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1. 发明申请

US20100022771A1 REACTION APPARATUS, AND REACTION METHOD 审中-公开
标题翻译：反应装置和反应方法
公开(公告)号：US20100022771A1
公开(公告)日：2010-01-28
申请号：US12441674
申请日：2007-09-14
申请人： Noriyuki Yoneda , Yuichi Oda , Yasuo Nakanishi
发明人： Noriyuki Yoneda , Yuichi Oda , Yasuo Nakanishi
IPC分类号： C07D487/02 , B01J19/00 , C07C55/06
CPC分类号： C07D487/04 , B01J19/243 , B01J2219/00063 , C07C67/343 , C07C69/716
摘要： The present invention is directed at obtaining a high yield of a target substance and simultaneously securing high productivity.A reaction apparatus 10 has: a main flow channel 12 having an inner diameter of 3 mm, in which a raw material M1 flows; an introduction flow channel 14 in which a raw material M2 that causes a chemical reaction with the raw material M1 flows; and five branch introduction flow channels 16a to 16e which are branched from the introduction flow channel 14 and introduce the raw material M2 to the main flow channel 12, at predetermined introduction points 12o to 12s in the main flow channel 12. Here, in the main flow channel 12, the flow channel lengths of the flow channels 12b to 12d between adjacent introduction points 12p to 12s are not longer than those of the flow channels 12a to 12c between the next previous adjacent introduction points 12o to 12r in a flow direction of the raw material M1. At least one length of the flow channels 12b to 12d between the adjacent introduction points 12p to 12s is shorter than lengths of the flow channels 12a to 12c between previous adjacent introduction points 12o to 12r in the flow direction of the raw material M1.
摘要翻译：本发明涉及获得高产率的目标物质并同时确保高生产率。反应装置10具有：原料M1流过的内径为3mm的主流路12; 导入与原料M1发生化学反应的原料M2的导入流路14; 以及从导入流路14分支并将原料M2引入主流路12的五个分支导入流路16a〜16e，在主流路12中的预定的导入点12o〜12s。这里，主在流路12中，相邻导入点12p〜12s之间的流路12b〜12d的流路长度不比前一相邻导入点12o〜12r之间的流路12a〜12c的流路长度在原料M1。在相邻的导入点12p〜12s之间的流路12b〜12d的至少一个长度比原料M1的流动方向的前一相邻导入点12o〜12r之间的流路12a〜12c的长度短。

2. 发明授权

US09393645B2 Junction material, manufacturing method thereof, and manufacturing method of junction structure 有权
标题翻译：接合材料及其制造方法以及接合结构的制造方法
公开(公告)号：US09393645B2
公开(公告)日：2016-07-19
申请号：US13700294
申请日：2011-07-28
申请人： Takuto Yamaguchi , Masahide Okamoto , Osamu Ikeda , Hiromitsu Kuroda , Kazuma Kuroki , Shohei Hata , Yuichi Oda
发明人： Takuto Yamaguchi , Masahide Okamoto , Osamu Ikeda , Hiromitsu Kuroda , Kazuma Kuroki , Shohei Hata , Yuichi Oda
IPC分类号： B21B3/00 , B23K35/00 , B23K35/02 , B23K1/00 , B23K35/28 , B23K35/30 , B23K35/38 , B32B15/01 , C22C5/02 , C22C9/00 , C22F1/00 , C22F1/04 , C22F1/08 , C22F1/16 , H01L21/50 , H01L23/06 , H01L23/10 , H01L23/373 , H01L23/495 , H01L23/00 , H01L23/31
CPC分类号： B23K35/0238 , B21B3/00 , B23K1/0016 , B23K35/282 , B23K35/286 , B23K35/302 , B23K35/38 , B23K35/383 , B23K2101/40 , B32B15/017 , B32B15/018 , C22C5/02 , C22C9/00 , C22F1/00 , C22F1/04 , C22F1/08 , C22F1/165 , H01L21/50 , H01L23/06 , H01L23/10 , H01L23/3107 , H01L23/3735 , H01L23/49513 , H01L23/49582 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/2784 , H01L2224/29101 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/83101 , H01L2224/838 , H01L2224/8382 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/013 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/16152 , H01L2924/181 , Y10T428/12708 , Y10T428/12736 , Y10T428/12792 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/83205
摘要： The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.
摘要翻译：所公开的连接材料，其制造方法和接合结构的制造方法利用无铅材料，并确保半导体元件与框架或基板之间或者金属板与另一金属板之间的接合部的高可靠性。对于半导体元件和框架或基板之间的接合，通过使用作为连接材料的层叠材料，其包含Zn基金属层（101），其两侧上的Al基金属层（102a，102b）和X- 即使在富含氧的环境下，Al基金属层（102a，102b）外侧的金属基金属层（103a，103b）（X = Cu，Au，Ag或Sn），表面的X系金属层保护Zn和Al免于氧化，直到所述接合材料熔化，保持所述接合材料作为焊料的润湿性和粘合性，并确保接合部的高可靠性。

