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1. 发明申请

US20080096297A1 Electrical Contacts for a Semiconductor Light Emitting Apparatus 有权
标题翻译：用于半导体发光器件的电触头
公开(公告)号：US20080096297A1
公开(公告)日：2008-04-24
申请号：US11550488
申请日：2006-10-18
申请人： Stefano Schiaffino , John Julian Uebbing
发明人： Stefano Schiaffino , John Julian Uebbing
IPC分类号： H01L21/00
CPC分类号： H01L33/382 , H01L33/20
摘要： A process for forming electrical contacts for a semiconductor light emitting apparatus is disclosed. The light emitting apparatus has a first layer of first conductivity type, an active layer for generating light overlying the first layer, and a second layer of second conductivity type overlying the active layer. The process involves forming at least a first and a second elongate electrical contact through the second layer and the active layer to provide electrical connection to the first layer, the first and second contacts oriented at an angle to each other, the first contact having a first end in proximity with the second contact, the first end being sufficiently spaced apart from the second contact such that when current is supplied to the first layer through the contacts, current contributions from the first end of the first contact and the second contact in an area generally between the first end and the second contact cause a current density in the area that is approximately equal to a current density elsewhere along the first and second contacts
摘要翻译：公开了一种用于形成用于半导体发光装置的电触头的工艺。发光装置具有第一导电类型的第一层，用于产生覆盖第一层的光的有源层和覆盖有源层的第二导电类型的第二层。该方法包括通过第二层和有源层至少形成第一和第二细长电接触以提供与第一层的电连接，第一和第二接触彼此成一定角度，第一接触具有第一在第二触点附近端部，第一端与第二触点充分隔开，使得当电流通过触点供应到第一层时，来自第一触点的第一端和第一触点的区域中的电流贡献通常在第一端和第二接触之间引起区域中的电流密度近似等于沿着第一和第二触点的其他地方的电流密度

2. 发明授权

US07842963B2 Electrical contacts for a semiconductor light emitting apparatus 有权
标题翻译：用于半导体发光装置的电触头
公开(公告)号：US07842963B2
公开(公告)日：2010-11-30
申请号：US11550488
申请日：2006-10-18
申请人： Stefano Schiaffino , John Julian Uebbing
发明人： Stefano Schiaffino , John Julian Uebbing
IPC分类号： H01L33/62
CPC分类号： H01L33/382 , H01L33/20
摘要： A process for forming electrical contacts for a semiconductor light emitting apparatus is disclosed. The light emitting apparatus has a first layer of first conductivity type, an active layer for generating light overlying the first layer, and a second layer of second conductivity type overlying the active layer. The process involves forming at least a first and a second elongate electrical contact through the second layer and the active layer to provide electrical connection to the first layer, the first and second contacts oriented at an angle to each other, the first contact having a first end in proximity with the second contact, the first end being sufficiently spaced apart from the second contact such that when current is supplied to the first layer through the contacts, current contributions from the first end of the first contact and the second contact in an area generally between the first end and the second contact cause a current density in the area that is approximately equal to a current density elsewhere along the first and second contacts.
摘要翻译：公开了一种用于形成用于半导体发光装置的电触头的工艺。发光装置具有第一导电类型的第一层，用于产生覆盖第一层的光的有源层和覆盖有源层的第二导电类型的第二层。该方法包括通过第二层和有源层至少形成第一和第二细长电接触以提供与第一层的电连接，第一和第二接触彼此成一定角度，第一接触具有第一在第二触点附近端部，第一端与第二触点充分隔开，使得当电流通过触点供应到第一层时，来自第一触点的第一端和第一触点的区域中的电流贡献通常在第一端和第二接触之间引起区域中的电流密度近似等于沿着第一和第二接触件的其他地方的电流密度。

