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1. 发明授权

US5077084A Process for producing a flexible printed base 失效
标题翻译：生产柔性印刷基底的方法
公开(公告)号：US5077084A
公开(公告)日：1991-12-31
申请号：US473461
申请日：1990-02-01
申请人： Shiro Konotsune , Atsushi Takahashi , Shouichi Fukunaga , Kazutsune Kikuta
发明人： Shiro Konotsune , Atsushi Takahashi , Shouichi Fukunaga , Kazutsune Kikuta
IPC分类号： B32B15/08 , B05D3/02 , B05D3/04 , B32B15/088 , H05K1/03 , H05K3/02
CPC分类号： B05D3/0254 , B05D3/0486 , H05K1/0346 , H05K3/022 , B05D2505/50 , Y10S29/042
摘要： In a process for producing a flexible printed base by directly coating a copper foil with a polyimide precursor, followed by heating, drying and curing, a process affording a flexible printed base having a superior folding endurance and a good heat resistance at a cheap cost is provided, which process comprises carrying out the curing in an inert gas under a tension of 0.02 to 0.2 Kg/cm and at 200.degree. and 450.degree. C.

2. 发明授权

US5300364A Metal-clad laminates and method for producing same 失效
标题翻译：金属覆层压板及其制造方法
公开(公告)号：US5300364A
公开(公告)日：1994-04-05
申请号：US849416
申请日：1992-04-29
申请人： Hiroaki Hase , Kazutsune Kikuta , Atsushi Takahashi , Shiro Konotsune
发明人： Hiroaki Hase , Kazutsune Kikuta , Atsushi Takahashi , Shiro Konotsune
IPC分类号： B32B15/08 , H05K1/00 , H05K1/03 , H05K3/00 , H05K3/30 , H05K3/38
CPC分类号： H05K1/0346 , B32B15/08 , H05K1/036 , H05K1/0393 , H05K2201/0154 , H05K2201/0358 , H05K2201/068 , Y10T428/24917 , Y10T428/31678 , Y10T428/31681
摘要： The present invention provides a flexible metal-clad laminate obtained by directly applying a polyimide precursor to a metallic conductive foil, and then drying, heating and curing the precursor to form a polyimide film, this flexible metal-clad laminate being characterized in that the polyimide film is composed of two or more polyimide layers, the linear thermal expansion coefficient of at least one of the second and later polyimide layers is larger than that of the first layer brought into contact with the metallic conductive foil, and the requirements of the following formulae are met:3.0 t.sub.n and ##EQU1## wherein t.sub.n is the thickness (.mu.m) of the outermost layer (the nth layer) of the polyimide layers, t.sub.n-1 is the thickness (.mu.m) of the film comprising the first layer to the (n-1)th layer of the polyimide layers, and Q.sub.n-1 is a double value (cm) of the curvature radius of the curl of the film comprising the first layer to the (n-1)th layer of the polyimide layers and Rz is the average surface roughness (.mu.m) of the metallic conductive foil. This board does not curl immediately after curing, and the curl does not occur even after the formation of a circuit by etching.
摘要翻译： PCT No.PCT / JP91 / 01176 Sec。一九九二年四月二十九日 102（e）日期1992年4月29日PCT 1991年9月3日PCT PCT。出版物WO92 / 0481100 本发明提供了一种柔性金属包覆层压板，其通过将聚酰亚胺前体直接施加到金属导电箔上，然后干燥，加热和固化前体以形成聚酰亚胺膜，该柔性金属包层其特征在于，所述聚酰亚胺膜由两层以上的聚酰亚胺层构成，所述第二层和后述的聚酰亚胺层中的至少一层的线性热膨胀系数大于与所述金属导电箔接触的所述第一层的线性热膨胀系数，满足以下公式的要求：3.0 tn和tn-1> tn和（*化学结构*）其中tn是（（my）m）聚酰亚胺层的最外层（第n层）tn-1是包含第一层至第（n-1）层聚酰亚胺层的膜的厚度（（my）m），Qn-1 是包括第一个1a的膜的卷曲的曲率半径的双重值（cm）对于第（n-1）层的聚酰亚胺层，Rz是金属导电箔的平均表面粗糙度（（my）m）。该板在固化后不会立即卷曲，即使在通过蚀刻形成电路之后也不会发生卷曲。

