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    • 3. 发明授权
    • Enhanced permeability device structures and method
    • 增强渗透性装置结构和方法
    • US07683445B2
    • 2010-03-23
    • US11740066
    • 2007-04-25
    • Srinivas V. PietambaramNicholas D. RizzoJon M. Slaughter
    • Srinivas V. PietambaramNicholas D. RizzoJon M. Slaughter
    • H01L29/82
    • H01L43/08H01L43/12Y10S977/838Y10S977/933
    • Low power magnetoelectronic device structures and methods therefore are provided. The magnetoelectronic device structure (100, 150, 450, 451) comprises a programming line (104, 154, 156, 454, 456), a magnetoelectronic device (102, 152, 452) magnetically coupled to the programming line (104, 154, 156, 454, 456), and an enhanced permeability dielectric (EPD) material (106, 108, 110, 158, 160, 162, 458, 460, 462) disposed adjacent the magnetoelectronic device. The EPD material (106, 108, 110, 158, 160, 162, 458, 460, 462) comprises multiple composite layers (408) of magnetic nano-particles (406) embedded in a dielectric matrix (409). The composition of the composite layers is chosen to provide a predetermined permeability profile. A method for making a magnetoelectronic device structure is also provided. The method comprises fabricating the magnetoelectronic device (102, 152, 452) and depositing the programming line (104, 154, 156, 454, 456). The EPD material (106, 108, 110, 158, 160, 162, 458, 460, 462) comprising the multiple composite layers (408) is formed around the magnetoelectronic device (102, 152, 452) and/or between the device (102, 152, 452) and the programming line (104, 154, 156, 454, 456). The presence of the EPD structure (470, 480, 490) in proximity to the programming line (104, 154, 156, 454, 456) and/or the magnetoelectronic device (102, 152, 452) reduces the required programming current.
    • 因此提供了低功率磁电子器件结构和方法。 磁电子器件结构(100,150,450,451)包括编程线(104,154,156,454,456),磁耦合到编程线(104,154,452)的磁电子器件(102,152,452) 156,454,456)以及邻近磁电子器件设置的增强磁导率电介质(EPD)材料(106,108,110,158,160,162,458,460,462)。 EPD材料(106,108,110,158,160,162,458,460,462)包括嵌入电介质矩阵(409)中的磁性纳米颗粒(406)的多个复合层(408)。 选择复合层的组成以提供预定的渗透率分布。 还提供了一种制造磁电子器件结构的方法。 该方法包括制造磁电子器件(102,152,452)并沉积编程线(104,154,156,454,456)。 包括多个复合层(408)的EPD材料(106,108,110,158,160,162,458,460,462)形成在磁电子器件(102,152,452)周围和/或在器件( 102,152,452)和编程线(104,154,156,454,465)。 靠近编程线(104,154,156,454,465)和/或磁电子器件(102,152,452)的EPD结构(470,480,490)的存在减少了所需的编程电流。
    • 4. 发明授权
    • Low power magnetoelectronic device structures utilizing enhanced permeability materials
    • 利用增强的渗透性材料的低功率磁电子器件结构
    • US07285835B2
    • 2007-10-23
    • US11066884
    • 2005-02-24
    • Nicholas D. RizzoRenu DaveJon M. SlaughterSrinivas V. Pietambaram
    • Nicholas D. RizzoRenu DaveJon M. SlaughterSrinivas V. Pietambaram
    • H01L43/00
    • H01L43/08H01L43/12Y10S977/838Y10S977/933
    • Low power magnetoelectronic device structures and methods for making the same are provided. One magnetoelectronic device structure (100) comprises a programming line (104), a magnetoelectronic device (102) magnetically coupled to the programming line, and an enhanced permeability dielectric material (106) disposed adjacent the magnetoelectronic device. The enhanced permeability dielectric material has a permeability no less than approximately 1.5. A method for making a magnetoelectronic device structure is also provided. The method comprises fabricating a magnetoelectronic device (102) and depositing a conducting line (104). A layer of enhanced permeability dielectric material (106) having a permeability no less than approximately 1.5 is formed, wherein after the step of fabricating a magnetoelectronic device and the step of depositing a conducting line, the layer of enhanced permeability dielectric material is situated adjacent the magnetoelectronic device.
