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1. 发明授权

US06572673B2 Process for preparing noble metal nanoparticles 失效
公开(公告)号：US06572673B2
公开(公告)日：2003-06-03
申请号：US09876093
申请日：2001-06-08
申请人： Chien-Liang Lee , Chi-Chao Wan
发明人： Chien-Liang Lee , Chi-Chao Wan
IPC分类号： B22F924
CPC分类号： B22F1/0022 , B22F9/24 , B22F2998/00 , B82Y30/00 , B22F1/0018
摘要： A process for preparing metal nanoparticles, comprising reacting suitable metal salts and anionic surfactant containing an anionic group of carboxylic group (COO−), sulfate group (SO42−) or sulfonate group (SO32−) as reducing agent in water under reflux at a temperature of 50-140° C., such that under the reducing power of said anionic surfactant itself, the metal salts can be effectively reduced into metal nanoparticles having a uniform particle size and that the reaction will be not too fast, no large microparticle will be formed, the yield will not be lowered, and the nanoparticle thus prepared can be dispersed stably in polar and non-polar solvent.

2. 发明授权

US08697489B2 Package structure and package process 有权
标题翻译：包装结构和包装过程
公开(公告)号：US08697489B2
公开(公告)日：2014-04-15
申请号：US12635701
申请日：2009-12-11
申请人： Chien-Liang Lee
发明人： Chien-Liang Lee
IPC分类号： H01L21/00
CPC分类号： H01L25/18 , H01L21/4853 , H01L21/563 , H01L23/3128 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H05K3/305 , H05K3/3436 , H05K2201/035 , H05K2201/10734 , H05K2201/10977 , Y02P70/613 , Y10T428/24091 , Y10T428/2414 , Y10T428/24165 , Y10T428/24182 , Y10T428/2424 , H01L2924/00
摘要： A package structure and a package process are provided. In the package process, firstly, a first electronic component having a plurality of first conductive bumps at a bottom thereof is provided. Then, a first insulation paste is coated on the first conductive bumps. The first electronic component is disposed on a circuit substrate having a plurality of substrate pads, and the first conductive bumps are respectively situated on the substrate pads. Next, a heating process is performed to both of the first conductive bumps and the first insulation paste, wherein the first conductive bumps is reflowed to bond the first electronic component and the substrate pads, and the first insulation paste is cured.
摘要翻译：提供了封装结构和封装工艺。在封装工序中，首先，设置在底部具有多个第一导电凸块的第一电子部件。然后，将第一绝缘膏涂覆在第一导电凸块上。第一电子部件设置在具有多个基板焊盘的电路基板上，第一导电凸块分别位于基板焊盘上。接下来，对第一导电凸块和第一绝缘膏进行加热处理，其中第一导电凸块被回流以接合第一电子部件和基板焊盘，并且第一绝缘膏被固化。

3. 发明申请

US20110031605A1 PACKAGE STRUCTURE AND PACKAGE PROCESS 有权
标题翻译：包装结构和包装过程
公开(公告)号：US20110031605A1
公开(公告)日：2011-02-10
申请号：US12635701
申请日：2009-12-11
申请人： Chien-Liang Lee
发明人： Chien-Liang Lee
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L25/18 , H01L21/4853 , H01L21/563 , H01L23/3128 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H05K3/305 , H05K3/3436 , H05K2201/035 , H05K2201/10734 , H05K2201/10977 , Y02P70/613 , Y10T428/24091 , Y10T428/2414 , Y10T428/24165 , Y10T428/24182 , Y10T428/2424 , H01L2924/00
摘要： A package structure and a package process are provided. In the package process, firstly, a first electronic component having a plurality of first conductive bumps at a bottom thereof is provided. Then, a first insulation paste is coated on the first conductive bumps. The first electronic component is disposed on a circuit substrate having a plurality of substrate pads, and the first conductive bumps are respectively situated on the substrate pads. Next, a heating process is performed to both of the first conductive bumps and the first insulation paste, wherein the first conductive bumps is reflowed to bond the first electronic component and the substrate pads, and the first insulation paste is cured.
摘要翻译：提供了封装结构和封装工艺。在封装工序中，首先，设置在底部具有多个第一导电凸块的第一电子部件。然后，将第一绝缘膏涂覆在第一导电凸块上。第一电子部件设置在具有多个基板焊盘的电路基板上，第一导电凸块分别位于基板焊盘上。接下来，对第一导电凸块和第一绝缘膏进行加热处理，其中第一导电凸块被回流以接合第一电子部件和基板焊盘，并且第一绝缘膏被固化。

4. 发明授权

US08269619B2 Wireless light indication and control device 失效
标题翻译：无线灯指示和控制装置
公开(公告)号：US08269619B2
公开(公告)日：2012-09-18
申请号：US12557115
申请日：2009-09-10
申请人： Chien-Liang Lee
发明人： Chien-Liang Lee
IPC分类号： B60Q1/34
CPC分类号： B60Q1/2676 , A42B3/0453 , B60Q2900/30 , B62J6/005 , B62J2006/008
摘要： A wireless light indication and control device connected with a helmet is provided. The wireless light indication and control device includes a direction detector, a wireless transmitter, and at least one light element, wherein the direction detector senses a movement of the helmet to generate a turning signal, the wireless transmitter receives the turning signal and cooperates with a frequency hopping unit and a matching unit to generate a wireless signal, and the light element includes a wireless receiver for receiving the wireless signal. As the user wears the helmet of the present invention, the light can generate warning effect based on the movement of the helmet, so as to provide the user a more comprehensive traffic safety.
摘要翻译：提供与头盔连接的无线指示和控制装置。无线指示和控制装置包括方向检测器，无线发射器和至少一个光元件，其中方向检测器感测头盔的移动以产生转向信号，无线发射器接收转向信号并与一个跳频单元和匹配单元以产生无线信号，并且所述光元件包括用于接收所述无线信号的无线接收器。当使用者佩戴本发明的头盔时，灯可以基于头盔的移动产生警告效果，从而为用户提供更全面的交通安全性。

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