3. 发明授权

US5254361A Method for producing printed circuit boards 失效
标题翻译：印刷电路板的制造方法
公开(公告)号：US5254361A
公开(公告)日：1993-10-19
申请号：US826773
申请日：1992-02-13
申请人： Takao Kawamoto , Hitoshi Yano , Kazutsune Kikuta , Shiro Konotsune
发明人： Takao Kawamoto , Hitoshi Yano , Kazutsune Kikuta , Shiro Konotsune
IPC分类号： C08L79/08 , C09D11/10 , H05K1/00 , H05K3/28 , B05D5/12
CPC分类号： H05K3/285 , C08L79/08 , C09D11/102 , H05K1/0393
摘要： A method for producing circuit boards with a film having improved printing properties, adhesion, flexibility and heat resistance which comprises applying a liquid printing ink composition comprising an admixture of a solvent, a polyamide-acid and a partially imidized polyamide-acid, then heat to effect drying and curing.
摘要翻译：一种制备具有改进的印刷性能，粘合性，柔韧性和耐热性的薄膜的电路板的方法，其包括将包含溶剂，聚酰胺 - 酸和部分酰亚胺化的聚酰胺 - 酸的混合物的液体印刷油墨组合物加热至效果干燥和固化。

4. 发明授权

US4981940A Polyamide having a low elastic modulus and a process for producing the same 失效
标题翻译：具有低弹性模量的聚酰胺及其制造方法
公开(公告)号：US4981940A
公开(公告)日：1991-01-01
申请号：US432434
申请日：1989-11-06
申请人： Shiro Konotsune , Takao Kawamoto , Kazutsune Kikuta
发明人： Shiro Konotsune , Takao Kawamoto , Kazutsune Kikuta
IPC分类号： C08G73/10 , C08G77/455
CPC分类号： C08G73/1042 , C08G73/106 , C08G77/455
摘要： A polyimide having a low elastic modulus and also superior heat resistance and mechanical characteristics and soluble in solvents and a process for producing the same are provided,which polyimide comprises as main components, 60 to 99% by mol of repetition units of the formula (I) and 1 to 40% by mol of repetition units of the formula (II) ##STR1## wherein Ar is a tetravalent aromatic group; X and Y are at least one group bonded to phenyl group at o-position relative to N atom and selected from 1-4C alkyl, CO group or OH group; R.sup.1 is a 3-5C divalent alkyl or phenylene; R.sup.2 is 4 or less C alkyl or phenyl; l and m are each 1 to 4; and n is 20 to 300, andwhich polyimide is produced by reacting diamino compounds consisting of 60 to 99% by mol of an aromatic diamine of the formula (V) and 1 to 40% by mol of a silicone diamine of the formula (VI), with an aromatic tetracarboxylic acid dianhydride of the formula (IV) in an organic polar solvent at 20.degree.-250.degree. C., ##STR2## wherein Ar, X, Y, R.sup.1, l, m and n are each as defined above.

5. 发明授权

US5192619A Flexible copper-applied substrates 失效
标题翻译：柔性铜基材
公开(公告)号：US5192619A
公开(公告)日：1993-03-09
申请号：US787624
申请日：1991-11-04
申请人： Shiro Konotsune , Kazutsune Kikuta , Masaya Uetsuki , Hiroaki Hase
发明人： Shiro Konotsune , Kazutsune Kikuta , Masaya Uetsuki , Hiroaki Hase
IPC分类号： H05K1/03 , H05K3/02
CPC分类号： H05K1/0346 , H05K3/022 , Y10S428/901 , Y10T428/31681 , Y10T428/31721
摘要： A flexible copper-applied substrate comprises a copper foil and a resin layer comprising a composite material of a polyimide and a polyimide silicone, the resin layer being directly formed on the surface of the copper foil, said substrate being producible by applying a polyamide acid composite composed of a mixed solution of a polyamide acid and a polyamide acid alkylsilane to a copper foil and heating.
摘要翻译：柔性铜涂布基板包括铜箔和包含聚酰亚胺和聚酰亚胺硅氧烷的复合材料的树脂层，所述树脂层直接形成在铜箔的表面上，所述基材可通过将聚酰胺酸复合物由聚酰胺酸和聚酰胺酸烷基硅烷的混合溶液组成到铜箔上并加热。

