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1. 发明授权

US09393645B2 Junction material, manufacturing method thereof, and manufacturing method of junction structure 有权
标题翻译：接合材料及其制造方法以及接合结构的制造方法
公开(公告)号：US09393645B2
公开(公告)日：2016-07-19
申请号：US13700294
申请日：2011-07-28
申请人： Takuto Yamaguchi , Masahide Okamoto , Osamu Ikeda , Hiromitsu Kuroda , Kazuma Kuroki , Shohei Hata , Yuichi Oda
发明人： Takuto Yamaguchi , Masahide Okamoto , Osamu Ikeda , Hiromitsu Kuroda , Kazuma Kuroki , Shohei Hata , Yuichi Oda
IPC分类号： B21B3/00 , B23K35/00 , B23K35/02 , B23K1/00 , B23K35/28 , B23K35/30 , B23K35/38 , B32B15/01 , C22C5/02 , C22C9/00 , C22F1/00 , C22F1/04 , C22F1/08 , C22F1/16 , H01L21/50 , H01L23/06 , H01L23/10 , H01L23/373 , H01L23/495 , H01L23/00 , H01L23/31
CPC分类号： B23K35/0238 , B21B3/00 , B23K1/0016 , B23K35/282 , B23K35/286 , B23K35/302 , B23K35/38 , B23K35/383 , B23K2101/40 , B32B15/017 , B32B15/018 , C22C5/02 , C22C9/00 , C22F1/00 , C22F1/04 , C22F1/08 , C22F1/165 , H01L21/50 , H01L23/06 , H01L23/10 , H01L23/3107 , H01L23/3735 , H01L23/49513 , H01L23/49582 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/2784 , H01L2224/29101 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/83101 , H01L2224/838 , H01L2224/8382 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/013 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/16152 , H01L2924/181 , Y10T428/12708 , Y10T428/12736 , Y10T428/12792 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/83205
摘要： The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.
摘要翻译：所公开的连接材料，其制造方法和接合结构的制造方法利用无铅材料，并确保半导体元件与框架或基板之间或者金属板与另一金属板之间的接合部的高可靠性。对于半导体元件和框架或基板之间的接合，通过使用作为连接材料的层叠材料，其包含Zn基金属层（101），其两侧上的Al基金属层（102a，102b）和X- 即使在富含氧的环境下，Al基金属层（102a，102b）外侧的金属基金属层（103a，103b）（X = Cu，Au，Ag或Sn），表面的X系金属层保护Zn和Al免于氧化，直到所述接合材料熔化，保持所述接合材料作为焊料的润湿性和粘合性，并确保接合部的高可靠性。

2. 发明授权

US08669652B2 Lead component and method for manufacturing the same, and semiconductor package 失效
标题翻译：铅成分及其制造方法，半导体封装
公开(公告)号：US08669652B2
公开(公告)日：2014-03-11
申请号：US13421244
申请日：2012-03-15
申请人： Shohei Hata , Yuichi Oda , Kazuma Kuroki , Hiromitsu Kuroda
发明人： Shohei Hata , Yuichi Oda , Kazuma Kuroki , Hiromitsu Kuroda
IPC分类号： H01L23/48 , H05K5/02 , H01L21/00
CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L23/49582 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/33 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/1134 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/16245 , H01L2224/291 , H01L2224/29111 , H01L2224/32245 , H01L2224/32503 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73221 , H01L2224/73253 , H01L2224/73265 , H01L2224/81455 , H01L2224/83385 , H01L2224/83455 , H01L2224/84801 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/157 , H01L2924/15787 , H01L2924/181 , H01L2924/3651 , H01L2224/84 , H01L2924/00012 , H01L2924/01031 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.
摘要翻译：提供可以容易地连接到半导体芯片并且具有令人满意的可连接性的便宜的引线部件。提供了一种引线部件，其包括具有用于连接到半导体芯片的连接部分的基底材料，包括：焊料部分，其具有由在该基材上卷绕和包覆的Zn粘合材料制成的Zn层，以及Al 在包含所述基材上的所述连接部的规定区域中，在所述Zn层上卷绕并包层接合的由Al结合材料制成的层; 并且所述焊料部还包括由覆盖所述Al层的表面的Au，Ag，Cu，Ni，Pd和Pt中的一种或两种以上构成的金属薄膜。

