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    • 3. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110193081A1
    • 2011-08-11
    • US13018879
    • 2011-02-01
    • Hiromichi GODOYasuyuki ARAISatohiro OKAMOTOMari TERASHIMAEriko NISHIDAJunpei SUGAO
    • Hiromichi GODOYasuyuki ARAISatohiro OKAMOTOMari TERASHIMAEriko NISHIDAJunpei SUGAO
    • H01L29/78
    • H01L29/7869
    • An object is to provide a semiconductor device including an oxide semiconductor in which miniaturization is achieved while favorable characteristics are maintained. The semiconductor includes an oxide semiconductor layer, a source electrode and a drain electrode in contact with the oxide semiconductor layer, a gate electrode overlapping with the oxide semiconductor layer, a gate insulating layer provided between the oxide semiconductor layer and the gate electrode, and an insulating layer provided in contact with the oxide semiconductor layer. A side surface of the oxide semiconductor layer is in contact with the source electrode or the drain electrode. An upper surface of the oxide semiconductor layer overlaps with the source electrode or the drain electrode with the insulating layer interposed between the oxide semiconductor layer and the source electrode or the drain electrode.
    • 本发明的目的是提供一种包括氧化物半导体的半导体器件,其中实现了小型化,同时保持了有利的特性。 半导体包括与氧化物半导体层接触的氧化物半导体层,源电极和漏电极,与氧化物半导体层重叠的栅电极,设置在氧化物半导体层和栅电极之间的栅极绝缘层,以及 绝缘层设置成与氧化物半导体层接触。 氧化物半导体层的侧表面与源电极或漏电极接触。 氧化物半导体层的上表面与源电极或漏电极重叠,绝缘层介于氧化物半导体层与源电极或漏电极之间。
    • 4. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR SUBSTRATE MANUFACTURING APPARATUS
    • 制造半导体基板和半导体基板制造装置的方法
    • US20110030901A1
    • 2011-02-10
    • US12903527
    • 2010-10-13
    • Akihisa SHIMOMURAMasaki KOYAMASatohiro OKAMOTO
    • Akihisa SHIMOMURAMasaki KOYAMASatohiro OKAMOTO
    • B32B37/10
    • H01L21/76254
    • An object is to provide a uniform semiconductor substrate in which defective bonding is reduced. A further object is to manufacture the semiconductor substrate with a high yield. A first substrate and a second substrate are bonded in a reduced-pressure atmosphere by placing the first substrate at a certain region surrounded by an airtight holding mechanism provided over a support to surround the certain region of a surface of the support; placing the second substrate so as to come to be in contact with the airtight holding mechanism to ensure airtightness of a space surrounded by the support, the airtight holding mechanism, and the second substrate; evacuating the space whose airtightness is secured, thereby reducing an pressure in the space; disposing the second substrate in close contact with the first substrate using difference between the pressure in the space and outside atmospheric pressure; and performing heat treatment.
    • 目的在于提供一种均匀的半导体衬底,其中不良接合被降低。 另一个目的是以高产率制造半导体衬底。 第一基板和第二基板通过将第一基板放置在由设置在支撑件上的气密保持机构包围的特定区域上而在减压气氛中接合,以围绕支撑体的表面的特定区域; 将第二基板放置成与气密保持机构接触,以确保由支撑体,气密保持机构和第二基板包围的空间的气密性; 疏散其气密性的空间,从而减小空间中的压力; 使用所述空间中的压力和外部大气压之间的差异将所述第二基板设置为与所述第一基板紧密接触; 并进行热处理。
    • 5. 发明申请
    • LIQUID CRYSTAL DISPLAY DEVICE AND ELECTRONIC DEVICE PROVIDED WITH THE SAME
    • 液晶显示器件及其相应的电子器件
    • US20100044713A1
    • 2010-02-25
    • US12608266
    • 2009-10-29
    • Atsushi MIYAGUCHISatohiro OKAMOTO
    • Atsushi MIYAGUCHISatohiro OKAMOTO
    • H01L29/04
    • G02F1/13624G02F1/134363G02F1/1368G02F2001/134318H01L27/124H01L29/04H01L29/41733H01L29/66765
    • A liquid crystal display device provided with a thin film transistor with excellent electrical characteristics and reduced off current, for which increase in manufacturing costs can be suppressed while suppressing reduction in yield. A thin film transistor includes a gate electrode provided over a substrate; a gate insulating film provided to cover the substrate and the gate electrode; a first island-shaped semiconductor layer and a second island-shaped semiconductor layer each formed as a stack of a microcrystalline semiconductor layer and a buffer layer with a depression on an upper surface thereof, over the gate electrode with the gate insulating film interposed therebetween; a conductive semiconductor layer; and a conductive layer provided on the conductive semiconductor layer. The conductive semiconductor layer is provided between the first island-shaped semiconductor layer and the second island-shaped semiconductor layer in contact with the gate insulating film.
    • 具有薄膜晶体管的液晶显示装置,其具有优异的电特性和减小的截止电流,从而可以抑制成品率的降低,从而可以抑制制造成本的增加。 薄膜晶体管包括设置在衬底上的栅电极; 设置为覆盖基板和栅电极的栅极绝缘膜; 第一岛状半导体层和第二岛状半导体层,其各自形成为微晶半导体层的堆叠和在其上表面上具有凹陷的缓冲层,栅极电极之间插入栅极绝缘膜; 导电半导体层; 以及设置在导电半导体层上的导电层。 导电半导体层设置在与栅极绝缘膜接触的第一岛状半导体层和第二岛状半导体层之间。
    • 6. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR SUBSTRATE MANUFACTURING APPARATUS
    • 制造半导体基板和半导体基板制造设备的方法
    • US20090137095A1
    • 2009-05-28
    • US12275809
    • 2008-11-21
    • Akihisa SHIMOMURAMasaki KOYAMASatohiro OKAMOTO
    • Akihisa SHIMOMURAMasaki KOYAMASatohiro OKAMOTO
    • H01L21/02B29C65/00
    • H01L21/76254
    • An object is to provide a uniform semiconductor substrate in which defective bonding is reduced. A further object is to manufacture the semiconductor substrate with a high yield. A first substrate and a second substrate are bonded in a reduced-pressure atmosphere by placing the first substrate at a certain region surrounded by an airtight holding mechanism provided over a support to surround the certain region of a surface of the support; placing the second substrate so as to come to be in contact with the airtight holding mechanism to ensure airtightness of a space surrounded by the support, the airtight holding mechanism, and the second substrate; evacuating the space whose airtightness is secured, thereby reducing an pressure in the space; disposing the second substrate in close contact with the first substrate using difference between the pressure in the space and outside atmpspheric pressure; and performing heat treatment.
    • 目的在于提供一种均匀的半导体衬底,其中不良接合被降低。 另一个目的是以高产率制造半导体衬底。 第一基板和第二基板通过将第一基板放置在由设置在支撑件上的气密保持机构包围的一定区域上而在减压气氛中接合,以围绕支撑体的表面的特定区域; 将第二基板放置成与气密保持机构接触,以确保由支撑体,气密保持机构和第二基板包围的空间的气密性; 疏散其气密性的空间,从而减小空间中的压力; 使用空间中的压力和外部大气压之间的差异将第二基板设置为与第一基板紧密接触; 并进行热处理。