3. 发明授权

US08384118B2 LED assembly having maximum metal support for laser lift-off of growth substrate 有权
标题翻译： LED组件具有用于生长衬底的激光剥离的最大金属支撑
公开(公告)号：US08384118B2
公开(公告)日：2013-02-26
申请号：US12767845
申请日：2010-04-27
申请人： Stefano Schiaffino , Daniel A. Steigerwald , Mari Holcomb , Grigoriy Basin , Paul Martin , John Epler
发明人： Stefano Schiaffino , Daniel A. Steigerwald , Mari Holcomb , Grigoriy Basin , Paul Martin , John Epler
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L33/22 , H01L33/32 , H01L33/382 , H01L33/40 , H01L33/62 , H01L2224/73204 , H01L2924/01322 , H01L2924/00
摘要： Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.
摘要翻译：描述了在将LED管芯接合到基座之后，使用激光剥离工艺形成LED结构以去除生长衬底（例如，蓝宝石）的工艺。 LED芯片的下侧形成有基本上在同一平面中的阳极和阴极电极，其中电极覆盖LED结构的后表面的至少85％。底座具有基本上在同一平面中的阳极和阴极电极的相应布局。 LED芯片电极和基座电极被超声波焊接在一起，使得LED芯片的整个表面几乎被电极和底座支撑。也可以使用其它粘合技术。没有使用底层填料。然后使用激光剥离工艺从LED层去除形成LED结构顶部的生长衬底。在激光剥离过程中产生的极高的压力不会由于电极和基座的LED层的大面积支撑而损坏LED层。

4. 发明授权

US08202741B2 Method of bonding a semiconductor device using a compliant bonding structure 有权
标题翻译：使用柔性接合结构接合半导体器件的方法
公开(公告)号：US08202741B2
公开(公告)日：2012-06-19
申请号：US12397367
申请日：2009-03-04
申请人： James G. Neff , John E. Epler , Stefano Schiaffino
发明人： James G. Neff , John E. Epler , Stefano Schiaffino
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/38 , H01L2224/8112 , H01L2224/81801
摘要： A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.
摘要翻译：柔性接合结构设置在半导体器件和安装件之间。在一些实施例中，该装置是发光装置。当半导体发光器件例如通过向半导体发光器件提供超声能量而将半导体发光器件附接到安装件时，柔性结合结构塌陷以部分地填充半导体发光器件和安装件之间的空间。在一些实施例中，柔性接合结构是在接合期间经历塑性变形的多个金属凸块。在一些实施例中，柔性结合结构是多孔金属层。

5. 发明授权

US07736945B2 LED assembly having maximum metal support for laser lift-off of growth substrate 有权
标题翻译： LED组件具有用于生长衬底的激光剥离的最大金属支撑
公开(公告)号：US07736945B2
公开(公告)日：2010-06-15
申请号：US11611775
申请日：2006-12-15
申请人： Stefano Schiaffino , Daniel A. Steigerwald , Mari Holcomb , Grigoriy Basin , Paul Martin , John Epler
发明人： Stefano Schiaffino , Daniel A. Steigerwald , Mari Holcomb , Grigoriy Basin , Paul Martin , John Epler
IPC分类号： H01L21/00
CPC分类号： H01L33/0079 , H01L33/22 , H01L33/32 , H01L33/382 , H01L33/40 , H01L33/62 , H01L2224/73204 , H01L2924/01322 , H01L2924/00
摘要： Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.
摘要翻译：描述了在将LED管芯接合到基座之后，使用激光剥离工艺形成LED结构以去除生长衬底（例如，蓝宝石）的工艺。 LED芯片的下侧形成有基本上在同一平面中的阳极和阴极电极，其中电极覆盖LED结构的后表面的至少85％。底座具有基本上在同一平面中的阳极和阴极电极的相应布局。 LED芯片电极和基座电极被超声波焊接在一起，使得LED芯片的整个表面几乎被电极和底座支撑。也可以使用其它粘合技术。没有使用底层填料。然后使用激光剥离工艺从LED层去除形成LED结构顶部的生长衬底。在激光剥离过程中产生的极高的压力不会由于电极和基座的LED层的大面积支撑而损坏LED层。