3. 发明申请

US20130256390A1 JUNCTION MATERIAL, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF JUNCTION STRUCTURE 有权
标题翻译：结构材料及其制造方法及结构结构的制造方法
公开(公告)号：US20130256390A1
公开(公告)日：2013-10-03
申请号：US13700294
申请日：2011-07-28
申请人： Takuto Yamaguchi , Masahide Okamoto , Osamu Ikeda , Hiromitsu Kuroda , Kazuma Kuroki , Shohei Hata , Yuichi Oda
发明人： Takuto Yamaguchi , Masahide Okamoto , Osamu Ikeda , Hiromitsu Kuroda , Kazuma Kuroki , Shohei Hata , Yuichi Oda
IPC分类号： B23K35/02 , B21B3/00
CPC分类号： B23K35/0238 , B21B3/00 , B23K1/0016 , B23K35/282 , B23K35/286 , B23K35/302 , B23K35/38 , B23K35/383 , B23K2101/40 , B32B15/017 , B32B15/018 , C22C5/02 , C22C9/00 , C22F1/00 , C22F1/04 , C22F1/08 , C22F1/165 , H01L21/50 , H01L23/06 , H01L23/10 , H01L23/3107 , H01L23/3735 , H01L23/49513 , H01L23/49582 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/2784 , H01L2224/29101 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/83101 , H01L2224/838 , H01L2224/8382 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/013 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/16152 , H01L2924/181 , Y10T428/12708 , Y10T428/12736 , Y10T428/12792 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/83205
摘要： The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.
摘要翻译：所公开的连接材料，其制造方法和接合结构的制造方法利用无铅材料，并确保半导体元件与框架或基板之间，或金属板与另一金属板之间的接合部的高可靠性。对于半导体元件和框架或基板之间的接合，通过使用作为连接材料的层叠材料，其包含Zn基金属层（101），其两侧上的Al基金属层（102a，102b）和X- 即使在富含氧的环境下，Al基金属层（102a，102b）外侧的金属基金属层（103a，103b）（X = Cu，Au，Ag或Sn），表面的X系金属层保护Zn和Al免于氧化，直到所述接合材料熔化，保持所述接合材料作为焊料的润湿性和粘合性，并确保接合部的高可靠性。

4. 发明授权

US08449204B2 Optical module 失效
标题翻译：光模块
公开(公告)号：US08449204B2
公开(公告)日：2013-05-28
申请号：US13126898
申请日：2009-06-11
申请人： Toshiaki Takai , Yukio Sakigawa , Shohei Hata
发明人： Toshiaki Takai , Yukio Sakigawa , Shohei Hata
IPC分类号： G02B6/36 , G02B6/42
CPC分类号： G02B6/4246 , G02B6/29367 , H01S5/005 , H01S5/02212 , H01S5/02228 , H01S5/02284 , H01S5/02296 , H01S2301/176
摘要： An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elements 11 and light-receiving elements 12 are mounted on an optical-element mounting substrate 1, a light-absorbing resin 6 to absorb light with a light-emission wavelength of the light-emitting elements 11 is arranged to cover side surfaces of the light-emitting elements 11 and a non-adhesive layer 7 including a material not adhesive to the light-absorbing resin 6 is arranged between the light-absorbing resin 6 and the optical-element mounting substrate 1.
摘要翻译：提供一种简单结构的光模块，其可以抑制由于漏光引起的光串扰，而不会导致发光元件的特性劣化和可靠性降低，从而获得适当的光接收灵敏度。在其中多个发光元件11和光接收元件12安装在光学元件安装基板1上的光学模块中，用于吸收发光波长的光的光吸收树脂6，发光元件11布置成覆盖发光元件11的侧表面，并且在光吸收树脂6和光学元件安装之间布置有包括不与光吸收树脂6粘合的材料的非粘合层7 基板1。

