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    • 4. 发明申请
    • Metal laminate and method of etching the same
    • 金属层压板及其蚀刻方法
    • US20050087509A1
    • 2005-04-28
    • US10500846
    • 2003-07-28
    • Koji HirotaMasano KobayashiMinehiro MoriNaoki Nakazawa
    • Koji HirotaMasano KobayashiMinehiro MoriNaoki Nakazawa
    • G11B5/48H05K1/03H05K1/05H05K3/00H05K3/38H01B13/00
    • H05K3/002G11B5/4833H05K1/0346H05K1/056H05K3/0041H05K3/385H05K2201/0154H05K2203/0315H05K2203/163Y10T428/12951Y10T428/265Y10T428/31681
    • The present invention relates to a metal laminate which is broadly used for a flexible wiring board or the like and an etching method therefor. In particular, the present invention relates to a metal laminate which includes a layer obtained by laminating a metal layer and an insulating layer, where the insulating layer is subjected to an etching process, wherein, in a surface of the metal layer which is positioned so as to come in contact with the insulating layer, respective concentrations of main metal element and oxygen element constituting the metal layer are measured from the surface of the metal layer towards inside of the metal layer in a time-elapsing manner according to AES (Auger electron spectroscopy) and a value of the thickness of a metal oxide film of the surface of the metal layer measured at a time when atomic concentrations of the main metal element and the oxygen element constituting the metal layer become equal to each other is in a range of at least 0 Å to less than 50 Å. According to the present invention, an etching time of polyimide in the polyimide metal laminate can be calculated and a flexure used for a suspension for a hard disc drive having a high productivity can be provided.
    • 本发明涉及广泛用于柔性布线板等的金属层压体及其蚀刻方法。 特别地,本发明涉及一种金属层压体,其包括通过层压金属层和绝缘层而获得的层,其中绝缘层进行蚀刻处理,其中在该金属层的表面上 为了与绝缘层接触,根据AES(俄歇电子学(俄歇电子学),从金属层的表面到金属层的内部)以时间流逝的方式测量构成金属层的主要金属元素和氧元素的各自浓度 光谱),并且在构成金属层的主金属元素和氧元素的原子浓度变得相等的时刻测量的金属层的表面的金属氧化物膜的厚度的值在 至少从0到小于50。 根据本发明,可以计算聚酰亚胺金属层叠体中的聚酰亚胺的蚀刻时间,并且可以提供用于具有高生产率的硬盘驱动器的悬架的挠曲。