有在其上延伸以容纳匹配连接器的空腔。连接器不包括光学部件。定位在连接器上的虚拟焊接焊盘允许连接器在衬底波导上自动倒装芯片结合。

3. 发明授权

US07195941B2 Optical devices and methods to construct the same 失效
标题翻译：光学器件和方法构造相同
公开(公告)号：US07195941B2
公开(公告)日：2007-03-27
申请号：US10397580
申请日：2003-03-26
申请人： Daoqiang Lu , Gilroy Vandentop
发明人： Daoqiang Lu , Gilroy Vandentop
IPC分类号： H01L21/00 , H32B6/36
CPC分类号： G02B6/423 , G02B6/4232
摘要： Optical devices and methods for constructing the same are disclosed. An example optical device includes an optical transmitter, a photodetector and a waveguide optically coupling the optical transmitter and the photodetector. It also includes a substrate having a first cavity to receive the optical transmitter and a second cavity to receive the second transmitter. The first and second cavities are located and dimensioned to passively align the optical transmitter, the waveguide and the photodetector when the transmitter is inserted into the first cavity and the photodetector is inserted into the second cavity.
摘要翻译：公开了用于构造它们的光学器件和方法。一种示例性的光学器件包括光发射器，光电检测器和光学耦合光发射器和光电检测器的波导。其还包括具有用于接收光发射器的第一腔体和用于接收第二发射器的第二腔体的衬底。第一和第二空腔的位置和尺寸被定位成当发射器被插入到第一空腔中并且光电检测器被插入到第二腔中时被动对准光发射器，波导和光电检测器。

4. 发明申请

US20060067609A1 Optical package 失效
标题翻译：光学包装
公开(公告)号：US20060067609A1
公开(公告)日：2006-03-30
申请号：US10954903
申请日：2004-09-30
申请人： Daoqiang Lu , Henning Braunisch , Gilroy Vandentop
发明人： Daoqiang Lu , Henning Braunisch , Gilroy Vandentop
IPC分类号： G02B6/26 , G02B6/12 , G02B6/42
CPC分类号： G02B6/1228 , G02B6/24 , G02B2006/12147
摘要： Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.
摘要翻译：公开了光学封装。在一个方面，光学封装可以包括表面，与表面耦合的微电子器件，与微电子器件耦合的第一波导，具有与第一波导ev逝地耦合的第一端和第二端的第二波导，设置在第二端和表面之间的包层材料的第一厚度，以及设置在第一端和第一波导之间的包层材料的第二厚度。第一厚度可以大于第二厚度。还公开了制造光学封装件的方法。还公开了在光学封装上对准操作的装置和方法。

5. 发明申请

US20070127865A1 OPTICAL DEVICES AND METHODS TO CONSTRUCT THE SAME 审中-公开
标题翻译：光学装置及其构造方法
公开(公告)号：US20070127865A1
公开(公告)日：2007-06-07
申请号：US11671775
申请日：2007-02-06
申请人： Daoqiang Lu , Gilroy Vandentop
发明人： Daoqiang Lu , Gilroy Vandentop
IPC分类号： G02B6/12
CPC分类号： G02B6/423 , G02B6/4232
摘要： Optical devices and methods for constructing the same are disclosed. An example optical device includes an optical transmitter, a photodetector and a waveguide optically coupling the optical transmitter and the photodetector. It also includes a substrate having a first cavity to receive the optical transmitter and a second cavity to receive the second transmitter. The first and second cavities are located and dimensioned to passively align the optical transmitter, the waveguide and the photodetector when the transmitter is inserted into the first cavity and the photodetector is inserted into the second cavity.
摘要翻译：公开了用于构造它们的光学器件和方法。一种示例性光学装置包括光发射器，光电检测器和光学耦合光发射器和光电检测器的波导。其还包括具有用于接收光发射器的第一腔体和用于接收第二发射器的第二腔体的衬底。第一和第二空腔的位置和尺寸被定位成当发射器被插入到第一空腔中并且光电检测器被插入到第二腔中时被动对准光发射器，波导和光电检测器。

6. 发明授权

US07038316B2 Bumpless die and heat spreader lid module bonded to bumped die carrier 失效
标题翻译：无铅模具和散热器盖模块接合到凸起的模具载体
公开(公告)号：US07038316B2
公开(公告)日：2006-05-02
申请号：US10811370
申请日：2004-03-25
申请人： Chuan Hu , Daoqiang Lu , Zhiyong Wang , Gilroy Vandentop
发明人： Chuan Hu , Daoqiang Lu , Zhiyong Wang , Gilroy Vandentop
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： B23K3/0623 , B23K2101/40 , H01L2224/05001 , H01L2224/05009 , H01L2224/05571 , H01L2224/05647 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/00 , H01L2224/05099
摘要： An IC package is assembled from a bumpless die, a die carrier having a plurality of solder bumps thereon, and a heat spreader lid. The bumpless die is bonded to the heat spreader lid to form a module and then the module is bonded to the bumped die carrier.
摘要翻译： IC封装由无冲击模具，其上具有多个焊料凸块的模具载体和散热器盖组装。将无凸起的模具结合到散热器盖上以形成模块，然后将模块结合到凸起的模具载体上。

