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    • 3. 发明申请
    • ENGINEERED SUBSTRATE
    • 工程基板
    • WO2017134064A1
    • 2017-08-10
    • PCT/EP2017/052080
    • 2017-02-01
    • SOITEC
    • AULNETTE, CécileDIMROTH, FrankOLIVA, Eduard
    • H01L21/18H01L31/0304H01L31/18
    • H01L21/187H01L31/0304H01L31/184
    • Engineered substrate comprising: a seed layer made of a first semiconductor material for growth of a solar cell; a support substrate comprising a base and a surface layer epitaxially grown on a first side of the base, the base and the surface layer made of a second semiconductor material; a direct bonding interface between the seed layer and the surface layer; wherein doping concentration of the surface layer is higher than a predetermined value such that the electrical resistivity at the direct bonding interface is below 10 m Ohm·cm², preferentially below 1 m Ohm·cm²; and wherein doping concentration of the base as well as the thickness of the engineered substrate are such that absorption of the engineered substrate is less than 20%, preferentially less than 10%, and total area-normalized series resistance of the engineered substrate is less than 10 m Ohm·cm², preferentially less than m Ohm·cm². 1
    • 工程衬底,包括:由用于太阳能电池生长的第一半导体材料制成的晶种层; 支撑衬底,其包括基底和在所述基底的第一侧上外延生长的表面层,所述基底和所述表面层由第二半导体材料制成; 种子层和表面层之间的直接结合界面; 其中所述表面层的掺杂浓度高于预定值,使得在所述直接结合界面处的电阻率低于10mΩcm-2,优选低于1mΩcm2。 并且其中基体的掺杂浓度以及工程衬底的厚度使得工程衬底的吸收小于20%,优选小于10%,并且工程衬底的总面积归一化串联电阻小于 10米欧姆厘米厘米,优选小于米欧姆厘米厘米。 1