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1. 发明申请

US20070128857A1 Method for manufacturing copper wires on substrate of flat panel display device 有权
标题翻译：在平板显示装置的基板上制造铜线的方法
公开(公告)号：US20070128857A1
公开(公告)日：2007-06-07
申请号：US11446205
申请日：2006-06-05
申请人： Shrane-Ning Jenq , Hung-Wei Li , Min-Sheng Chu , Chi-Chao Wan , Yung-Yun Wang , Po-Tsun Liu
发明人： Shrane-Ning Jenq , Hung-Wei Li , Min-Sheng Chu , Chi-Chao Wan , Yung-Yun Wang , Po-Tsun Liu
IPC分类号： H01L21/4763
CPC分类号： H01L21/2885 , C23C18/1605 , C23C18/1651 , C23C18/1653 , C23C18/38 , C25D3/38 , C25D5/022 , H01L27/12 , H01L27/124 , H01L27/1292
摘要： A method for manufacturing copper wires on a substrate for a flat panel display device is disclosed. The method comprises following steps: providing a substrate; forming a seed layer on the surface; forming a patterned photoresist on the surface of the seed layer to expose a part of the seed layer; and plating a copper layer on the exposed part of the seed layer. As the copper layer is plated, an electrolyte solution comprises a sulfur-containing compound is used. The angle between the surface of the copper layer and the contact surface of the seed layer is greater than 0 degree and less than 90 degree. Through the method illustrated above, the film step-coverage in the following process can be improved, the generated voids in device can be reduced, the manufacturing steps can be simplified, and the complicated etching process can be avoided.
摘要翻译：公开了一种在平板显示装置用基板上制造铜线的方法。该方法包括以下步骤：提供衬底; 在表面上形成种子层; 在所述种子层的表面上形成图案化的光致抗蚀剂以暴露所述种子层的一部分; 并在种子层的暴露部分上镀覆铜层。当铜层被镀覆时，使用包含含硫化合物的电解质溶液。铜层的表面与种子层的接触面之间的角度大于0度且小于90度。通过上述方法，可以改善以下工序中的膜阶梯覆盖，可以减少器件中产生的空隙，可以简化制造步骤，可以避免复杂的蚀刻工艺。

2. 发明授权

US07393786B2 Method for manufacturing copper wires on substrate of flat panel display device 有权
标题翻译：在平板显示装置的基板上制造铜线的方法
公开(公告)号：US07393786B2
公开(公告)日：2008-07-01
申请号：US11446205
申请日：2006-06-05
申请人： Shrane-Ning Jenq , Hung-Wei Li , Min-Sheng Chu , Chi-Chao Wan , Yung-Yun Wang , Po-Tsun Liu
发明人： Shrane-Ning Jenq , Hung-Wei Li , Min-Sheng Chu , Chi-Chao Wan , Yung-Yun Wang , Po-Tsun Liu
IPC分类号： H01L21/44
CPC分类号： H01L21/2885 , C23C18/1605 , C23C18/1651 , C23C18/1653 , C23C18/38 , C25D3/38 , C25D5/022 , H01L27/12 , H01L27/124 , H01L27/1292
摘要： A method for manufacturing copper wires on a substrate for a flat panel display device is disclosed. The method comprises following steps: providing a substrate; forming a seed layer on the surface; forming a patterned photoresist on the surface of the seed layer to expose a part of the seed layer; and plating a copper layer on the exposed part of the seed layer. As the copper layer is plated, an electrolyte solution comprises a sulfur-containing compound is used. The angle between the surface of the copper layer and the contact surface of the seed layer is greater than 0 degree and less than 90 degree. Through the method illustrated above, the film step-coverage in the following process can be improved, the generated voids in device can be reduced, the manufacturing steps can be simplified, and the complicated etching process can be avoided.
摘要翻译：公开了一种在平板显示装置用基板上制造铜线的方法。该方法包括以下步骤：提供衬底; 在表面上形成种子层; 在所述种子层的表面上形成图案化的光致抗蚀剂以暴露所述种子层的一部分; 并在种子层的暴露部分上镀覆铜层。当铜层被镀覆时，使用包含含硫化合物的电解质溶液。铜层的表面与种子层的接触面之间的角度大于0度且小于90度。通过上述方法，可以改善以下工序中的膜阶梯覆盖，可以减少器件中产生的空隙，可以简化制造步骤，可以避免复杂的蚀刻工艺。