3. 发明授权

US08669652B2 Lead component and method for manufacturing the same, and semiconductor package 失效
标题翻译：铅成分及其制造方法，半导体封装
公开(公告)号：US08669652B2
公开(公告)日：2014-03-11
申请号：US13421244
申请日：2012-03-15
申请人： Shohei Hata , Yuichi Oda , Kazuma Kuroki , Hiromitsu Kuroda
发明人： Shohei Hata , Yuichi Oda , Kazuma Kuroki , Hiromitsu Kuroda
IPC分类号： H01L23/48 , H05K5/02 , H01L21/00
CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L23/49582 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/33 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/1134 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/16245 , H01L2224/291 , H01L2224/29111 , H01L2224/32245 , H01L2224/32503 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73221 , H01L2224/73253 , H01L2224/73265 , H01L2224/81455 , H01L2224/83385 , H01L2224/83455 , H01L2224/84801 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/157 , H01L2924/15787 , H01L2924/181 , H01L2924/3651 , H01L2224/84 , H01L2924/00012 , H01L2924/01031 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.
摘要翻译：提供可以容易地连接到半导体芯片并且具有令人满意的可连接性的便宜的引线部件。提供了一种引线部件，其包括具有用于连接到半导体芯片的连接部分的基底材料，包括：焊料部分，其具有由在该基材上卷绕和包覆的Zn粘合材料制成的Zn层，以及Al 在包含所述基材上的所述连接部的规定区域中，在所述Zn层上卷绕并包层接合的由Al结合材料制成的层; 并且所述焊料部还包括由覆盖所述Al层的表面的Au，Ag，Cu，Ni，Pd和Pt中的一种或两种以上构成的金属薄膜。

4. 发明申请

US20130256390A1 JUNCTION MATERIAL, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF JUNCTION STRUCTURE 有权
标题翻译：结构材料及其制造方法及结构结构的制造方法
公开(公告)号：US20130256390A1
公开(公告)日：2013-10-03
申请号：US13700294
申请日：2011-07-28
申请人： Takuto Yamaguchi , Masahide Okamoto , Osamu Ikeda , Hiromitsu Kuroda , Kazuma Kuroki , Shohei Hata , Yuichi Oda
发明人： Takuto Yamaguchi , Masahide Okamoto , Osamu Ikeda , Hiromitsu Kuroda , Kazuma Kuroki , Shohei Hata , Yuichi Oda
IPC分类号： B23K35/02 , B21B3/00
CPC分类号： B23K35/0238 , B21B3/00 , B23K1/0016 , B23K35/282 , B23K35/286 , B23K35/302 , B23K35/38 , B23K35/383 , B23K2101/40 , B32B15/017 , B32B15/018 , C22C5/02 , C22C9/00 , C22F1/00 , C22F1/04 , C22F1/08 , C22F1/165 , H01L21/50 , H01L23/06 , H01L23/10 , H01L23/3107 , H01L23/3735 , H01L23/49513 , H01L23/49582 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/2784 , H01L2224/29101 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/83101 , H01L2224/838 , H01L2224/8382 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/013 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/16152 , H01L2924/181 , Y10T428/12708 , Y10T428/12736 , Y10T428/12792 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/83205
摘要： The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.
摘要翻译：所公开的连接材料，其制造方法和接合结构的制造方法利用无铅材料，并确保半导体元件与框架或基板之间，或金属板与另一金属板之间的接合部的高可靠性。对于半导体元件和框架或基板之间的接合，通过使用作为连接材料的层叠材料，其包含Zn基金属层（101），其两侧上的Al基金属层（102a，102b）和X- 即使在富含氧的环境下，Al基金属层（102a，102b）外侧的金属基金属层（103a，103b）（X = Cu，Au，Ag或Sn），表面的X系金属层保护Zn和Al免于氧化，直到所述接合材料熔化，保持所述接合材料作为焊料的润湿性和粘合性，并确保接合部的高可靠性。

