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    • 4. 发明授权
    • Oxide plasma etching process with a controlled wineglass shape
    • 氧化物等离子体蚀刻工艺具有受控的酒杯形状
    • US06355557B2
    • 2002-03-12
    • US09121190
    • 1998-07-22
    • James A. StinnettCynthia B. BrooksWalter R. MerryJason Regis
    • James A. StinnettCynthia B. BrooksWalter R. MerryJason Regis
    • H01L214763
    • H01L21/76804
    • An oxide etching method, particularly applicable to forming through an oxide layer a wineglass shaped contact or via hole of controlled shape. The wineglass hole is particularly useful for eased metal hole filling. The bowl is etched by first etching an anisotropic hole through a mask aperture, and then isotropically etching through the same mask aperture. The relative periods of the anisotropic and isotropic etch determine the lateral-to-vertical dimensions of the bowl. The stem is then etched through the same mask aperture with a strongly anisotropic etch. The isotropic etch may be performed in the same chamber as the anisotropic etch or may advantageously be performed in a separate etch chamber having a remote plasma source.
    • 一种氧化物蚀刻方法,特别适用于通过氧化物层形成具有受控形状的酒杯形接触或通孔。 酒杯孔特别适用于宽松的金属孔填充。 通过首先通过掩模孔蚀刻各向异性孔,然后通过相同的掩模孔径进行各向同性蚀刻来蚀刻该碗。 各向异性和各向同性蚀刻的相对周期决定了碗的横向至垂直尺寸。 然后通过强烈的各向异性蚀刻将杆蚀刻通过相同的掩模孔。 各向同性蚀刻可以在与各向异性蚀刻相同的室中进行,或者可以有利地在具有远程等离子体源的分离的蚀刻室中进行。