3. 发明授权

US5874185A Polymer electrolyte material for use in lithium and lithium ion batteries 失效
标题翻译：用于锂离子和锂离子电池的聚合物电解质材料
公开(公告)号：US5874185A
公开(公告)日：1999-02-23
申请号：US900209
申请日：1997-07-24
申请人： Yung-Yun Wang , Chi-Chao Wan , Hsi-Yueh Sung
发明人： Yung-Yun Wang , Chi-Chao Wan , Hsi-Yueh Sung
IPC分类号： H01M10/052 , H01M10/0565 , H01M10/40 , H01M10/36
CPC分类号： H01M10/052 , H01M10/0565
摘要： A polymer electrolyte for use in lithium batteries is disclosed. It contains: (a) a poly(vinyl chloride-co-vinyl acetate), or PVCAC, which is a copolymer containing 5 to 25 mol % of a vinyl chloride monomer, and 75 to 95 mol % of a vinyl acetate monomer; (b) a lithium salt; and (c) an organic solvent mixture. The organic solvent mixture contains at least one component selected from the group consisting of EC and PC and a high-boiling-point organic solvent. Preferably, the amount of the PVCAC is about 16-40 mol % of the polymer electrolyte, lithium about 3-12 mol %, and the organic solvent mixture about 48-81 mol %, when the polymer electrolyte was freshly prepared. Preferrably, the high-boiling-point is DMF or NMP. Within the organic solvent mixture, if DMF is used, it should preferably be about 20-60 mol % of the total organic solvent mixture. If NMP is used, it should preferably be about 10-40 mol % of the total organic solvent mixture.
摘要翻译：公开了一种用于锂电池的聚合物电解质。它包含：（a）聚（氯乙烯 - 共 - 乙酸乙烯酯）或PVCAC，它是含有5至25mol％的氯乙烯单体的共聚物和75至95mol％的乙酸乙烯酯单体; （b）锂盐; 和（c）有机溶剂混合物。有机溶剂混合物含有至少一种选自EC和PC的组分和高沸点有机溶剂。优选地，当新鲜制备聚合物电解质时，PVCAC的量为聚合物电解质的约16-40摩尔％，锂约3-12摩尔％，有机溶剂混合物约为48-81摩尔％。优选的是高沸点是DMF或NMP。在有机溶剂混合物中，如果使用DMF，则应优选为总有机溶剂混合物的约20-60摩尔％。如果使用NMP，则应优选为总有机溶剂混合物的约10-40摩尔％。

4. 发明申请

US20080063788A1 Method for preparing an electrode comprising an electrochemical catalyst layer thereon 有权
标题翻译：制备其上包含电化学催化剂层的电极的方法
公开(公告)号：US20080063788A1
公开(公告)日：2008-03-13
申请号：US11715426
申请日：2007-03-08
申请人： Tzu-Chien Wei , Chi-Chao Wan , Yeng-Yun Wang , Hui-Hsiu Tang
发明人： Tzu-Chien Wei , Chi-Chao Wan , Yeng-Yun Wang , Hui-Hsiu Tang
IPC分类号： B05D5/12
CPC分类号： H01G9/2022 , H01G9/2031 , H01G9/2059 , Y02E10/542 , Y02P70/521
摘要： Disclosed is a method for preparing an electrode having an electrochemical catalyst layer, comprising the steps of: providing a substrate having a conductive layer thereon, immersing the substrate in a first solution having a conditioner to form a conditioner layer on the surface of the conductive layer, and immersing the substrate in a second solution having polymer-capped noble metal nanoclusters to form an electrochemical catalyst layer on the conditioner layer of the substrate. This method can reduce the amount of noble metal used in the electrochemical catalyst layer and is suitable for mass production.
摘要翻译：公开了一种制备具有电化学催化剂层的电极的方法，包括以下步骤：提供其上具有导电层的基板，将基板浸入具有调节剂的第一溶液中，以在导电层的表面上形成调理剂层并将基板浸渍在具有聚合物封端的贵金属纳米簇的第二溶液中，以在基板的调理层上形成电化学催化剂层。该方法可以减少在电化学催化剂层中使用的贵金属的量并且适合批量生产。