6. 发明授权

US5112694A Flexible printed-circuit base board and process for producing the same 失效
标题翻译：柔性印刷电路板及其制造方法
公开(公告)号：US5112694A
公开(公告)日：1992-05-12
申请号：US556408
申请日：1990-07-24
申请人： Shiro Konotsune , Hitoshi Yano , Souichiro Hiraki , Kazutsune Kikuta
发明人： Shiro Konotsune , Hitoshi Yano , Souichiro Hiraki , Kazutsune Kikuta
IPC分类号： B32B15/088 , C08G73/10 , H01B3/30 , H05K1/03
CPC分类号： C08G73/1067 , C08G73/1042 , C08G73/106 , H01B3/306 , H05K1/0346 , Y10S428/901 , Y10T428/31663 , Y10T428/31678
摘要： A flexible double-sided copper-clad printed-circuit base board is provided with a core resin layer of a composite material essentially composed of a specific rigid-structured polyimide and a specific flexible-structured crosslinked polyimide silicone in a state of being inseparable from each other, wherein the core resin layer is formed directly between two copper foils. This base board is produced by coating a surface of a copper foil with a polyamic acid solution mixture of a specific polyamic acid and a specific polyamic acid - alkylsilane, heat-treating the resulting coated copper foil, and contact-bonding another copper foil to the resulting copper-foil/polyimide laminate.

7. 发明授权

US4923968A Melt-moldable crystalline polyimide polymer 失效
标题翻译：熔融成型的结晶聚酰亚胺聚合物
公开(公告)号：US4923968A
公开(公告)日：1990-05-08
申请号：US217302
申请日：1988-07-11
申请人： Kouichi Kunimune , Kazutsune Kikuta , Takao Kawamoto , Shiro Konotsune
发明人： Kouichi Kunimune , Kazutsune Kikuta , Takao Kawamoto , Shiro Konotsune
IPC分类号： C08G73/10
CPC分类号： C08G73/1064 , C08G73/1042 , C08G73/1071
摘要： A crystalline polyimide polymer having a practical effectiveness that extrusion or injection molding which has so far been applied to thermoplastic resins, but could not have been achieved by conventional polyimides, are possible due to its melting point in the range of 300.degree. C. to 450.degree. C., and a process for producing the polymer, are provided, which polyimide polymer contains the following imide repetition unit (I) in 30% by mol based on the polymer and containing or not containing at least one of other imide repetition units and also having an inherent viscosity of 0.1 to 5 dl/g in conc. sulfuric acid at 30.+-.0.01.degree. C.: ##STR1## wherein X is divalent CO, divalent SO.sub.2 group, S, O or a single bond.

8. 发明授权

US4103078A Method for producing polymers of alpha-olefin 失效
标题翻译： α-烯烃聚合物的制备方法
公开(公告)号：US4103078A
公开(公告)日：1978-07-25
申请号：US340854
申请日：1973-03-13
申请人： Akihiro Sato , Shiro Konotsune , Atsuyuki Kachi , Hiroshi Shimizu
发明人： Akihiro Sato , Shiro Konotsune , Atsuyuki Kachi , Hiroshi Shimizu
IPC分类号： C08F4/02 , C08F10/00
CPC分类号： C08F10/00 , C08F4/025 , C08F2410/04
摘要： Polymers of .alpha.-olefin such as polyethylene, polypropylene, copolymers of ethylene with propylene, butene-1 or styrene, are produced by the (co-) polymerization using a catalyst obtained by mill-mixing an oxide of a metal belonging to I, II, III, VII or VIII Group of the Periodic Table of Elements such as MgO or SiO.sub.2 or B.sub.2 O.sub.3, with a trivalent metal halide such as AlCl.sub.3, then reacting the resultant mixture with a transition metal compound such as TiCl.sub.4 in the presence of an aromatic compound such as xylene, and activating the resultant solid reaction product with an organoaluminum compound such as triethyl aluminum.In the preparation of the present catalyst, no dehydrochlorination occurs. The present catalyst has an excellent utilization efficiency of transition metal compound in the polymerization. Further, no polymer film forms on the wall surface of the polymerization vessel.
摘要翻译：通过（共）聚合，使用通过将属于I，II的金属的氧化物混合而获得的催化剂制备α-烯烃如聚乙烯，聚丙烯，乙烯与丙烯的共聚物，丁烯-1或苯乙烯的聚合物，III，VII或VIII族元素如MgO或SiO 2或B 2 O 3与三价金属卤化物如AlCl 3组合，然后使所得混合物与诸如TiCl 4的过渡金属化合物在芳族化合物的存在下反应例如二甲苯，并用有机铝化合物如三乙基铝活化所得的固体反应产物。