5. 发明授权

US08441612B2 LED light source, its manufacturing method, and LED-based photolithography apparatus and method 失效
标题翻译： LED光源，其制造方法和基于LED的光刻设备和方法
公开(公告)号：US08441612B2
公开(公告)日：2013-05-14
申请号：US12815222
申请日：2010-06-14
申请人： Susumu Ishida , Shohei Hata
发明人： Susumu Ishida , Shohei Hata
IPC分类号： G03B27/54 , H01L21/00 , H01L33/00
CPC分类号： H01L33/64 , G03F7/7005 , G03F7/70858 , H01L25/13 , H01L33/641 , H01L2224/48091 , H05B3/0038 , H05K1/0204 , H05K1/0206 , H05K3/0061 , H05K2201/0209 , H05K2201/09063 , H05K2201/10106 , H05K2201/10977 , H01L2924/00014
摘要： This invention provides a structurally-simple LED light source that is capable of preventing temperature variations among its multiple LED elements arranged densely on its LED-mounting substrate and also improving the heat release capabilities of the substrate by comprising an LED light source with: a plurality of LED elements each of which is formed by connecting an LED chip to electrodes formed on a ceramic substrate; an LED-mounting substrate on which to mount the plurality of LED elements, the LED-mounting substrate having through holes therein; and a heat sink plate for releasing heat from the LED-mounting substrate, wherein a thermally conductive resin is present between the LED-mounting substrate and the heat sink plate and wherein part of the thermally conductive resin protrudes from the through holes of the LED-mounting substrate and covers the top surface of the LED-mounting substrate on which the plurality of LED elements are mounted, so that the part of the thermally conductive resin is in contact with the plurality of LED elements.
摘要翻译：本发明提供一种结构简单的LED光源，其能够防止在其LED安装基板上密集布置的多个LED元件之间的温度变化，并且还通过包括具有多个LED的LED光源来提高基板的散热能力的LED元件，每个LED元件通过将LED芯片连接到形成在陶瓷基板上的电极而形成; 在其上安装多个LED元件的LED安装基板，其中具有通孔的LED安装基板; 以及用于从LED安装基板释放热量的散热板，其中在LED安装基板和散热板之间存在导热树脂，并且其中部分导热树脂从LED-安装基板的通孔突出，安装基板并覆盖其上安装有多个LED元件的LED安装基板的顶表面，使得导热树脂的一部分与多个LED元件接触。

6. 发明授权

US08269301B2 Submount for optical device and its manufacturing method 有权
标题翻译：光学装置底座及其制造方法
公开(公告)号：US08269301B2
公开(公告)日：2012-09-18
申请号：US12295740
申请日：2007-04-04
申请人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima , Hideaki Takemori , Masatoshi Seki
发明人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima , Hideaki Takemori , Masatoshi Seki
IPC分类号： H01L31/0203 , H01L27/15
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/46 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/09701 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided.A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.
摘要翻译：提供了用于安装具有优异的散热性并且可以分批地以晶片状态形成的光学器件的安装座。包括光学器件安装部件和布线部件的金属化电极形成在以绝缘材料为主要成分的第一基板的表面上，在作为第二基板的玻璃基板中形成通孔，光学元件安装部第一基板被排列成位于第二基板的通孔内部，并且第一基板和第二基板通过诸如阳极接合的方法接合在一起。

7. 发明申请

US20060237231A1 Substrate for mounting electronic part and electronic part 有权
公开(公告)号：US20060237231A1
公开(公告)日：2006-10-26
申请号：US11378450
申请日：2006-03-20
申请人： Shohei Hata , Naoki Matsushima , Takeru Fujinaga
发明人： Shohei Hata , Naoki Matsushima , Takeru Fujinaga
IPC分类号： H01L23/28
CPC分类号： H01L24/10 , H01L23/49582 , H01L23/49811 , H01L23/4985 , H01L23/49866 , H01L24/13 , H01L24/48 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H05K3/3426 , H05K3/3463 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2224/0555 , H01L2224/0556
摘要： The present invention is characterized by a structure having a substrate 1, and metallization layers 2 formed on the substrate 1, on which a Sn solder film 3 and an Ag film 4 are formed. The Ag film 4 is a metal free from oxidization at room temperature in the atmosphere. In a wet process, since only an exposed side of the Sn solder film 3 is oxidized by the cell reaction of Ag and Sn, an upper surface of the Ag film 4 on the solder film, which would otherwise affect the connection, is not oxidized. Since the Ag film 4 melts into the Sn solder simultaneously with melting of the Sn solder film 3, the Ag film 4 does not hinder the connection.

