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    • 2. 发明授权
    • Methods for pretreatment of group III-nitride depositions
    • Ⅲ型氮化物沉积预处理方法
    • US08853086B2
    • 2014-10-07
    • US13469048
    • 2012-05-10
    • Yuriy MelnikLu ChenHidehiro Kojiri
    • Yuriy MelnikLu ChenHidehiro Kojiri
    • H01L21/311H01L21/02H01L33/00
    • H01L21/0254H01L21/0242H01L21/02458H01L21/0262H01L21/02658H01L33/007
    • Embodiments of the present disclosure relate to methods for pretreatment of substrates and group III-nitride layers for manufacturing devices such as light emitting diodes (LEDs), laser diodes (LDs) or power electronic devices. One embodiment of the present disclosure provides a method including providing one or more substrates having an aluminum containing surface in a processing chamber and exposing a surface of each of the one or more substrates having an aluminum containing surface to a pretreatment gas mixture to form a pretreated surface. The pretreatment gas mixture includes ammonia (NH3), an aluminum halide gas (e.g., AlCl3, AlCl) and an etchant containing gas that includes a halogen gas (e.g., Cl2) or hydrogen halide gas (e.g., HCl).
    • 本公开的实施例涉及用于制造诸如发光二极管(LED),激光二极管(LD)或功率电子器件的器件的衬底和III族氮化物层的预处理的方法。 本公开的一个实施方案提供了一种方法,包括在处理室中提供具有含铝表面的一个或多个基材,并将具有含铝表面的一个或多个基材中的每一个的表面暴露于预处理气体混合物以形成预处理 表面。 预处理气体混合物包括氨(NH 3),卤化铝气体(例如AlCl 3,AlCl)和含有卤素气体(例如Cl 2)或卤化氢气体(例如HCl)的含蚀刻剂的气体。
    • 5. 发明授权
    • Methods for improved growth of group III nitride semiconductor compounds
    • 改善III族氮化物半导体化合物生长的方法
    • US08980002B2
    • 2015-03-17
    • US13469045
    • 2012-05-10
    • Yuriy MelnikLu ChenHidehiro Kojiri
    • Yuriy MelnikLu ChenHidehiro Kojiri
    • C30B25/14C30B25/18C30B25/02C30B29/40
    • C30B25/14C30B25/02C30B25/18C30B25/183C30B29/40C30B29/403C30B29/406
    • Methods are disclosed for growing group III-nitride semiconductor compounds with advanced buffer layer technique. In an embodiment, a method includes providing a suitable substrate in a processing chamber of a hydride vapor phase epitaxy processing system. The method includes forming an AlN buffer layer by flowing an ammonia gas into a growth zone of the processing chamber, flowing an aluminum halide containing precursor to the growth zone and at the same time flowing additional hydrogen halide or halogen gas into the growth zone of the processing chamber. The additional hydrogen halide or halogen gas that is flowed into the growth zone during buffer layer deposition suppresses homogeneous AlN particle formation. The hydrogen halide or halogen gas may continue flowing for a time period while the flow of the aluminum halide containing precursor is turned off.
    • 公开了采用先进缓冲层技术生长III族氮化物半导体化合物的方法。 在一个实施例中,一种方法包括在氢化物气相外延处理系统的处理室中提供合适的衬底。 该方法包括通过使氨气流入处理室的生长区而形成AlN缓冲层,将含卤化铝的前体流过生长区,同时将另外的卤化氢或卤素气体流入生长区的生长区 处理室。 在缓冲层沉积期间流入生长区的附加卤化氢或卤素气体抑制均匀的AlN颗粒形成。 卤化氢或卤素气体可以持续流动一段时间,同时关闭含卤化铝的前体的流动。