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    • 10. 发明授权
    • High voltage current limiter and method for making
    • 高压限流器及制作方法
    • US5629536A
    • 1997-05-13
    • US560774
    • 1995-11-21
    • David M. HemingerJoseph H. Slaughter
    • David M. HemingerJoseph H. Slaughter
    • H01L27/04H01L21/822H01L21/8234H01L27/088H01L29/10H01L29/739H01L29/78H03F1/52H01L29/41
    • H01L29/7395H01L29/1095H01L29/7802
    • A current limiter (15) is formed between a silicon substrate (10) and a source region (17) by a channel implant region (20). The channel implant region (20) is not modulated by a gate structure so the maximum voltage that can flow between the silicon substrate (10) and the source region (17) is determined by the doping profile of the ever-present channel implant region (20). A pinch-off structure (12) is used to form a depletion region which can support a large voltage potential between the silicon substrate (10) and the source region (17). In an alternate embodiment, a bipolar device is formed such that a limited current flow can be directed into a base region (32) which is used to modulate a current flow between silicon substrate (30) and an emitter region (38). Using the current limiters (15, 35) it is possible to form an AC current limiter (50) that will limit the current flow regardless of the polarity of the voltage placed across two terminals (51, 52).
    • 通过沟道注入区(20)在硅衬底(10)和源极区(17)之间形成限流器(15)。 通道注入区域(20)不被栅极结构调制,使得可以在硅衬底(10)和源极区域(17)之间流动的最大电压由永久存在的沟道注入区域(的掺杂分布) 20)。 夹断结构(12)用于形成能够支撑硅衬底(10)和源极区(17)之间的大电压电位的耗尽区。 在替代实施例中,形成双极器件,使得有限的电流可以被引导到用于调制硅衬底(30)和发射极区域(38)之间的电流的基极区域(32)中。 使用电流限制器(15,35),可以形成限制电流的AC限流器(50),而不管跨两个端子(51,52)放置的电压的极性。