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1. 发明授权

US07040954B1 Methods of and apparatus for controlling polishing surface characteristics for chemical mechanical polishing 失效
标题翻译：用于控制化学机械抛光抛光表面特性的方法和设备
公开(公告)号：US07040954B1
公开(公告)日：2006-05-09
申请号：US10952608
申请日：2004-09-28
申请人： Simon McClatchie , Peter Norton , Xuyen Pham , Ren Zhou
发明人： Simon McClatchie , Peter Norton , Xuyen Pham , Ren Zhou
IPC分类号： B24B49/18 , B24B53/00
CPC分类号： B24B37/005 , B24B49/18
摘要： Apparatus and methods control CMP to uniformly polish a series of wafers. Average motor current I(avg) drawn by, and related average work W(avg) performed by, motors during CMP on the wafers reliably indicate quality of a roughness polishing characteristic of a polishing surface of a polishing pad. A conditioner controller controls a rate at which the quality of the polishing surface is restored by conditioning in relation to a rate of change of the quality of the polishing surface due to the CMP. Motor current is measured and averaged over many CMP-processed wafers. The method defines a baseline range of values of average work and controls conditioning according to whether average work is within the baseline range. When the polishing surface moves at constant velocity relative to each of the wafers that are being polished, a control signal based on average motor current represents the quality of the polishing characteristic.
摘要翻译：设备和方法控制CMP以均匀抛光一系列晶片。平均电动机电流I（avg），以及在晶圆上的CMP期间电动机执行的相关的平均功率W（avg）可靠地指示抛光垫的抛光表面的粗糙度抛光特性的质量。调节器控制器通过调节相对于由CMP引起的抛光表面的质量的变化率来控制抛光表面的质量恢复的速率。在许多CMP处理的晶片上测量和平均电动机电流。该方法根据平均工作是否在基线范围内定义了平均工作值和控制条件的基准范围。当抛光表面相对于被抛光的每个晶片以恒定速度移动时，基于平均电动机电流的控制信号表示抛光特性的质量。

2. 发明授权

US07040970B2 Apparatus and method for distributing a polishing fluid 失效
标题翻译：用于分配抛光液的装置和方法
公开(公告)号：US07040970B2
公开(公告)日：2006-05-09
申请号：US10892428
申请日：2004-07-15
申请人： Simon McClatchie , Sabir Majumder , Ren Zhou , Xuyen Pham , Tuan A. Nguyen
发明人： Simon McClatchie , Sabir Majumder , Ren Zhou , Xuyen Pham , Tuan A. Nguyen
IPC分类号： B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified by adjustment of geometric parameters of the spray nozzle. The apparatus is configured with actuating mechanisms for translating and rotating the spray nozzle relative to the polishing pad in order to adjust a pattern of distribution of the polishing fluid. The method of dispersing polishing fluid onto the polishing pad produces an even distribution of polishing fluid across a width of the polishing pad.
摘要翻译：一种用于在化学机械平面化工艺期间将抛光流体均匀地分布到抛光垫上的装置和方法，其中抛光液通过从喷嘴喷射的喷雾而分散。可以通过调整喷嘴的几何参数来修改施加到抛光垫的抛光液的图案。该装置配置有用于相对于抛光垫平移和旋转喷嘴的致动机构，以便调节抛光流体的分布模式。将抛光液分散在抛光垫上的方法产生抛光液在抛光垫宽度上的均匀分布。

3. 发明申请

US20060014478A1 Apparatus and method for distributing a polishing fluid 失效
公开(公告)号：US20060014478A1
公开(公告)日：2006-01-19
申请号：US10892428
申请日：2004-07-15
申请人： Simon McClatchie , Sabir Majumder , Ren Zhou , Xuyen Pham , Tuan Nguyen
发明人： Simon McClatchie , Sabir Majumder , Ren Zhou , Xuyen Pham , Tuan Nguyen
IPC分类号： B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified by adjustment of geometric parameters of the spray nozzle. The apparatus is configured with actuating mechanisms for translating and rotating the spray nozzle relative to the polishing pad in order to adjust a pattern of distribution of the polishing fluid. The method of dispersing polishing fluid onto the polishing pad produces an even distribution of polishing fluid across a width of the polishing pad.

4. 发明授权

US07054719B2 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system 有权
标题翻译：用于CMP /清洁系统的使用点输送，控制和混合化学和浆料的系统和方法
公开(公告)号：US07054719B2
公开(公告)日：2006-05-30
申请号：US10828026
申请日：2004-04-19
申请人： Xuyen Pham , Tuan Nguyen , Vien Quach , Ren Zhou
发明人： Xuyen Pham , Tuan Nguyen , Vien Quach , Ren Zhou
IPC分类号： G05B21/00
CPC分类号： G05D11/132
摘要： A method of mixing two or more chemicals such as for a CMP system. The method includes delivering a first chemical to a first inlet port of a point of use mixer at a first flow rate, delivering a second chemical to a second inlet port of the point of use mixer at a second flow rate, controlling the flow of the first and second chemicals into the mixer upon demand for a mixture of the first and second chemicals and balancing the flow of the first and second chemicals into the mixer. The mixture can also be output such as to a CMP process. A system for mixing two or more chemicals is also described.
摘要翻译：一种混合两种或更多种化学物质的方法，例如用于CMP系统。该方法包括以第一流速将第一化学品输送到使用混合点的第一入口端口，以第二流量将第二化学品输送到使用混合器的第二入口端口，第一和第二化学品进入混合器中，根据需要混合第一和第二化学品并将第一和第二化学品的流动平衡到混合器中。混合物也可以输出到CMP工艺。还描述了用于混合两种或更多种化学品的系统。

