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1. 发明授权

US08430153B2 Heat dissipation device having heat sink enclosing conductive member therein 失效
标题翻译：具有散热器的散热装置，其中包含导电部件
公开(公告)号：US08430153B2
公开(公告)日：2013-04-30
申请号：US12643931
申请日：2009-12-21
申请人： Shou-Biao Xu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Shou-Biao Xu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F7/00 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0233 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions.
摘要翻译：散热装置包括基座，安装在基座上并经由两个第一热管连接到基座的第一散热器和位于第一散热器的侧面的第二散热器，并经由第二热管。第一个散热片包括两个散热片组。其中一个翅片组堆叠在另一个翅片组上。每个翅片组包括从翅片组的中心沿着水平方向沿翅片组的周边径向扩散的多个翅片。

2. 发明授权

US08365810B2 Active heat sink for use with electronic device 失效
标题翻译：主动散热器，用于电子设备
公开(公告)号：US08365810B2
公开(公告)日：2013-02-05
申请号：US12496653
申请日：2009-07-02
申请人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0208 , F28D15/0275 , F28F1/34 , F28F13/125 , F28F2215/00 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.
摘要翻译：散热器包括导热基座，热连接并相对于基座旋转的导热轴和多个翅片。轴包括热连接到基座的热吸收部分和与吸热部分连接的散热部分。翅片设置在轴的散热部分上。

3. 发明申请

US20110024090A1 HEAT DISSIPATION DEVICE 有权
标题翻译：散热装置
公开(公告)号：US20110024090A1
公开(公告)日：2011-02-03
申请号：US12641340
申请日：2009-12-18
申请人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28D15/02
CPC分类号： F28D15/0233 , F28D15/0275 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section.
摘要翻译：示例性的散热装置包括基板，两个翅片组，芯，连接到芯的顶部的风扇支架，位于翅片组上方并由风扇支架固定的风扇和两个热管。两个翅片组协作以在其中心形成中心孔并具有从中心孔径向向外延伸的多个翅片。芯放置在基板上并接收在中心孔中。每个热管包括夹在核心和基板之间的蒸发部分，夹在两个翅片组之间的弧形冷凝部分和连接蒸发部分和冷凝部分的绝热部分。

4. 发明授权

US08579019B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US08579019B2
公开(公告)日：2013-11-12
申请号：US12641340
申请日：2009-12-18
申请人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： F28D15/0233 , F28D15/0275 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section.
摘要翻译：示例性的散热装置包括基板，两个翅片组，芯，连接到芯的顶部的风扇支架，位于翅片组上方并由风扇支架固定的风扇和两个热管。两个翅片组协作以在其中心形成中心孔并具有从中心孔径向向外延伸的多个翅片。芯放置在基板上并接收在中心孔中。每个热管包括夹在核心和基板之间的蒸发部分，夹在两个翅片组之间的弧形冷凝部分和连接蒸发部分和冷凝部分的绝热部分。

5. 发明授权

US07990720B2 Electronic system with heat dissipation structure 有权
标题翻译：具有散热结构的电子系统
公开(公告)号：US07990720B2
公开(公告)日：2011-08-02
申请号：US12614452
申请日：2009-11-09
申请人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： G06F1/181 , G06F1/20
摘要： An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.
摘要翻译：诸如计算机系统的电子系统包括限定其侧面的开口的壳体，布置在壳体中的母板，位于母板侧的硬盘和覆盖壳体的开口的散热结构。主板包括面向壳体的开口的印刷电路板，安装在印刷电路板上并朝向开口的第一电子部件和第二电子部件。散热结构包括与壳体接合的基部和从基部延伸到壳体外部的翅片。底座包括接触第一和第二电子部件的第一接合部分和接触硬盘的第二接合部分。第一接合部分和第二接合部分彼此处于不同的高度。