5. 发明授权

US07838065B2 Method for preparing an electrode comprising an electrochemical catalyst layer thereon 有权
标题翻译：制备其上包含电化学催化剂层的电极的方法
公开(公告)号：US07838065B2
公开(公告)日：2010-11-23
申请号：US11715426
申请日：2007-03-08
申请人： Tzu-Chien Wei , Chi-Chao Wan , Yeng-Yun Wang , Hui-Hsiu Tang
发明人： Tzu-Chien Wei , Chi-Chao Wan , Yeng-Yun Wang , Hui-Hsiu Tang
IPC分类号： B05D5/12
CPC分类号： H01G9/2022 , H01G9/2031 , H01G9/2059 , Y02E10/542 , Y02P70/521
摘要： Disclosed is a method for preparing an electrode having an electrochemical catalyst layer, comprising the steps of: providing a substrate having a conductive layer thereon, immersing the substrate in a first solution having a conditioner to form a conditioner layer on the surface of the conductive layer, and immersing the substrate in a second solution having polymer-capped noble metal nanoclusters to form an electrochemical catalyst layer on the conditioner layer of the substrate. This method can reduce the amount of noble metal used in the electrochemical catalyst layer and is suitable for mass production.
摘要翻译：公开了一种制备具有电化学催化剂层的电极的方法，包括以下步骤：提供其上具有导电层的基板，将基板浸入具有调节剂的第一溶液中，以在导电层的表面上形成调理剂层并将基板浸渍在具有聚合物封端的贵金属纳米簇的第二溶液中，以在基板的调理层上形成电化学催化剂层。该方法可以减少在电化学催化剂层中使用的贵金属的量并且适合批量生产。

6. 发明授权

US06572673B2 Process for preparing noble metal nanoparticles 失效
公开(公告)号：US06572673B2
公开(公告)日：2003-06-03
申请号：US09876093
申请日：2001-06-08
申请人： Chien-Liang Lee , Chi-Chao Wan
发明人： Chien-Liang Lee , Chi-Chao Wan
IPC分类号： B22F924
CPC分类号： B22F1/0022 , B22F9/24 , B22F2998/00 , B82Y30/00 , B22F1/0018
摘要： A process for preparing metal nanoparticles, comprising reacting suitable metal salts and anionic surfactant containing an anionic group of carboxylic group (COO−), sulfate group (SO42−) or sulfonate group (SO32−) as reducing agent in water under reflux at a temperature of 50-140° C., such that under the reducing power of said anionic surfactant itself, the metal salts can be effectively reduced into metal nanoparticles having a uniform particle size and that the reaction will be not too fast, no large microparticle will be formed, the yield will not be lowered, and the nanoparticle thus prepared can be dispersed stably in polar and non-polar solvent.

7. 发明授权

US06472023B1 Seed layer of copper interconnection via displacement 失效
标题翻译：通过位移铜互连的种子层
公开(公告)号：US06472023B1
公开(公告)日：2002-10-29
申请号：US09900851
申请日：2001-07-10
申请人： Yang Wu , Chi-Chao Wan
发明人： Yang Wu , Chi-Chao Wan
IPC分类号： B05D118
CPC分类号： H01L21/76873 , C23C18/42 , C23C28/00 , H01L21/288 , H01L21/76843
摘要： A process for the fabrication of submicron copper interconnection useful on IC structures without deposition of copper seed is described. A dense metal layer can be deposited through contact displacement reaction between diffusion barrier layer and metal ions in solution under appropriate conditions. The metal layer formed by the displacement deposition can serve as the conducting material for subsequent copper electroplating. Moreover, the costly process for applying seed layer through CVD or PVD can be eliminated.
摘要翻译：描述了用于制造不沉积铜种子的IC结构的亚微米铜互连的方法。可以在合适的条件下通过溶液中的扩散阻挡层和金属离子之间的接触置换反应来沉积致密的金属层。通过置换沉积形成的金属层可以用作随后的铜电镀的导电材料。此外，可以消除通过CVD或PVD施加晶种层的昂贵的方法。

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