8. 发明授权

US08698264B2 Photoelectric conversion module 失效
标题翻译：光电转换模块
公开(公告)号：US08698264B2
公开(公告)日：2014-04-15
申请号：US13355668
申请日：2012-01-23
申请人： Kouki Hirano , Hiroki Yasuda , Yoshinori Sunaga , Shohei Hata
发明人： Kouki Hirano , Hiroki Yasuda , Yoshinori Sunaga , Shohei Hata
IPC分类号： H01L31/0203
CPC分类号： H01L31/0203 , H01L2224/16225
摘要： A photoelectric conversion module includes: a substrate having a light transmitting property and having a mounting surface; a photoelectric conversion element mounted on the mounting surface of the substrate; a cover member fixed to the substrate via a solder layer constituted by solder and forming, cooperatively with the substrate, an airtight chamber housing the photoelectric conversion element; and a solder adsorbing film provided near an area fixed to the substrate by the solder layer, in a surface, of the cover member, facing the mounting surface, the solder having an adhesive property to the solder adsorbing film.
摘要翻译：光电转换模块包括：具有透光性且具有安装面的基板; 安装在基板的安装面上的光电转换元件; 盖构件，其经由焊料构成的焊料层固定到所述衬底，并与所述衬底协同地形成容纳所述光电转换元件的气密室; 以及焊料吸附膜，其通过所述焊料层在所述盖部件的与所述安装面相对的表面中靠近所述基板的区域附近设置，所述焊料与所述焊料吸附膜具有粘合性。

9. 发明申请

US20120193742A1 PHOTOELECTRIC CONVERSION MODULE AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION MODULE 失效
标题翻译：光电转换模块及制造光电转换模块的方法
公开(公告)号：US20120193742A1
公开(公告)日：2012-08-02
申请号：US13355668
申请日：2012-01-23
申请人： Kouki HIRANO , Hiroki Yasuda , Yoshinori Sunaga , Shohei Hata
发明人： Kouki HIRANO , Hiroki Yasuda , Yoshinori Sunaga , Shohei Hata
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L2224/16225
摘要： A photoelectric conversion module includes: a substrate having a light transmitting property and having a mounting surface; a photoelectric conversion element mounted on the mounting surface of the substrate; a cover member fixed to the substrate via a solder layer constituted by solder and forming, cooperatively with the substrate, an airtight chamber housing the photoelectric conversion element; and a solder adsorbing film provided near an area fixed to the substrate by the solder layer, in a surface, of the cover member, facing the mounting surface, the solder having an adhesive property to the solder adsorbing film.
摘要翻译：光电转换模块包括：具有透光性且具有安装面的基板; 安装在基板的安装面上的光电转换元件; 盖构件，其经由焊料构成的焊料层固定到所述衬底，并与所述衬底协同地形成容纳所述光电转换元件的气密室; 以及焊料吸附膜，其通过所述焊料层在所述盖部件的与所述安装面相对的表面中靠近所述基板的区域附近设置，所述焊料与所述焊料吸附膜具有粘合性。

10. 发明授权

US07842889B2 Substrate for mounting electronic part and electronic part 有权
标题翻译：用于安装电子部件和电子部件的基板
公开(公告)号：US07842889B2
公开(公告)日：2010-11-30
申请号：US12352631
申请日：2009-01-13
申请人： Shohei Hata , Naoki Matsushima , Takeru Fujinaga
发明人： Shohei Hata , Naoki Matsushima , Takeru Fujinaga
IPC分类号： H01L23/49 , H05K5/06
CPC分类号： H01L24/10 , H01L23/49582 , H01L23/49811 , H01L23/4985 , H01L23/49866 , H01L24/13 , H01L24/48 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H05K3/3426 , H05K3/3463 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2224/0555 , H01L2224/0556
摘要： The present invention is characterized by a structure having a substrate 1, and metallization layers 2 formed on the substrate 1, on which a Sn solder film 3 and an Ag film 4 are formed. The Ag film 4 is a metal free from oxidization at room temperature in the atmosphere. In a wet process, since only an exposed side of the Sn solder film 3 is oxidized by the cell reaction of Ag and Sn, an upper surface of the Ag film 4 on the solder film, which would otherwise affect the connection, is not oxidized. Since the Ag film 4 melts into the Sn solder simultaneously with melting of the Sn solder film 3, the Ag film 4 does not hinder the connection.
摘要翻译：本发明的特征在于具有基板1和形成在基板1上的金属化层2的结构，在其上形成有Sn焊料膜3和Ag膜4。 Ag膜4是在室温下在大气中不氧化的金属。在湿法中，由于仅通过Ag和Sn的电池反应使Sn焊料膜3的露出侧被氧化，否则会影响连接的焊料膜上的Ag膜4的上表面不被氧化。由于Ag膜4在Sn焊料膜3熔化的同时熔融而成为Sn焊料，所以Ag膜4不妨碍连接。

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