6. 发明授权

US06062681A Bubble valve and bubble valve-based pressure regulator 失效
标题翻译：气泡阀和气泡阀为基础的压力调节器
公开(公告)号：US06062681A
公开(公告)日：2000-05-16
申请号：US114978
申请日：1998-07-14
申请人： Leslie A. Field , Stefano Schiaffino , Phillip W. Barth , Storrs T. Hoen , Naoto A. Kawamura , David K. Donald , Channing R. Robertson , Jonathan D. Servaites
发明人： Leslie A. Field , Stefano Schiaffino , Phillip W. Barth , Storrs T. Hoen , Naoto A. Kawamura , David K. Donald , Channing R. Robertson , Jonathan D. Servaites
IPC分类号： B41J2/175 , B41J2/05
CPC分类号： B41J2/17596 , B41J2/19 , Y10S366/03
摘要： A bubble valve that comprises a liquid delivery channel and a localized heating arrangement. The liquid delivery channel includes an upstream portion and a constriction downstream of the upstream portion. The constriction has a smaller cross-sectional area than the upstream portion. The localized heating arrangement is located in the liquid delivery channel and generates heat to nucleate and enlarge a bubble in the liquid. The constriction is shaped to form a seal with the bubble. The localized heating arrangement additionally generates heat to move the bubble relative to the constriction to control the flow of the liquid. A pressure regulator that comprises a liquid delivery channel connected to a liquid outlet, a sensor located adjacent the liquid outlet, a controller that operates in response to the sensor and a localized heating arrangement. The liquid delivery channel includes an upstream portion, and a constriction located between the upstream portion and the liquid outlet. The constriction has a smaller cross-sectional area than the upstream portion. The localized heating arrangement is located in the liquid delivery channel and generates heat in response to the controller to nucleate and enlarge a bubble in the liquid. The constriction is shaped to form a seal with the bubble. The localized heating arrangement additionally generates heat to move the bubble relative to the constriction to control the flow of the liquid to the liquid outlet.
摘要翻译：气泡阀，其包括液体输送通道和局部加热装置。液体输送通道包括上游部分的下游部分和收缩部分。缩颈具有比上游部分更小的横截面面积。局部加热装置位于液体输送通道中并产生热量以成核并扩大液体中的气泡。缩颈被成形为与气泡形成密封。局部加热装置另外产生热量以相对于收缩部移动气泡以控制液体的流动。一种压力调节器，包括连接到液体出口的液体输送通道，位于液体出口附近的传感器，响应于传感器操作的控制器和局部加热装置。液体输送通道包括上游部分和位于上游部分和液体出口之间的收缩部。缩颈具有比上游部分更小的横截面面积。局部加热装置位于液体输送通道中，响应于控制器产生热量以成核并扩大液体中的气泡。缩颈被成形为与气泡形成密封。局部加热装置另外产生热量以相对于收缩部移动气泡以控制液体流到液体出口的流动。

7. 发明授权

US09076944B2 Method of bonding a semiconductor device using a compliant bonding structure 有权
标题翻译：使用柔性接合结构接合半导体器件的方法
公开(公告)号：US09076944B2
公开(公告)日：2015-07-07
申请号：US13470784
申请日：2012-05-14
申请人： James G. Neff , John E. Epler , Stefano Schiaffino
发明人： James G. Neff , John E. Epler , Stefano Schiaffino
IPC分类号： H01L21/00 , H01L33/62 , H01L33/38 , H01L33/00
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/38 , H01L2224/8112 , H01L2224/81801
摘要： A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.
摘要翻译：柔性接合结构设置在半导体器件和安装件之间。在一些实施例中，该装置是发光装置。当半导体发光器件例如通过向半导体发光器件提供超声能量而将半导体发光器件附接到安装件时，柔性结合结构塌陷以部分地填充半导体发光器件和安装件之间的空间。在一些实施例中，柔性接合结构是在接合期间经历塑性变形的多个金属凸块。在一些实施例中，柔性结合结构是多孔金属层。

8. 发明授权

US07439449B1 Flexible circuit for establishing electrical connectivity with optical subassembly 有权
标题翻译：用于与光学组件建立电连接的柔性电路
公开(公告)号：US07439449B1
公开(公告)日：2008-10-21
申请号：US10409837
申请日：2003-04-09
申请人： Dev E. Kumar , Giorgio Giaretta , Stefano Schiaffino , Donald A. Ice
发明人： Dev E. Kumar , Giorgio Giaretta , Stefano Schiaffino , Donald A. Ice
IPC分类号： H05K1/00
CPC分类号： H05K1/0253 , G02B6/4292 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01S5/02212 , H01S5/02415 , H05K1/0203 , H05K1/0219 , H05K1/0393 , H05K1/141 , H05K1/147 , H05K3/3447 , H05K2201/10121 , H05K2201/10219 , H05K2201/10446 , H01L2924/00
摘要： Flexible printed circuit boards interconnect to adjacent electronic devices through one or more of high speed data, low speed data, high current, and ground lines and pads. The design of the high speed data pads and traces and adjacent ground pads and traces maintains a desired impedance in the flexible circuit and at the transition from the flexible circuit to a printed circuit board, a ceramic header, or other device to ensure high speed operation. The pads are preferably arranged in a two dimensional geometry such that a connecting area of the flexible circuit is narrower than it would preferably be if the pads were arranged linearly. The two dimensional array also allows the use of the high current thermoelectric cooler pads, which require large surface areas that may otherwise not fit in a conventional linear array.
摘要翻译：柔性印刷电路板通过高速数据，低速数据，高电流和接地线和焊盘中的一个或多个互连到相邻电子器件。高速数据焊盘和迹线以及相邻接地焊盘和迹线的设计在柔性电路中保持所需的阻抗，并且在柔性电路到印刷电路板，陶瓷集管或其他器件的过渡期间保持高速运行。垫优选地布置成二维几何形状，使得柔性电路的连接区域比优选地如果衬垫线性排列的那样较窄。二维阵列还允许使用大电流热电冷却器垫，其需要大的表面积，否则其不适合常规线性阵列。