    • 提供了低功率磁电子器件结构及其制造方法。 一个磁电子器件结构(100)包括编程线(104),磁耦合到编程线的磁电子器件(102)和邻近磁电子器件设置的增强的磁导率介电材料(106)。 增强的导电介电材料具有不小于约1.5的渗透性。 还提供了一种制造磁电子器件结构的方法。 该方法包括制造磁电子器件(102)并沉积导线(104)。 形成具有不小于约1.5的磁导率的增强磁导率介电材料层(106),其中在制造磁电子器件的步骤和沉积导线的步骤之后,增强磁导率介电材料层位于 磁电子器件。
    • 5. 发明授权
    • Low power magnetoelectronic device structures utilizing enhanced permeability materials
    • 利用增强的渗透性材料的低功率磁电子器件结构
    • US07635902B2
    • 2009-12-22
    • US11867189
    • 2007-10-04
    • Nicholas D. RizzoRenu DaveJon M. SlaughterSrinivas V. Pietambaram
    • Nicholas D. RizzoRenu DaveJon M. SlaughterSrinivas V. Pietambaram
    • H01L29/82
    • H01L43/08H01L43/12Y10S977/838Y10S977/933
    • Low power magnetoelectronic device structures and methods for making the same are provided. One magnetoelectronic device structure (100) comprises a programming line (104), a magnetoelectronic device (102) magnetically coupled to the programming line, and an enhanced permeability dielectric material (106) disposed adjacent the magnetoelectronic device. The enhanced permeability dielectric material has a permeability no less than approximately 1.5.A method for making a magnetoelectronic device structure is also provided. The method comprises fabricating a magnetoelectronic device (102) and depositing a conducting line (104). A layer of enhanced permeability dielectric material (106) having a permeability no less than approximately 1.5 is formed, wherein after the step of fabricating a magnetoelectronic device and the step of depositing a conducting line, the layer of enhanced permeability dielectric material is situated adjacent the magnetoelectronic device.
    • 提供了低功率磁电子器件结构及其制造方法。 一个磁电子器件结构(100)包括编程线(104),磁耦合到编程线的磁电子器件(102)和邻近磁电子器件设置的增强的磁导率介电材料(106)。 增强的导电介电材料具有不小于约1.5的渗透性。 还提供了一种制造磁电子器件结构的方法。 该方法包括制造磁电子器件(102)并沉积导线(104)。 形成具有不小于约1.5的磁导率的增强磁导率介电材料层(106),其中在制造磁电子器件的步骤和沉积导线的步骤之后,增强磁导率介电材料层位于 磁电子器件。
    • 9. 发明申请
    • Magnetic tunnel junction memory and method with etch-stop layer
    • 磁隧道结记忆和具有蚀刻停止层的方法
    • US20080096290A1
    • 2008-04-24
    • US11584411
    • 2006-10-19
    • Kenneth H. SmithBrian R. ButcherGregory W. GrynkewichSrinivas V. PietambaramNicholas D. Rizzo
    • Kenneth H. SmithBrian R. ButcherGregory W. GrynkewichSrinivas V. PietambaramNicholas D. Rizzo
    • H01L21/00
    • H01L43/12
    • Methods and apparatus are provided for magnetoresistive memories employing magnetic tunnel junction (MTJ). The apparatus comprises a MTJ (61, 231), first (60, 220) and second (66, 236) electrodes coupled, respectively, to first (62, 232) and second (64, 234) magnetic layers of the MTJ (61, 231), first (54, 204) and second (92, 260) write conductors magnetically coupled to the MTJ (61, 231) and spaced apart from the first (60, 220) and second (66, 236) electrodes, and at least one etch-stop layer (82, 216) located between the first write conductor (54, 204) and the first electrode (60, 220), having an etch rate in a reagent for etching the MTJ (61, 231) and/or the first electrode (60, 220) that is at most 25% of the etch rate of the MTJ (61, 231) and/or first conductor (60, 220) to the same reagent, so as to allow portions of the MTJ (61, 231) and first electrode (60, 220) to be removed without affecting the underlying first write conductor (54, 204). In a further embodiment, a second etch-stop layer (90, 250) is located between the second electrode (66, 236) and the second write conductor (92, 260). Improved yield and performance are obtained.
