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1. 发明申请

US20070246079A1 Multi zone shower head for cleaning and drying wafer and method of cleaning and drying wafer 审中-公开
标题翻译：用于清洗和干燥晶圆的多区域淋浴头以及清洗和干燥晶圆的方法
公开(公告)号：US20070246079A1
公开(公告)日：2007-10-25
申请号：US11408664
申请日：2006-04-21
申请人： Xuyen Pham
发明人： Xuyen Pham
IPC分类号： B08B3/00 , B08B7/00
CPC分类号： H01L21/67051 , H01L21/6708
摘要： A method and system to clean and rinse and dry wafer comprises a precision control of an outward-moving inner boundary condition and a steady state edge boundary condition. The edge boundary condition can confine the liquid within the substrate by an edge liquid flow step, to create an outer liquid boundary, to confine the liquid within the wafer, and to compensate for liquid lost through process conditions such as wafer spinning. The outward-moving inner boundary condition can control or distribute the liquid within the substrate by an inner liquid boundary condition that moves outward to the edge of the wafer, to create an outward-moving inner liquid boundary, to uniformly distribute liquid within the wafer, and to uniformly drying the wafer.
摘要翻译：清洗和干燥晶片的方法和系统包括向外移动的内边界条件和稳态边界边界条件的精确控制。边缘边界条件可以通过边缘液流步骤将液体限制在基板内，以产生外部液体边界，以将液体限制在晶片内，并补偿在诸如晶片旋转之类的工艺条件下损失的液体。向外移动的内边界条件可以通过向外移动到晶片边缘的内部液体边界条件来控制或分布在基板内的液体，以产生向外移动的内部液体边界，以将液体均匀地分布在晶片内，并均匀干燥晶片。

2. 发明授权

US07054719B2 System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system 有权
标题翻译：用于CMP /清洁系统的使用点输送，控制和混合化学和浆料的系统和方法
公开(公告)号：US07054719B2
公开(公告)日：2006-05-30
申请号：US10828026
申请日：2004-04-19
申请人： Xuyen Pham , Tuan Nguyen , Vien Quach , Ren Zhou
发明人： Xuyen Pham , Tuan Nguyen , Vien Quach , Ren Zhou
IPC分类号： G05B21/00
CPC分类号： G05D11/132
摘要： A method of mixing two or more chemicals such as for a CMP system. The method includes delivering a first chemical to a first inlet port of a point of use mixer at a first flow rate, delivering a second chemical to a second inlet port of the point of use mixer at a second flow rate, controlling the flow of the first and second chemicals into the mixer upon demand for a mixture of the first and second chemicals and balancing the flow of the first and second chemicals into the mixer. The mixture can also be output such as to a CMP process. A system for mixing two or more chemicals is also described.
摘要翻译：一种混合两种或更多种化学物质的方法，例如用于CMP系统。该方法包括以第一流速将第一化学品输送到使用混合点的第一入口端口，以第二流量将第二化学品输送到使用混合器的第二入口端口，第一和第二化学品进入混合器中，根据需要混合第一和第二化学品并将第一和第二化学品的流动平衡到混合器中。混合物也可以输出到CMP工艺。还描述了用于混合两种或更多种化学品的系统。

3. 发明授权

US07018276B2 Air platen for leading edge and trailing edge control 失效
公开(公告)号：US07018276B2
公开(公告)日：2006-03-28
申请号：US10876415
申请日：2004-06-25
申请人： Anthony de la Llera , Xuyen Pham , Cangshan Xu , David Wei , Tony Luong
发明人： Anthony de la Llera , Xuyen Pham , Cangshan Xu , David Wei , Tony Luong
IPC分类号： B24B7/22 , B24B21/08
CPC分类号： B24B21/10 , B24B37/04
摘要： An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

4. 发明授权

US06761626B2 Air platen for leading edge and trailing edge control 失效
标题翻译：用于前缘和后缘控制的气压盘
公开(公告)号：US06761626B2
公开(公告)日：2004-07-13
申请号：US10037452
申请日：2001-12-20
申请人： Anthony de la Llera , Xuyen Pham , Cangshan Xu , David Wei , Tony Luong
发明人： Anthony de la Llera , Xuyen Pham , Cangshan Xu , David Wei , Tony Luong
IPC分类号： B24B722
CPC分类号： B24B21/10 , B24B37/04
摘要： An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.
摘要翻译：描述了空气压板组件，并且包括具有多个同心环的压板。每个环具有多个开口，以便向CMP带提供空气缓冲。至少一个环延伸超过晶片的外边缘以由CMP带平坦化。支撑件与压板连接，并且具有多个用于加压空气的空气端口以传递到压板的环。垫片定位在支撑件和压板之间，并且具有与开口和空气端口对准的多个切口。还包括基地并支持支持。