9. 发明申请

US20050196173A1 Receive optical assembly with angled optical receiver 审中-公开
标题翻译：接收具有倾斜光接收器的光学组件
公开(公告)号：US20050196173A1
公开(公告)日：2005-09-08
申请号：US10954091
申请日：2004-09-28
申请人： Stefano Schiaffino , Alex Klajic , Subra Nagarajan , Dincer Birincioglu , Mina Farr
发明人： Stefano Schiaffino , Alex Klajic , Subra Nagarajan , Dincer Birincioglu , Mina Farr
IPC分类号： H04B10/12
CPC分类号： H04B10/66 , G02B6/4207 , G02B6/4257 , G02B6/4263
摘要： A receive optical subassembly comprises a header assembly positioned inside an outer shell that interfaces with a receive optical fiber. The header assembly comprises an upper surface upon which one or more optical components can be mounted, the upper surface defined at least in party by a standard plane. The header assembly further comprises an angled surface that is angled with respect to the standard plane. The angled surface can comprise, for example, a sloped cavity stamped inside the header assembly, or an angled shim positioned on top of the header assembly upper surface. An optical receiver mounted on the angled surface receives an incoming optical signal but reflects at least a portion of stray optical signals away from the incoming optical signal.
摘要翻译：接收光学子组件包括定位在与接收光纤接口的外壳内部的头部组件。头部组件包括上表面，一个或多个光学部件可以安装在上表面上，上表面至少由标准平面限定。头部组件还包括相对于标准平面成角度的成角度的表面。成角度的表面可以包括例如冲压在集管组件内部的倾斜空腔，或者位于集管组件上表面顶部的成角度的垫片。安装在倾斜表面上的光学接收器接收输入光信号，但是将至少一部分杂散光信号反射离开入射光信号。

10. 发明申请

US20050135777A1 Small form factor transceiver with externally modulated laser 有权
标题翻译：带外部调制激光器的小型收发器
公开(公告)号：US20050135777A1
公开(公告)日：2005-06-23
申请号：US11029067
申请日：2005-01-03
申请人： Lewis Aronson , Giorgio Giaretta , Stefano Schiaffino , Dev Kumar , T.G. Mason
发明人： Lewis Aronson , Giorgio Giaretta , Stefano Schiaffino , Dev Kumar , T.G. Mason
IPC分类号： H01L23/055 , H01L23/10 , H01S5/022 , H01S5/024 , G02B6/00
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01S5/02415 , H01L2924/00
摘要： This disclosure is concerned with transceiver modules. In one example, a transceiver module includes a receiver optical subassembly, as well as a transmitter optical subassembly having a header assembly and an externally modulated laser (EML). The header assembly includes a base with first and second sides, as well as a platform attached to the base and having an inside portion near the first side of the base and an outside portion near the second side of the base. The platform of the header assembly further includes a conductive pathway extending through part of the platform. The EML is supported by the platform and electrically communicates with the conductive pathway of the platform. The EML can be passively or actively cooled.
摘要翻译：本公开涉及收发器模块。在一个示例中，收发器模块包括接收器光学子组件以及具有头部组件和外部调制激光器（EML）的发射器光学子组件。头部组件包括具有第一和第二侧面的基部，以及附接到基部并且具有靠近基部的第一侧的内部部分和靠近基部的第二侧的外侧部分的平台。头部组件的平台还包括延伸穿过平台的一部分的导电通路。 EML由平台支撑并与平台的导电通路电连通。 EML可被动或主动冷却。

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