9. 发明授权

US4818806A Process for producing highly adherent silicon-containing polyamic acid and corsslinked silicon-containing polyimide 失效
标题翻译：用于生产高粘附性含硅聚酰胺酸和连接的含硅聚酰亚胺的方法
公开(公告)号：US4818806A
公开(公告)日：1989-04-04
申请号：US93143
申请日：1987-09-02
申请人： Kouichi Kunimune , Yoshiya Kutsuzawa , Hiromi Egawa , Shiro Konotsune
发明人： Kouichi Kunimune , Yoshiya Kutsuzawa , Hiromi Egawa , Shiro Konotsune
IPC分类号： C08G73/00 , C08G73/10 , C08G77/455 , C08G77/04
CPC分类号： C08G73/1085 , C08G73/106 , C08G77/455
摘要： A process for producing a silicon-containing polyamic acid of a specified inherent viscosity as a precursor affording polyimide resins having a considerable extent of heat resistance as adhesives or resins for multilayer laminated composite materials, and a good adhesion onto inorganic materials, metals or resins, and a crosslinked silicon-containing polyimide resin prepared from the polyamic acid are provided, which process comprises reacting a tetracarboxylic acid dianhydride of formula (1) (A mols), a diamine of formula (2) (B mols) and an aminosilicon compound of formula (3) (C mols), satisfying the expressions of (4) and (5): ##STR1## wherein R.sup.1 is a tetravalent carboxylic aromatic group; R.sup.2 is an aliphatic, alicyclic, aromatic aliphatic or carboyclic aromatic group each of a specified number of carbon atoms, a specified polysiloxane group, or a formula of ##STR2## wherein R.sup.8 is a specified hydrocarbon group or hydrogen atom; ##STR3## (s: 1 to 4); R.sup.4 is alkyl, phenyl or alkyl-substituted phenyl each of a specified number of carbon atoms; X is alkoxy, acetoxy or halogen; and 1.ltoreq.k.ltoreq.3, and which polyimide resin is produced by baking a solution containing the above polyamic acid at 50.degree. to 450.degree. C.
摘要翻译：制备具有特定的特性粘度的含硅聚酰胺酸作为前体的方法，其提供具有相当程度耐热性的聚酰亚胺树脂作为多层层压复合材料的粘合剂或树脂，以及对无机材料，金属或树脂的良好粘附性，和由聚酰胺酸制备的交联的含硅聚酰亚胺树脂，该方法包括使式（1）的四羧酸二酐（A摩尔），式（2）的二胺（B摩尔）和氨基硅化合物（3）（3）（3）（3）（3）（3）（3）（3）（IMA））其中R1是四价羧酸芳族基团; R2是指定数量的碳原子的脂肪族，脂环族，芳香族脂肪族或碳环芳香族基团，特定的聚硅氧烷基团，或者其中R8是特定的烃基或氢原子的式 + TR （s：1至4）; R4是烷基，苯基或烷基取代的苯基，各自具有特定数目的碳原子; X是烷氧基，乙酰氧基或卤素; 和1

10. 发明授权

US4609700A Soluble imide oligomer and a method for producing the same 失效
标题翻译：可溶性酰亚胺低聚物及其制造方法
公开(公告)号：US4609700A
公开(公告)日：1986-09-02
申请号：US732726
申请日：1985-06-19
申请人： Kouichi Kunimune , Shiro Konotsune
发明人： Kouichi Kunimune , Shiro Konotsune
IPC分类号： C07F7/18 , C08G73/10 , H01B3/30 , C08K5/34
CPC分类号： C08G73/106 , C07F7/182 , H01B3/306
摘要： A soluble imide oligomer represented by the general formula ##STR1## (Definitions of R, R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7 and R.sup.8 are found in the specification.) and its preparation process are presented. A coating solution for electronic materials containing said soluble imide oligomer is also presented.
摘要翻译：通式（Ⅰ）表示的可溶性酰亚胺低聚物（R，R 1，R 2，R 3，R 4，R 5，R 6，R 7和R 8的定义见本说明书），其制备方法为呈现。还提供了含有所述可溶性酰亚胺低聚物的电子材料的涂布溶液。

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