5. 发明授权

US06569004B1 Polishing pad and method of manufacture 失效
标题翻译：抛光垫及其制造方法
公开(公告)号：US06569004B1
公开(公告)日：2003-05-27
申请号：US09476459
申请日：1999-12-30
申请人： Xuyen Pham
发明人： Xuyen Pham
IPC分类号： B24D1100
CPC分类号： B24B37/20 , B29C53/382 , B29C65/02 , B29C65/04 , B29C65/06 , B29C65/08 , B29C65/10 , B29C65/4815 , B29C65/505 , B29C66/1142 , B29C66/1282 , B29C66/12841 , B29C66/14 , B29C66/43 , B29C66/4322 , B29C66/4324 , B29L2009/00 , B29L2031/709 , B29L2031/736
摘要： A method of joining sections of polishing pad for use in the chemical mechanical planarization of a semiconductor wafer. Two sections of polishing pad are positioned so that they contact one another. The two sections are then welded together to create a robust joint. The joint is resistant to infiltration of slurry and is not susceptible to delamination that commonly occurs in a typical laminate joint.
摘要翻译：一种接合用于半导体晶片的化学机械平面化的抛光垫部分的方法。抛光垫的两个部分被定位成使得它们彼此接触。然后将两个部分焊接在一起以形成牢固的接头。接头耐浆料渗透，并且不易于在典型的层压接头中通常发生分层。

6. 发明授权

US06447380B1 Polishing apparatus and substrate retainer ring providing continuous slurry distribution 失效
标题翻译：抛光装置和基板保持环提供连续的浆料分布
公开(公告)号：US06447380B1
公开(公告)日：2002-09-10
申请号：US09607896
申请日：2000-06-30
申请人： Xuyen Pham , Joe Simon
发明人： Xuyen Pham , Joe Simon
IPC分类号： B24B3704
CPC分类号： B24B37/32
摘要： A polishing apparatus includes a rotatable head assembly including a substrate retainer that incorporates a cavity in the face surface of the substrate retainer for temporarily holding polishing slurry during operation of the polishing apparatus. The cavity resides in the face surface of the substrate retainer at a location adjacent the perimeter surface of the retainer. During operation of the polishing apparatus, slurry flowing along the surface of the polishing pad flows into the cavity where a portion of the slurry is temporarily held. As the head assembly of the polishing apparatus rotates against the polishing pad, slurry continuously flows from the cavity across the polishing pad and is uniformly distributed across the exposed surface of the substrate being polished. An offset in the cavity wall permits used slurry to flow away from the substrate retainer during rotation of the head assembly.
摘要翻译：抛光装置包括可旋转的头部组件，其包括基板保持器，该基板保持器在基板保持器的表面中并入腔体，用于在抛光装置的操作期间临时保持抛光浆料。空腔位于与保持器的周边表面相邻的位置处的基板保持器的表面。在抛光装置的操作期间，沿着抛光垫的表面流动的浆料流入其中浆料的一部分暂时保持的空腔。当抛光装置的头部组件相对于抛光垫旋转时，浆料从腔体连续地流过抛光垫，并且均匀分布在被抛光的基底的暴露表面上。空腔壁中的偏移允许使用的浆料在头部组件旋转期间从衬底保持器流出。

7. 发明授权

US08783305B2 Powder filling apparatus and methods for their use 有权
标题翻译：粉末灌装设备及其使用方法
公开(公告)号：US08783305B2
公开(公告)日：2014-07-22
申请号：US13301414
申请日：2011-11-21
申请人： Kyle A Naydo , Derrick J Parks , Patrick Reich , Gordon Stout , Xuyen Pham , Michael J Rocchio
发明人： Kyle A Naydo , Derrick J Parks , Patrick Reich , Gordon Stout , Xuyen Pham , Michael J Rocchio
IPC分类号： B65B1/08
CPC分类号： A61J3/02 , A61M15/005 , A61M2202/064
摘要： The invention provides methods, systems and apparatus for the metered transport of fine powders into receptacles. According to one exemplary embodiment, an apparatus is provided which comprises a hopper having an opening. The hopper is adapted to receive a bed of fine powder. At least one chamber, which is moveable to allow the chamber to be placed in close proximity to the opening, is also provided. An element having a proximal end and a distal end is positioned within the hopper such that the distal end is near the opening. A vibrator motor is provided to vibrate the element when within the fine powder.
摘要翻译：本发明提供了用于将精细粉末计量运送到容器中的方法，系统和装置。根据一个示例性实施例，提供了一种包括具有开口的料斗的装置。料斗适于接纳细粉床。还提供了至少一个室，其可移动以允许室被放置在靠近开口处。具有近端和远端的元件位于料斗内，使得远端靠近开口。提供振动电机以在细粉末内振动元件。