5. 发明授权

US06872128B1 System, method and apparatus for applying liquid to a CMP polishing pad 失效
标题翻译：将液体施加到CMP抛光垫的系统，方法和装置
公开(公告)号：US06872128B1
公开(公告)日：2005-03-29
申请号：US10676388
申请日：2003-09-30
申请人： Xuyen Pham , Ren Zhou , Wen-Chiang Tu
发明人： Xuyen Pham , Ren Zhou , Wen-Chiang Tu
IPC分类号： B24B37/04 , B24B57/02 , B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A system and method of delivering a liquid to a CMP polishing pad includes supplying the liquid to a nozzle, the nozzle being oriented toward a polishing surface of the CMP polishing pad. The liquid flows at a rate of less than or equal to about 100 cc per minute. A pressurized carrier gas is also supplied to the nozzle. The liquid is substantially evenly sprayed from the nozzle onto the CMP polishing pad.
摘要翻译：将液体输送到CMP抛光垫的系统和方法包括将液体供应到喷嘴，喷嘴朝向CMP抛光垫的抛光表面。液体以小于或等于约100cc /分钟的速率流动。加压的载气也被供应到喷嘴。液体基本均匀地从喷嘴喷射到CMP抛光垫上。

6. 发明授权

US06821195B1 Carrier head having location optimized vacuum holes 失效
标题翻译：具有位置优化的真空孔的承载头
公开(公告)号：US06821195B1
公开(公告)日：2004-11-23
申请号：US10187228
申请日：2002-06-28
申请人： Xuyen Pham , Ren Zhou , Raisa Khavinson
发明人： Xuyen Pham , Ren Zhou , Raisa Khavinson
IPC分类号： B24B1900
CPC分类号： B24B37/30
摘要： An invention is provided for a carrier head for use in a CMP process. The carrier head includes a metal plate that is capable of transferring a downforce to a wafer during a CMP operation. A plurality of vacuum holes is disposed within the metal plate, wherein each vacuum hole is positioned such that the vacuum hole is within five millimeters of an edge of the wafer during the CMP operation. In this manner, each vacuum hole can be positioned such that the vacuum hole is within an edge exclusion zone of the wafer during the CMP operation. In some embodiments, each vacuum hole is positioned such that the vacuum hole is within three millimeters of the edge of the wafer during the CMP operation, such as 2.7 millimeters from the edge of the wafer.
摘要翻译：本发明提供一种用于CMP工艺的载体头。载体头包括在CMP操作期间能够将下压力传递到晶片的金属板。多个真空孔设置在金属板内，其中每个真空孔定位成使得在CMP操作期间真空孔在晶片边缘的5毫米内。以这种方式，每个真空孔可以被定位成使得在CMP操作期间真空孔位于晶片的边缘排除区域内。在一些实施例中，每个真空孔被定位成使得真空孔在CMP操作期间在晶片边缘的三毫米内，例如距离晶片边缘2.7毫米。

7. 发明授权

US06953750B1 Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization 失效
标题翻译：在线性化学机械平面化中控制带表面温度和浆料温度的方法和系统
公开(公告)号：US06953750B1
公开(公告)日：2005-10-11
申请号：US10261568
申请日：2002-09-30
申请人： Patrick P. H. Wu , Xuyen Pham , Tuan A. Nguyen , Ren Zhou
发明人： Patrick P. H. Wu , Xuyen Pham , Tuan A. Nguyen , Ren Zhou
IPC分类号： B24B21/04 , B24B37/015 , B24B49/14 , B24B57/02 , H01L21/302
CPC分类号： B24B37/015 , B24B21/04 , B24B57/02
摘要： A linear chemical mechanical planarization (CMP) system includes a belt pad, a slurry bar having a plurality of nozzles, and a heating module for heating slurry. The heating module has a plurality of heating elements, each of which is coupled in flow communication with one of the plurality of nozzles of the slurry bar. The system also may include a control system for controlling the heating elements of the heating module and first and second temperature sensors coupled to the control system. The first temperature sensors measure the temperature of slurry heated by each of the heating elements, and the second temperature sensors measure the temperature of the surface of the belt pad. A method for dispensing slurry in a linear CMP system, and methods for controlling the temperature of the surface of the belt pad and the temperature of slurry in a linear CMP system also are described.
摘要翻译：线性化学机械平面化（CMP）系统包括带式衬垫，具有多个喷嘴的浆料棒和用于加热浆料的加热模块。加热模块具有多个加热元件，每个加热元件与浆料棒的多个喷嘴中的一个流体连通地联接。该系统还可以包括用于控制加热模块的加热元件的控制系统和耦合到控制系统的第一和第二温度传感器。第一温度传感器测量由每个加热元件加热的浆料的温度，第二温度传感器测量带垫表面的温度。还描述了用于在线性CMP系统中分配浆料的方法，以及用于控制带衬垫的表面的温度和在线性CMP系统中的浆料的温度的方法。