6. 发明授权

US08061411B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08061411B2
公开(公告)日：2011-11-22
申请号：US12396484
申请日：2009-03-03
申请人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device removing heat from an electronic device includes a base plate, a fin set in thermal connection with the base plate, a fixing member and two fans. The fixing member includes a driving part coupled to a top of the fin set, two mounting parts located at two opposite sides of a circumference of the fin set and two connecting arms extending outwardly from the driving part and connecting with the two mounting parts. The two fans, respectively mounted on the two mounting parts of the fixing member and located at two opposite sites of the circumference of the fin set, are driven to rotate around the circumference of the fin set by the driving part and generate two streams of airflow which flow through the fin set that are non-intersecting.
摘要翻译：从电子设备去除热量的散热装置包括基板，与基板热连接的散热片，固定部件和两个风扇。固定构件包括联接到翅片组的顶部的驱动部分，位于翅片组的圆周的两个相对侧的两个安装部分和从驱动部分向外延伸并与两个安装部分连接的两个连接臂。分别安装在固定构件的两个安装部分上并且位于翅片组的圆周的两个相对位置处的两个风扇被驱动以由驱动部分围绕翅片组的周边旋转，并产生两股气流其流过不相交的翅片组。

7. 发明申请

US20110048675A1 HEAT SINK 审中-公开
标题翻译：散热器
公开(公告)号：US20110048675A1
公开(公告)日：2011-03-03
申请号：US12620529
申请日：2009-11-17
申请人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Shou-Biao Xu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F13/00 , H05K7/20
CPC分类号： H01L23/3672 , H01L21/4882 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a plurality of first fins and a plurality of second fins. Each first fin and each second fin includes an inner end and an outer end opposite to the inner end, respectively. Each of the second fins is sandwiched between two respective adjacent first fins. The inner end of each of the first fins is engagingly received in the inner end of the previous adjacent first fin, sandwiching the inner end of a corresponding second fin therebetween. The outer end of each of the first fins is engagingly received in the outer end of the previous adjacent second fin, and the outer end of each of the second fins is engagingly received in the outer end of the previous adjacent first fin.
摘要翻译：散热器包括多个第一散热片和多个第二散热片。每个第一翅片和每个第二翅片分别包括内端和与内端相对的外端。每个第二散热片夹在两个相邻的相邻的第一散热片之间。每个第一散热片的内端接合地接纳在先前相邻的第一散热片的内端，夹在其间的相应的第二散热片的内端。每个第一散热片的外端接合地容纳在先前相邻的第二散热片的外端中，并且每个第二散热片的外端接合地容纳在先前相邻的第一散热片的外端。

8. 发明授权

US07983043B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07983043B2
公开(公告)日：2011-07-19
申请号：US12508582
申请日：2009-07-24
申请人： Shou-Biao Xu , Guo Chen , Shi-Wen Zhou
发明人： Shou-Biao Xu , Guo Chen , Shi-Wen Zhou
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： F28D15/0233 , F28D15/0275 , F28F2215/10 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the post, respectively, and a plurality of fins extending between the branches. Each heat pipe includes an evaporating section attached to a bottom of the post, a condensing section parallel to the evaporation section and attached to a top of the post, and an adiabatic section interconnecting the evaporating section and the condensing section. A block is secured to bottoms of the condensing sections of the heat pipes.
摘要翻译：散热装置包括散热器和固定在散热器上的一对热管。散热器包括矩形柱，分别从柱的四个角向外延伸的四个分支和在分支之间延伸的多个翅片。每个热管包括附接到柱的底部的蒸发部分，与蒸发部分平行并连接到柱的顶部的冷凝部分和将蒸发部分和冷凝部分互连的绝热部分。块被固定到热管的冷凝部分的底部。

9. 发明授权

US08296947B2 Heat sink and method of manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US08296947B2
公开(公告)日：2012-10-30
申请号：US12506213
申请日：2009-07-20
申请人： Peng Liu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Peng Liu , Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： B21D53/02 , H05K7/20
CPC分类号： B21D53/085 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
摘要翻译：散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。还公开了一种制造散热器的方法。

10. 发明授权

US07990719B2 Electronic system with heat dissipation device 有权
标题翻译：具有散热装置的电子系统
公开(公告)号：US07990719B2
公开(公告)日：2011-08-02
申请号：US12610388
申请日：2009-11-02
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20154
摘要： A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.
摘要翻译：散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。电子元件具有不同的高度。所述散热装置包括连接板，安装在所述连接板上的至少两个弹性部件和散热器，所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。基板和连接板之间的距离可通过调节连接部件来调节，以使基板与一个电子部件紧密接触。

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