5. 发明申请

US20120248592A1 LEAD COMPONENT AND METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE 失效
标题翻译：导线组件及其制造方法和半导体封装
公开(公告)号：US20120248592A1
公开(公告)日：2012-10-04
申请号：US13421244
申请日：2012-03-15
申请人： Shohei HATA , Yuichi Oda , Kazuma Kuroki , Hiromitsu Kuroda
发明人： Shohei HATA , Yuichi Oda , Kazuma Kuroki , Hiromitsu Kuroda
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L23/49582 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/33 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/1134 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/16245 , H01L2224/291 , H01L2224/29111 , H01L2224/32245 , H01L2224/32503 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73221 , H01L2224/73253 , H01L2224/73265 , H01L2224/81455 , H01L2224/83385 , H01L2224/83455 , H01L2224/84801 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/157 , H01L2924/15787 , H01L2924/181 , H01L2924/3651 , H01L2224/84 , H01L2924/00012 , H01L2924/01031 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.
摘要翻译：提供可以容易地连接到半导体芯片并且具有令人满意的可连接性的便宜的引线部件。提供了一种引线部件，其包括具有用于连接到半导体芯片的连接部分的基底材料，包括：焊料部分，其具有由在该基材上卷绕和包覆的Zn粘合材料制成的Zn层，以及Al 在包含所述基材上的所述连接部的规定区域中，在所述Zn层上卷绕并包层接合的由Al结合材料制成的层; 并且所述焊料部还包括由覆盖所述Al层的表面的Au，Ag，Cu，Ni，Pd和Pt中的一种或两种以上构成的金属薄膜。

6. 发明授权

US08370810B2 Debugging device and debugging method 有权
标题翻译：调试器和调试方法
公开(公告)号：US08370810B2
公开(公告)日：2013-02-05
申请号：US12273934
申请日：2008-11-19
申请人： Yuichi Oda
发明人： Yuichi Oda
IPC分类号： G06F9/44 , G06F11/00
CPC分类号： G06F11/3644 , G06F11/3628
摘要： A debugging device configured to debug a program includes an analysis section configured to analyze information of a code that does not need to be debugged in which a predetermined processing instruction is described, the code being generated by optimization of a compiler for a source code of the program, and an output section configured to output processing content information, a start address, and an end address of the code that does not need to be debugged which are obtained by the analysis.
摘要翻译：配置为调试程序的调试装置包括：分析部件，被配置为分析不需要调试的代码的信息，其中描述了预定处理指令，所述代码是通过优化编译器的源代码来生成的程序和输出部分，被配置为输出通过分析获得的不需要调试的代码的处理内容信息，起始地址和结束地址。

7. 发明申请

US20090144705A1 DEBUGGING DEVICE AND DEBUGGING METHOD 有权
标题翻译：调试设备和调试方法
公开(公告)号：US20090144705A1
公开(公告)日：2009-06-04
申请号：US12273934
申请日：2008-11-19
申请人： Yuichi ODA
发明人： Yuichi ODA
IPC分类号： G06F9/44
CPC分类号： G06F11/3644 , G06F11/3628
摘要： A debugging device configured to debug a program includes an analysis section configured to analyze information of a code that does not need to be debugged in which a predetermined processing instruction is described, the code being generated by optimization of a compiler for a source code of the program, and an output section configured to output processing content information, a start address, and an end address of the code that does not need to be debugged which are obtained by the analysis.
摘要翻译：配置为调试程序的调试装置包括：分析部件，被配置为分析不需要调试的代码的信息，其中描述了预定处理指令，所述代码是通过优化编译器的源代码来生成的程序和输出部分，被配置为输出通过分析获得的不需要调试的代码的处理内容信息，起始地址和结束地址。