7. 发明申请

US20060051021A1 Waveguide coupling mechanism 有权
公开(公告)号：US20060051021A1
公开(公告)日：2006-03-09
申请号：US10934858
申请日：2004-09-03
申请人： Henning Braunisch , Steven Towle , Daoqiang Lu , Gilroy Vandentop , Anna George
发明人： Henning Braunisch , Steven Towle , Daoqiang Lu , Gilroy Vandentop , Anna George
IPC分类号： G02B6/32
CPC分类号： G02B6/30 , G02B6/32
摘要： A system is disclosed. The system includes an external waveguide and an IC coupled to the external waveguide. The IC includes at least two lenses and a second waveguide. The lenses couple radiant energy from the external waveguide to the second waveguide.

8. 发明授权

US07283699B2 Optical package 失效
标题翻译：光学包装
公开(公告)号：US07283699B2
公开(公告)日：2007-10-16
申请号：US10954903
申请日：2004-09-30
申请人： Daoqiang Lu , Henning Braunisch , Gilroy Vandentop
发明人： Daoqiang Lu , Henning Braunisch , Gilroy Vandentop
IPC分类号： G02B6/26 , G02B6/12
CPC分类号： G02B6/1228 , G02B6/24 , G02B2006/12147
摘要： Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.
摘要翻译：公开了光学封装。在一个方面，光学封装可以包括表面，与表面耦合的微电子器件，与微电子器件耦合的第一波导，具有与第一波导ev逝地耦合的第一端和第二端的第二波导，设置在第二端和表面之间的包层材料的第一厚度，以及设置在第一端和第一波导之间的包层材料的第二厚度。第一厚度可以大于第二厚度。还公开了制造光学封装件的方法。还公开了在光学封装上对准操作的装置和方法。

9. 发明申请

US20060067606A1 On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device 有权
标题翻译：将衬底上发光器和/或接收器与衬底上的光学器件耦合的衬底上微透镜
公开(公告)号：US20060067606A1
公开(公告)日：2006-03-30
申请号：US10955553
申请日：2004-09-30
申请人： Steven Towle , Henning Braunisch , Daoqiang Lu , Gilroy Vandentop , Anna George
发明人： Steven Towle , Henning Braunisch , Daoqiang Lu , Gilroy Vandentop , Anna George
IPC分类号： G02B6/12
CPC分类号： G02B6/42 , G02B6/4206
摘要： Optical apparatus, methods of forming the apparatus, and methods of using the apparatus are disclosed herein. In one aspect, an optical apparatus may include a substrate, an on-substrate microlens coupled with the substrate to receive light from an off-substrate light emitter and focus the light toward a focal point, and an on-substrate optical device coupled with the substrate proximate the focal point to receive the focused light. Communication of light in the reverse direction is also disclosed. Systems including the optical apparatus are also disclosed.
摘要翻译：本文公开了光学设备，形成设备的方法以及使用该设备的方法。在一个方面，光学装置可以包括衬底，与衬底耦合的衬底上的微透镜以接收来自离衬底光发射器的光并将光聚焦到焦点，以及与衬底上的光学器件耦合的衬底上的光学器件靠近焦点的基板以接收聚焦光。还公开了相反方向的光的通信。还公开了包括光学装置的系统。

10. 发明申请

US20050211749A1 Bumpless die and heat spreader lid module bonded to bumped die carrier 失效
标题翻译：无铅模具和散热器盖模块接合到凸起的模具载体
公开(公告)号：US20050211749A1
公开(公告)日：2005-09-29
申请号：US10811370
申请日：2004-03-25
申请人： Chuan Hu , Daoqiang Lu , Zhiyong Wang , Gilroy Vandentop
发明人： Chuan Hu , Daoqiang Lu , Zhiyong Wang , Gilroy Vandentop
IPC分类号： B23K3/06 , B23K31/02
CPC分类号： B23K3/0623 , B23K2101/40 , H01L2224/05001 , H01L2224/05009 , H01L2224/05571 , H01L2224/05647 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/00 , H01L2224/05099
摘要： An IC package is assembled from a bumpless die, a die carrier having a plurality of solder bumps thereon, and a heat spreader lid. The bumpless die is bonded to the heat spreader lid to form a module and then the module is bonded to the bumped die carrier.
摘要翻译： IC封装由无冲击模具，其上具有多个焊料凸块的模具载体和散热器盖组装。将无凸起的模具结合到散热器盖上以形成模块，然后将模块结合到凸起的模具载体上。

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