8. 发明授权

US06896586B2 Method and apparatus for heating polishing pad 失效
标题翻译：抛光垫加热方法和装置
公开(公告)号：US06896586B2
公开(公告)日：2005-05-24
申请号：US10112628
申请日：2002-03-29
申请人： Xuyen Pham , Tuan Nguyen , Ren Zhou , David Wei , Linda Jiang , Katgenhalli Y. Ramanujam , Joseph P. Simon , Tony Luong , Sridharan Srivatsan , Anjun Jerry Jin
发明人： Xuyen Pham , Tuan Nguyen , Ren Zhou , David Wei , Linda Jiang , Katgenhalli Y. Ramanujam , Joseph P. Simon , Tony Luong , Sridharan Srivatsan , Anjun Jerry Jin
IPC分类号： B24B21/10 , B24B37/12 , B24B49/14 , H01L21/304 , B24B49/00
CPC分类号： B24B37/12 , B24B21/10 , B24B49/14
摘要： A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.
摘要翻译：提供了一种用于具有线性抛光带的化学机械平面化（CMP）系统的温度控制系统，能够在线性抛光带上的准备位置上施加基底的载体。温度控制系统包括具有多个区域的压板。温度控制系统还包括配置的温度传感器，其确定在准备位置之后的位置处的线性抛光带的温度。该系统还包括控制器，用于响应于从温度传感器接收到的输出，调节调节温度的流体流到压板的多个区域中的选定区域。

9. 发明申请

US20050070212A1 SYSTEM, METHOD AND APPARATUS FOR APPLYING LIQUID TO A CMP POLISHING PAD 失效
标题翻译：用于将液体施加到CMP抛光垫的系统，方法和装置
公开(公告)号：US20050070212A1
公开(公告)日：2005-03-31
申请号：US10676388
申请日：2003-09-30
申请人： Xuyen Pham , Ren Zhou , Wen-Chiang Tu
发明人： Xuyen Pham , Ren Zhou , Wen-Chiang Tu
IPC分类号： B24B37/04 , B24B57/02 , B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A system and method of delivering a liquid to a CMP polishing pad includes supplying the liquid to a nozzle, the nozzle being oriented toward a polishing surface of the CMP polishing pad. The liquid flows at a rate of less than or equal to about 100 cc per minute. A pressurized carrier gas is also supplied to the nozzle. The liquid is substantially evenly sprayed from the nozzle onto the CMP polishing pad.
摘要翻译：将液体输送到CMP抛光垫的系统和方法包括将液体供应到喷嘴，喷嘴朝向CMP抛光垫的抛光表面。液体以小于或等于约100cc /分钟的速率流动。加压的载气也被供应到喷嘴。液体基本均匀地从喷嘴喷射到CMP抛光垫上。

10. 发明授权

US06732017B2 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system 失效
标题翻译：用于CMP /清洁系统的使用点输送，控制和混合化学和浆料的系统和方法
公开(公告)号：US06732017B2
公开(公告)日：2004-05-04
申请号：US10077831
申请日：2002-02-15
申请人： Xuyen Pham , Tuan Nguyen , Vien Quach , Ren Zhou
发明人： Xuyen Pham , Tuan Nguyen , Vien Quach , Ren Zhou
IPC分类号： G05B2100
CPC分类号： G05D11/132
摘要： A chemical mechanical planarization (CMP) system includes a point of use chemical mixing system. The point of use chemical mixing system includes a first and a second pump, a first and a second flow sensor, a mixer and a controller. The first pump has an input coupled to a first chemical supply and the first flow sensor coupled to the output of the first pump. The second pump has an input coupled to a second chemical supply and the second flow sensor coupled to the output of the second pump. The mixer has inputs coupled to the output of the first and second flow sensors. The controller is configured to receive signals from the first and second flow sensors and to produce control signals for the first and second pumps and the mixer. The controller is further configured to cause a mixture of the first and second chemicals upon a demand from the CMP process.
摘要翻译：化学机械平面化（CMP）系统包括使用化学混合系统。使用的化学混合系统包括第一和第二泵，第一和第二流量传感器，混合器和控制器。第一泵具有耦合到第一化学品供应的输入和耦合到第一泵的输出的第一流量传感器。第二泵具有耦合到第二化学品供应的输入端和耦合到第二泵的输出端的第二流量传感器。混合器具有耦合到第一和第二流量传感器的输出的输入。控制器被配置为从第一和第二流量传感器接收信号并且产生用于第一和第二泵和混合器的控制信号。控制器还被配置成根据CMP工艺的要求引起第一和第二化学品的混合。

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