会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Process for making high dielectric constant nitride based materials and
devices using the same
    • 制造高介电常数氮化物基材料的方法及使用其的装置
    • US4464701A
    • 1984-08-07
    • US527454
    • 1983-08-29
    • Stanley RobertsJames G. Ryan
    • Stanley RobertsJames G. Ryan
    • H01L27/04H01G4/10H01G4/20H01L21/318H01L21/822H01G4/06
    • H01G4/20
    • An improved method of fabricating a stable high dielectric constant and low leakage dielectric material which includes oxidizing at a temperature of about 600.degree. C. or higher a layer of a mixture of a transition metal nitride and silicon nitride to produce a mixture which includes an oxide of the transition metal and silicon nitride. The initial mixture of transition metal nitride and silicon nitride may be deposited by reactive sputtering techniques or other known deposition techniques on, a semiconductor or an electrically conductive layer, and the thickness of the mixture should be within the range of 3 to 50 nanometers. By depositing an electrically conductive layer on the oxidized mixture, a capacitor having a high dielectric, and low current leakage dielectric medium is provided.
    • 一种制造稳定的高介电常数和低泄漏介电材料的改进方法,其包括在约600℃或更高的温度下氧化过渡金属氮化物和氮化硅的混合物的层,以产生包括氧化物 的过渡金属和氮化硅。 过渡金属氮化物和氮化硅的初始混合物可以通过反应溅射技术或其它已知的沉积技术沉积在半导体或导电层上,并且混合物的厚度应在3至50纳米的范围内。 通过在氧化的混合物上沉积导电层,提供具有高电介质和低电流泄漏电介质的电容器。
    • 5. 发明申请
    • Pharmaceutically useful compounds
    • 药用有用化合物
    • US20060040869A1
    • 2006-02-23
    • US11059086
    • 2005-02-07
    • Stanley RobertsMaria Gabriella SantoroVasudev JadhavAlan HappeJerome Dauvergne
    • Stanley RobertsMaria Gabriella SantoroVasudev JadhavAlan HappeJerome Dauvergne
    • A61K38/05A61K38/04A61K31/198C07C323/39C07K5/04C07K5/06
    • C07C323/59C07C45/673C07C49/647C07C49/653C07C49/657C07C49/753C07C205/45C07C225/20C07C233/32C07C233/76C07C271/24C07C271/36C07C271/56C07C271/66C07C311/20C07C311/53C07C323/43C07C2601/08C07C2601/10
    • A compound of formula (I) or (II): wherein A is hydrogen or CR1R2; Y and Z are each, independently, hydrogen or a halogen; X is —NR4R5, or R7; R1 is hydrogen, or a substituted or unsubstituted alkyl or alkenyl group containing 1-4 carbon atoms; when X is —NR4R5, R2 is a substituted or unsubstituted alkyl, alkenyl, alkynyl, aryl, aralkyl aralkenyl, or aralkynyl group, that optionally includes at least one heteroatom in its carbon skeleton and contains 1-12 carbon atoms; when X is R7, R2 is an unsubstituted alkyl, alkenyl or alkynyl group, or a substituted or unsubstituted aryl, aralkyl aralkenyl, or aralkynyl group, that optionally includes at least one heteroatom in its carbon skeleton and contains 1-12 carbon atoms; R3 is a substituted or unsubstituted alkyl, alkenyl, alkynyl, aryl, aralkyl aralkenyl, or aralkynyl group, that optionally includes at least one heteroatom in its carbon skeleton and contains 1-12 carbon atoms; R4 is hydrogen, a substituted or unsubstituted alkyl, alkenyl, alkynyl, aryl, aralkyl aralkenyl, or aralkynyl group, that optionally includes at least one heteroatom in its carbon skeleton and contains 1-12 carbon atoms, —COOR8, or —COR8; R5 is hydrogen, or a substituted or unsubstituted alkyl or alkenyl group containing 1-5 carbon atoms; R7 is an unsubstituted alkyl, alkenyl, or alkynyl group, that contains 1-4 carbon atoms; and, R8 is an unsubstituted or halo-substituted alkyl, aryl, or aralkyl group, that contains 1-12 carbon atoms.