    • 提供了采用磁隧道结(MTJ)的磁阻存储器的方法和装置。 该装置包括MTJ(61,231),第一(60,220)和第二(66,236)电极,其分别耦合到MTJ(61)的第一(62,232)和第二(64,234)磁性层 ,231),第一(54,204)和第二(92,260)写入导体,其磁耦合到MTJ(61,231)并且与第一(60,220)和第二(66,236)电极间隔开,以及 位于所述第一写入导体(54,204)和所述第一电极(60,220)之间的至少一个蚀刻停止层(82,216)具有用于蚀刻所述MTJ(61,231)的试剂中的蚀刻速率和 /或第一电极(60,220),其至多为MTJ(61,231)和/或第一导体(60,220)的蚀刻速率的25%的相同试剂,以便允许部分 MTJ(61,231)和第一电极(60,220)被去除而不影响下面的第一写入导体(54,204)。 在另一实施例中,第二蚀刻停止层(90,250)位于第二电极(66,236)和第二写入导体(92,260)之间。 获得了提高的产量和性能。
    • 10. 发明授权
    • Magnetic tunnel junction memory and method with etch-stop layer
    • 磁隧道结记忆和具有蚀刻停止层的方法
    • US07445943B2
    • 2008-11-04
    • US11584411
    • 2006-10-19
    • Kenneth H. SmithBrian R. ButcherGregory W. GrynkewichSrinivas V. PietambaramNicholas D. Rizzo
    • Kenneth H. SmithBrian R. ButcherGregory W. GrynkewichSrinivas V. PietambaramNicholas D. Rizzo
    • H01L21/00
    • H01L43/12
    • Methods and apparatus are provided for magnetoresistive memories employing magnetic tunnel junction (MTJ). The apparatus comprises a MTJ (61, 231), first (60, 220) and second (66, 236) electrodes coupled, respectively, to first (62, 232) and second (64, 234) magnetic layers of the MTJ (61, 231), first (54, 204) and second (92, 260) write conductors magnetically coupled to the MTJ (61, 231) and spaced apart from the first (60, 220) and second (66, 236) electrodes, and at least one etch-stop layer (82, 216) located between the first write conductor (54, 204) and the first electrode (60, 220), having an etch rate in a reagent for etching the MTJ (61, 231) and/or the first electrode (60, 220) that is at most 25% of the etch rate of the MTJ (61, 231) and/or first conductor (60, 220) to the same reagent, so as to allow portions of the MTJ (61, 231) and first electrode (60, 220) to be removed without affecting the underlying first write conductor (54, 204). In a further embodiment, a second etch-stop layer (90, 250) is located between the second electrode (66, 236) and the second write conductor (92, 260). Improved yield and performance are obtained.
    • 提供了采用磁隧道结(MTJ)的磁阻存储器的方法和装置。 该装置包括MTJ(61,231),第一(60,220)和第二(66,236)电极,其分别耦合到MTJ(61)的第一(62,232)和第二(64,234)磁性层 ,231),第一(54,204)和第二(92,260)写入导体,其磁耦合到MTJ(61,231)并且与第一(60,220)和第二(66,236)电极间隔开,以及 位于所述第一写入导体(54,204)和所述第一电极(60,220)之间的至少一个蚀刻停止层(82,216)具有用于蚀刻所述MTJ(61,231)的试剂中的蚀刻速率和 /或第一电极(60,220),其至多为MTJ(61,231)和/或第一导体(60,220)的蚀刻速率的25%的相同试剂,以便允许部分 MTJ(61,231)和第一电极(60,220)被去除而不影响下面的第一写入导体(54,204)。 在另一实施例中,第二蚀刻停止层(90,250)位于第二电极(66,236)和第二写入导体(92,260)之间。 获得了提高的产量和性能。