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    • 8. 发明专利
    • Semiconductor light emitting element, and method of manufacturing the same
    • 半导体发光元件及其制造方法
    • JP2008263228A
    • 2008-10-30
    • JP2008177951
    • 2008-07-08
    • Sharp Corpシャープ株式会社
    • TANETANI MOTOTAKA
    • H01S5/323H01L33/22H01L33/32
    • PROBLEM TO BE SOLVED: To prevent degradation of light emitting efficiency and deterioration of reliability when a semiconductor light emitting element is further formed on a continuous film semiconductor layer formed so as to differ in the substrate, lattice constant, or thermal expansion coefficient, using a partial growth suppressing structure. SOLUTION: This semiconductor light emitting element has a sapphire substrate, a growth suppressing structure formed on the sapphire substrate, a GaN continuous film semiconductor layer formed on the sapphire substrate and the growth suppressing structure, and an active layer which generates light formed on the GaN continuous film semiconductor layer, wherein the growth suppressing structure consists of either a groove structure or a concavo-convex structure formed in the sapphire substrate, and a surface of the GaN continuous film semiconductor layer is flat. COPYRIGHT: (C)2009,JPO&INPIT
    • 解决的问题为了防止在形成为不同基板,晶格常数或热膨胀系数的连续膜半导体层上进一步形成半导体发光元件时发光效率的降低和可靠性的劣化 ,使用部分生长抑制结构。 解决方案:该半导体发光元件具有蓝宝石衬底,形成在蓝宝石衬底上的生长抑制结构,形成在蓝宝石衬底上的GaN连续膜半导体层和生长抑制结构,以及产生形成光的有源层 在GaN连续膜半导体层上,其中生长抑制结构由在蓝宝石衬底中形成的凹槽结构或凹凸结构组成,并且GaN连续膜半导体层的表面是平坦的。 版权所有(C)2009,JPO&INPIT
    • 9. 发明专利
    • Nitride semiconductor laser element, and method of manufacturing same
    • 氮化物半导体激光元件及其制造方法
    • JP2007165344A
    • 2007-06-28
    • JP2005355574
    • 2005-12-09
    • Sharp Corpシャープ株式会社
    • OMI SUSUMUTAKATANI KUNIHIROYAMASHITA FUMIOTANETANI MOTOTAKA
    • H01S5/042H01S5/22H01S5/343
    • H01S5/32341H01S5/0202H01S5/0425H01S2301/176
    • PROBLEM TO BE SOLVED: To provide a nitride semiconductor laser element where a p-side electrode is hard to be peeled off from a nitride semiconductor lamination at the time of cleaving a wafer, and non-uniform injection of current and a defect of a current-optical output characteristic are hard to occur, and to provide a method of manufacturing the same.
      SOLUTION: An insulating film 15 and the p-side electrode 16 are formed on the nitride semiconductor lamination 20 formed on a substrate 11 in order. An end electrode protection layer 18 is formed on an upper part at a periphery of positions becoming cleavage faces 13 and 14 of the p-side electrode 16, and the wafer is obtained. Thus, the nitride semiconductor laser element 10 is perfected by cleaving the wafer. At the time of cleavage, the p-side electrode 16 is protected by the end electrode protection layer 18. Thus, it is hard to be peeled off from the nitride semiconductor lamination 20.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了提供在切割晶片时难以将p侧电极从氮化物半导体层压体剥离的氮化物半导体激光元件,以及电流和缺陷的不均匀注入 电流光输出特性难以发生,并提供其制造方法。 解决方案:在基板11上形成的氮化物半导体层叠体20上依次形成绝缘膜15和p侧电极16。 端面电极保护层18形成在p侧电极16的切割面13,14的位置的周边的上部的上部,得到晶片。 因此,通过切割晶片来完善氮化物半导体激光元件10。 在切割时,p侧电极16被端电极保护层18保护。因此,难以从氮化物半导体层压体20剥离。版权所有(C)2007,JPO&INPIT