    • 式(I)或(II)的化合物:其中A是氢或CR 1 R 2; Y和Z各自独立地为氢或卤素; X是-NR 4 R 5或R 7; R 1是氢或含有1-4个碳原子的取代或未取代的烷基或链烯基; 当X是-NR 4 R 5时,R 2是取代或未取代的烷基,烯基,炔基,芳基,芳烷基芳烯基或芳炔基 基团,其任选地在其碳骨架中包含至少一个杂原子并且含有1-12个碳原子; 当X是R 7时,R 2是未取代的烷基,烯基或炔基,或取代或未取代的芳基,芳烷基芳烯基或芳炔基,其任选地包括在 其碳骨架中至少有一个杂原子,含有1-12个碳原子; R 3是取代或未取代的烷基,烯基,炔基,芳基,芳烷基芳烯基或芳炔基,其任选地在其碳骨架中包含至少一个杂原子并含有1-12个碳原子; R 4是氢,取代或未取代的烷基,烯基,炔基,芳基,芳烷基芳烯基或芳炔基,其任选地在其碳骨架中包含至少一个杂原子并含有1-12个碳原子, -COOR 8或-COR 8; R 5是氢或含有1-5个碳原子的取代或未取代的烷基或链烯基; R 7是含有1-4个碳原子的未取代的烷基,烯基或炔基; R 8是含有1-12个碳原子的未取代或卤素取代的烷基,芳基或芳烷基。
    • 8. 发明授权
    • Process for making polycide structures
    • 制造多晶硅结构的方法
    • US4470189A
    • 1984-09-11
    • US497372
    • 1983-05-23
    • Stanley RobertsFrancis R. White
    • Stanley RobertsFrancis R. White
    • H01L29/78H01L21/027H01L21/28H01L21/3213H01L21/336H01L21/768H01L29/423H01L29/43H01L29/49H01L21/283C23C15/00
    • H01L29/66575H01L21/0272H01L21/28061H01L21/28123H01L21/32134H01L21/32137H01L21/7688H01L21/76889Y10S148/084Y10S438/951
    • An improved method for making polycide structures for use in electrode and wiring interconnection applications. It includes depositing a layer of polysilicon on an insulating layer and forming on this polysilicon layer a silicide structure and a silicon capping layer. The deposited layers are defined and etched through dry etching techniques using a dry etching mask made of a refractory metal that does not form a volatile halide in a dry etching environment. Metals with such characteristics include cobalt (Co), nickel (Ni), iron (Fe), and manganese (Mn). The metal mask and the other deposited layers may be formed and defined using a photoresist mask as a deposition mask formed to be compatible with lift-off techniques.The silicide may be deposited either through a chemical vapor deposition process or through evaporation techniques. If it is formed through the co-evaporation of metal and silicon, then the structure is subjected to a low temperature reaction annealing step at a temperature between 500.degree. and 600.degree. C. prior to dry etching. To avoid a diffusion of the metal mask into the silicon layer, during this low temperature annealing, the process provides for the formation of a diffusion barrier layer between the metal mask and the silicon layer.Following the removal of the metal mask and the diffusion barrier layer, the structure is annealed at a temperature sufficient to cause the homogenization of the silicide layer.
    • 一种用于制造用于电极和布线互连应用的多晶硅结构的改进方法。 它包括在绝缘层上沉积多晶硅层,并在该多晶硅层上形成硅化物结构和硅覆盖层。 通过干法蚀刻技术,使用由干蚀刻环境中不形成挥发性卤化物的难熔金属制成的干蚀刻掩模来定义和蚀刻沉积层。 具有这种特性的金属包括钴(Co),镍(Ni),铁(Fe)和锰(Mn)。 可以使用形成为与剥离技术相容的沉积掩模的光致抗蚀剂掩模来形成和限定金属掩模和其它沉积层。 硅化物可以通过化学气相沉积工艺或通过蒸发技术沉积。 如果通过金属和硅的共蒸发形成,则在干蚀刻之前,在500℃和600℃之间的温度下对该结构进行低温反应退火步骤。 为了避免金属掩模扩散到硅层中,在该低温退火期间,该工艺提供了在金属掩模和硅层之间形成扩散阻挡层。 在除去金属掩模和扩散阻挡层之后,该结构在足以使硅化物层均匀化的温度下退火。