8. 发明申请

US20080270760A1 DEBUG SUPPORT METHOD AND APPARATUS 审中-公开
标题翻译：调试支持方法和设备
公开(公告)号：US20080270760A1
公开(公告)日：2008-10-30
申请号：US12051581
申请日：2008-03-19
申请人： Yuichi ODA
发明人： Yuichi ODA
IPC分类号： G06F9/30
CPC分类号： G06F11/3624
摘要： According to the present invention, there is provided a debug support apparatus having, a decoder configured to receive an instruction output from a compiler which receives a source code, decode the instruction, and output a decoding result; and a display unit configured to receive debug information output from the compiler and the decoding result output from the decoder and display at least a correspondence between each decoded instruction and a position in the source code.
摘要翻译：根据本发明，提供了一种调试支持装置，具有：解码器，被配置为从接收源代码的编译器接收指令的输出，解码指令并输出解码结果; 以及显示单元，被配置为接收从编译器输出的调试信息和从解码器输出的解码结果，并且至少显示每个解码的指令与源代码中的位置之间的对应关系。

9. 发明授权

US09042391B2 Information processing device 有权
标题翻译：信息处理装置
公开(公告)号：US09042391B2
公开(公告)日：2015-05-26
申请号：US13611295
申请日：2012-09-12
申请人： Yuichi Oda
发明人： Yuichi Oda
IPC分类号： G06F12/14 , H04L29/08
CPC分类号： G06F12/14 , G06F13/4022 , G06F2213/0038 , H04L29/08549
摘要： According to one embodiment, an information processing device is provided with a memory, a plurality of processors, a router group, and an address protection unit. The plurality of the processors generate memory access packets each of which defines memory access requests for the memory, the memory access packet including an access destination address and an access type. The router group is provide with first routers which are connected to the memory and second routers which form transfer paths between the first router and the plurality of the processors, and transmits the memory access packets generated by the plurality of the processors to the memory. The address protection unit examines the memory access packets which pass through the first routers to detect a violated memory access.
摘要翻译：根据一个实施例，信息处理设备设置有存储器，多个处理器，路由器组和地址保护单元。多个处理器产生存储器访问分组，每个存储器访问分组定义存储器的存储器访问请求，存储器访问分组包括访问目的地地址和访问类型。路由器组提供连接到存储器的第一路由器和形成第一路由器和多个处理器之间的传输路径的第二路由器，并且将由多个处理器生成的存储器访问分组传送到存储器。地址保护单元检查通过第一路由器的存储器访问分组以检测违反的存储器访问。

10. 发明申请

US20120147045A1 IMAGE DISPLAY APPARATUS, IMAGE DISPLAY METHOD, AND IMAGE DISPLAY PROGRAM 审中-公开
标题翻译：图像显示装置，图像显示方法和图像显示程序
公开(公告)号：US20120147045A1
公开(公告)日：2012-06-14
申请号：US13324044
申请日：2011-12-13
申请人： Hiroshi OIKE , Hiroaki Sakaguchi , Yuichi Oda , Tomoo Nakano , Yasushi Usami
发明人： Hiroshi OIKE , Hiroaki Sakaguchi , Yuichi Oda , Tomoo Nakano , Yasushi Usami
IPC分类号： G09G5/00
CPC分类号： G06F3/04845 , G03B17/20 , G06F3/0483 , G06F3/04883
摘要： An image display apparatus including a first storage means for storing at least one item of image data, correction condition data for correcting the image data, and corrected image data obtained after the image data is corrected on the basis of the correction condition data; an image processing means for producing the corrected image data; a display means comprising a screen for superimposing an original image based on the image data and a corrected image based on the corrected image data onto each other and displaying either the original image or the corrected image; an input means for selecting an image to be displayed on the display screen, and a display control means for switching between the images in response to an input from the input means, so that either the original image or the corrected image is displayed on the display screen.
摘要翻译：一种图像显示装置，包括：用于存储图像数据的至少一个项目的第一存储装置，用于校正图像数据的校正条件数据;以及基于校正条件数据校正图像数据之后获得的校正图像数据; 用于产生校正后的图像数据的图像处理装置; 显示装置，其包括用于基于图像数据叠加原始图像的屏幕和基于校正图像数据的校正图像彼此并显示原始图像或校正图像; 用于选择要在显示屏幕上显示的图像的输入装置，以及用于响应于来自输入装置的输入而在图像之间切换的显示控制装置，使得原始图像或校正图像被显示在显示器上屏幕。

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