8. 发明申请

US20060157095A1 Systems and methods for spinning semiconductor wafers 审中-公开
标题翻译：用于纺丝半导体晶片的系统和方法
公开(公告)号：US20060157095A1
公开(公告)日：2006-07-20
申请号：US11038509
申请日：2005-01-19
申请人： Xuyen Pham
发明人： Xuyen Pham
IPC分类号： B08B3/00
CPC分类号： H01L21/67207 , H01L21/67051 , H01L21/6708 , H01L21/67161 , H01L21/68785 , H01L21/68792
摘要： Systems and methods are disclosed to process first and second sides of a wafer. The system includes a platform adapted to receive and rotate said wafer; and first and second heads coupled to the platform to access said first and second sides of said wafer.
摘要翻译：公开了处理晶片的第一和第二侧的系统和方法。该系统包括适于接收和旋转所述晶片的平台; 以及耦合到所述平台以访问所述晶片的所述第一和第二侧的第一和第二头部。

9. 发明授权

US07040970B2 Apparatus and method for distributing a polishing fluid 失效
标题翻译：用于分配抛光液的装置和方法
公开(公告)号：US07040970B2
公开(公告)日：2006-05-09
申请号：US10892428
申请日：2004-07-15
申请人： Simon McClatchie , Sabir Majumder , Ren Zhou , Xuyen Pham , Tuan A. Nguyen
发明人： Simon McClatchie , Sabir Majumder , Ren Zhou , Xuyen Pham , Tuan A. Nguyen
IPC分类号： B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified by adjustment of geometric parameters of the spray nozzle. The apparatus is configured with actuating mechanisms for translating and rotating the spray nozzle relative to the polishing pad in order to adjust a pattern of distribution of the polishing fluid. The method of dispersing polishing fluid onto the polishing pad produces an even distribution of polishing fluid across a width of the polishing pad.
摘要翻译：一种用于在化学机械平面化工艺期间将抛光流体均匀地分布到抛光垫上的装置和方法，其中抛光液通过从喷嘴喷射的喷雾而分散。可以通过调整喷嘴的几何参数来修改施加到抛光垫的抛光液的图案。该装置配置有用于相对于抛光垫平移和旋转喷嘴的致动机构，以便调节抛光流体的分布模式。将抛光液分散在抛光垫上的方法产生抛光液在抛光垫宽度上的均匀分布。

10. 发明授权

US07040954B1 Methods of and apparatus for controlling polishing surface characteristics for chemical mechanical polishing 失效
标题翻译：用于控制化学机械抛光抛光表面特性的方法和设备
公开(公告)号：US07040954B1
公开(公告)日：2006-05-09
申请号：US10952608
申请日：2004-09-28
申请人： Simon McClatchie , Peter Norton , Xuyen Pham , Ren Zhou
发明人： Simon McClatchie , Peter Norton , Xuyen Pham , Ren Zhou
IPC分类号： B24B49/18 , B24B53/00
CPC分类号： B24B37/005 , B24B49/18
摘要： Apparatus and methods control CMP to uniformly polish a series of wafers. Average motor current I(avg) drawn by, and related average work W(avg) performed by, motors during CMP on the wafers reliably indicate quality of a roughness polishing characteristic of a polishing surface of a polishing pad. A conditioner controller controls a rate at which the quality of the polishing surface is restored by conditioning in relation to a rate of change of the quality of the polishing surface due to the CMP. Motor current is measured and averaged over many CMP-processed wafers. The method defines a baseline range of values of average work and controls conditioning according to whether average work is within the baseline range. When the polishing surface moves at constant velocity relative to each of the wafers that are being polished, a control signal based on average motor current represents the quality of the polishing characteristic.
摘要翻译：设备和方法控制CMP以均匀抛光一系列晶片。平均电动机电流I（avg），以及在晶圆上的CMP期间电动机执行的相关的平均功率W（avg）可靠地指示抛光垫的抛光表面的粗糙度抛光特性的质量。调节器控制器通过调节相对于由CMP引起的抛光表面的质量的变化率来控制抛光表面的质量恢复的速率。在许多CMP处理的晶片上测量和平均电动机电流。该方法根据平均工作是否在基线范围内定义了平均工作值和控制条件的基准范围。当抛光表面相对于被抛光的每个晶片以恒定速度移动时，基于平均电动机电流的控制信号表示抛光特性的质量。

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